Custom Electronics EMI Shielding & Grounding Gaskets
H-O Products die-cuts and converts conductive fabric-over-foam, conductive elastomer (MIL-DTL-83528 grades), conductive foil tape, and ground-contact pads and strips into the shielding and grounding parts that keep board-level shields, device housings, and IoT enclosures below their FCC Part 15 and CISPR 32 emissions limits, built to your drawing.
Built for: board-level shield (BLS) perimeter gaskets and clip contacts, plastic-housing and display-bezel split-line gaskets, PCB-to-chassis ground-contact pads and strips, connector-aperture gaskets, foil-tape seam bridges, and the antenna-coexistence shield cans that keep a radio's noise floor clear in IoT devices.
To shield and ground an electronics device, pick the form factor first, then match the galvanic chemistry to the housing. Light plastic housings and long serviceable seams: conductive silicone sponge or fabric-over-foam — softest closure force, roughly 70–100 dB SE across low MHz into the GHz range per the maker TDS. Metal housings and board-level-shield perimeters needing the highest, most repeatable SE: a MIL-DTL-83528 conductive elastomer — choose the Type by galvanic match (nickel-graphite, Type M and nickel-aluminum are aluminum-tolerant.
The remaining zones and duties are mapped in the When-to-spec list on this page. Values are per the TDS on file; see the material reference below for ordering details.
Emissions limits, by designation (the compliance result belongs to the tested device): FCC Part 15 Subpart B (US unintentional radiators, Class A / Class B) · CISPR 32 / EN 55032 (multimedia equipment emissions; radiated Class B 40 dBµV/m at 30–230 MHz and 47 dBµV/m at 230–1000 MHz at 3 m) · CISPR 11 (industrial / ISM equipment).
Method & material-level, per the maker TDS: IEEE Std 299 (enclosure SE method) · MIL-DTL-83528 (conductive elastomer types, volume resistivity, SE coupon method) · ASTM D991 (volume resistivity of conductive rubber) · ASTM B117 (salt-spray corrosion) · UL 94 (flammability classes incl. V-0 on rated grades) · ASTM D395 / D1056 (compression set on cellular grades).
- Light plastic lid / long seam: conductive silicone sponge / fabric-over-foam
- Highest, most repeatable SE: MIL-DTL-83528 conductive elastomer
- Aluminum housing: Ni/graphite Type M or nickel-aluminum
- Flame-rated location: Ni/graphite UL 94 V-0
- Fuel / solvent exposure: conductive fluorosilicone
- High-conductivity solid: EC-2265 solid conductive silicone
- Seam bridge / cable-shield term: Cu / Al conductive foil tape
- Dielectric barrier under a pad: Kapton® HN / Nomex® 410
This guide is for hardware, RF, and EMC engineers — and the sourcing buyers who support them — specifying board-level and device-level EMI shielding and grounding parts for consumer, industrial, and IoT electronics: board-level shield gaskets and clip contacts, housing and bezel split-line gaskets, PCB-to-chassis ground-contact pads and strips, connector-aperture gaskets, and foil-tape seam bridges, all and converted made-to-order to your drawing.
Where are you in the spec process?
This page serves engineers who already know the shielding part they want and engineers still choosing between form factors. Pick the path that matches where you are; you don't have to read the rest.
Send a drawing, get a quote
A fabric-over-foam gasket, a MIL-DTL-83528 conductive-elastomer grade, a conductive-foil-tape width, a ground-contact pad or strip, or a complete shielding kit on your drawing.
Skip to the quote form →Choose the form factor and the galvanic match
Six selection factors (form factor, galvanic compatibility, closure force, SE qualifier, grounding path, environment), a form-factor checklist builder, and the material families with TDS-cited methods and by-designation standards language.
Start with selection factors →
-
1Send drawingUpload a DXF, STEP, or PDF, or describe the housing, board-level shield, or seam. A sample part works too.
-
2Material reviewEngineering reviews the form factor, closure force, galvanic pairing, and target frequency band against the maker TDSs, and frames the standards language correctly: material classes (UL 94, volume resistivity) by TDS; emissions limits (FCC Part 15, CISPR 32) by designation, with the compliance result belonging to the tested device.
-
3PrototypeSamples typically ship in 3–5 business days for common configurations on materials we keep on hand. Made-to-order; MOQ varies by material and part.
-
4ProductionStandard production runs ship about 2 weeks after drawing approval, on flatbed die-cutting, slitting for foil tape and roll stock, and kitting for device-level shielding kits. Ongoing parts run with material traceability and lot-code TDS records.
Emissions / SE requirement → form-factor + galvanic selection → converted gasket, pad, strip, or tape → production supply.
- 1Seam / aperture requirementMap the leaking seams, apertures, and grounding points on the housing and boards.
- 2Choose form factorFabric-over-foam, conductive elastomer, foil tape, or ground-contact pad / strip.
- 3Match galvanic + closure forceFiller / plating to housing metal; gasket compression to the force the housing supplies.
- 4Add PSA / liner / dielectricPSA backing, pull tabs, and any Kapton® / Nomex® dielectric layer under a ground pad.
- 5Die-cut to drawingDie-cut, kiss-cut, slit, or kit the gasket, pad, strip, washer, or tape to the geometry.
- 6Quote prototype or productionPrototype quantities through full production runs, with TDS records and lot traceability.
Which shielding problem are you solving?
Application Zones
Six shielding problems define the board and device level: the board-level shield (BLS) perimeter and the housing split line, where a gasket or clip has to bond a seam continuously; the connector and I/O aperture, where an opening radiates as a slot if it is left unbridged; the PCB-to-chassis ground path, where the "ground" is only as good as its impedance at RF; the foil-tape seam bridge and cable-shield termination; the antenna-coexistence shield that keeps a radio's noise floor clear; and the environmental / galvanic edge cases that decide filler chemistry.
Click a tab to see the part, the controlling property, and the families H-O converts for that zone.
Board-level shield & housing seams: the continuous-bond problem
A board-level shield (BLS) is a small Faraday can: a frame soldered to a perimeter ground pad plus a removable cover, or a one-piece stamped can. The instant the cover is reseated, its seam becomes a row of intermittent contacts, and every unbridged gap radiates once its longest dimension nears a half wavelength (λ/2). The gasket or clip contact's job is to make that seam behave as one continuous bond, keeping contact pitch well below λ/20.
On device housings, the same job appears at the split line and display bezel of a die-cast or conductively-coated plastic enclosure. Low-closure-force joints (light plastic lids, long serviceable seams) take conductive silicone sponge or fabric-over-foam; joints that can supply real closure force and need the highest, most repeatable SE take a MIL-DTL-83528 conductive elastomer, with the Type chosen by galvanic match.
Frame the seam geometry, the gap, and the closure force available; the gasket construction and its compression class do the rest.
Conductive Fabric-Over-Foam & Conductive Elastomer (MIL-DTL-83528)BLS perimeter and split-line gaskets: fabric-over-foam for soft closure (~70–100 dB SE per TDS), conductive elastomer for the highest repeatable SE; volume resistivity per ASTM D991. [2]
BISCO® EC-2130 Conductive Silicone SpongeSoft, low-closure-force conductive sponge for light plastic lids and long serviceable seams; conforms to irregular flanges without bowing the cover.
SSP502 Nickel-Graphite Conductive Silicone (Type M)The aluminum-tolerant workhorse conductive elastomer for perimeter gaskets and clip contacts; corrosion-tolerant filler chemistry on aluminum housings. [2]
SSP502 Flame-Retardant (UL 94 V-0)Where the location carries a flame-class requirement: nickel-graphite conductive silicone with a UL 94 V-0 class on its grade TDS. [8]
Connector & I/O apertures: don't let an opening become an antenna
Every unbridged opening in a shielded volume — a connector cut-out, an unused I/O port, a display window, a vent — behaves as a slot antenna once its longest dimension approaches a half wavelength. The metal can be perfect and the device still fails its scan because one aperture is radiating. The fix is to frame the opening with a conductive gasket that maintains continuous contact around its perimeter, or to bridge a seam with conductive foil tape.
This is a geometry problem before it is a material problem: keep the gasket / fastener contact pitch below λ/20 so the boundary reads as one continuous bond, not a picket fence of slots. H-O the aperture-frame gaskets and slits the foil tape to the opening geometry off the drawing, with sealed, accurate edges that remove the field-trimming that starts most aperture leaks.
Aperture-Frame Conductive GasketsDie-cut conductive elastomer or fabric-over-foam gaskets framing connector and I/O cut-outs so the opening keeps a continuous conductive perimeter.
Conductive Foil Tape (Cu / Al)Slit-to-width copper or aluminum foil tape with conductive adhesive to bridge a seam or patch an aperture; through-tape contact quality is the variable.
BISCO® EC-2265 High-Conductivity SolidSolid conductive silicone where an aperture frame needs a firm, high-conductivity section rather than a compliant sponge.
PCB-to-chassis grounding: the path, not just the pad
A shield can grounded through one long PCB trace is not grounded at RF: the trace is inductive, and the "ground" reference rises with frequency until the can radiates instead of shielding. The board-level fix is a continuous perimeter ground pad (roughly 0.5–1.0 mm wide) around the shield footprint with via stitching (roughly every 1.5–2 mm) tying it to the internal ground plane, and a short, wide bond from the board to the chassis.
The converted part in that path is a ground-contact pad — conductive elastomer or fabric-over-foam — or a foil / fingerstock-style strip that makes the PCB-to-chassis bond. Where the pad must sit next to live traces, a Kapton® or Nomex® dielectric window keeps it from shorting. Send the contact geometry, the gap to the chassis, and whether a dielectric isolation layer is needed.
Die-Cut Conductive-Elastomer Ground-Contact PadsPCB-to-chassis and shield-can-to-chassis bond pads; and kiss-cut on liner to the contact footprint, volume resistivity per ASTM D991. [6]
Conductive Foil / Fingerstock-Style StripsFoil-tape strips and converted contact strips for a short, wide chassis bond where a compliant pad is not the right form.
Kapton® HN Dielectric WindowDie-cut polyimide isolation so a ground-contact pad bonds where it should and does not short adjacent traces; dielectric methods per the maker TDS. [10]
Nomex® 410 Aramid-Paper BarrierConformable, thermally-tough dielectric spacer where a paper barrier suits the joint better than a film.Foil-tape seam bridges & cable-shield terminations
Not every seam gets a gasket. Where a panel joint, a shield-can lid, or a cable-shield termination needs a conductive bridge rather than a compressible gasket, conductive foil tape is the part: copper or aluminum foil with a conductive adhesive, slit to width and to length. It bridges the seam, ties a cable braid to the chassis, or patches an aperture on a prototype before the tooled gasket exists.
The variable is the through-tape contact: the conductive adhesive and the bonded interface, not the foil, set the DC resistance across the joint, so surface prep and dwell matter. H-O slits the tape to width and it to the seam or termination geometry, and applies it as part of a converted assembly where the drawing calls for it.
Copper / Aluminum Conductive Foil TapeSeam-bridging and cable-shield-termination tape, slit to width; through-tape DC resistance depends on the conductive adhesive and the bonded interface.
Companion Conductive GasketWhere a taped seam needs a compressible companion for a mating cover, a conductive gasket takes the reseated joint.Tape and adhesive selection is validated against the substrate, its surface energy, the temperature and exposure the joint sees, the dwell and pressure at application, the surface prep, and the part geometry and assembly method; send those with the drawing and H-O frames the tape and adhesive to them.
Antenna coexistence in IoT devices: keep the noise floor clear
An IoT device carries a radio (BLE, Wi-Fi, cellular, GNSS) inches from a switching regulator and high-speed digital logic. Left unshielded, that broadband hash raises the radio's noise floor and quietly eats the link budget: range drops, the antenna "desenses," and no amount of antenna tuning gets it back. The board-level shield can over the aggressor section is the fix — a small Faraday cage that keeps the SMPS and digital emissions off the antenna's band.
The shielding job here is the same continuous-bond problem as zone 1, applied to protect a receiver rather than to pass an emissions scan, and the grounding path (zone 3) is what makes the can actually shield. H-O converts the gasket, clip, and ground-pad parts of that can to drawing.
Shield-Can Perimeter Gasket / Clip ContactThe continuous-bond gasket or clip that closes the aggressor-section can so its emissions stay inside; form chosen by closure force.
Conductive-Elastomer Ground Contact to ChassisThe short, low-impedance bond that turns the can from a floating box into a grounded shield; volume resistivity per ASTM D991.Environment & galvanic: the edge cases that decide filler chemistry
Most board-level shielding lives indoors, but the exceptions drive the material choice. An outdoor or industrial IoT gateway on an aluminum housing must not pair a silver-copper filler with bare aluminum — the classic galvanic failure — so the aluminum-tolerant nickel-graphite (Type M) and nickel-aluminum chemistries carry that duty, verified by salt-spray per ASTM B117. A device exposed to fuel or solvent takes conductive fluorosilicone.
A location with a flame-class requirement takes the UL 94 V-0 nickel-graphite grade. And where the shield also has to keep water and dust out, a non-conductive companion silicone-sponge seal handles the environmental side alongside the conductive gasket. Name the housing metal and finish, the environment, and any flame or chemical requirement; those pick the chemistry before conductivity does.
SSP502 Corrosion-Resistant (Nickel-Aluminum class)The outdoor / aluminum-housing conductive elastomer; salt-spray endurance per ASTM B117 on the grade TDS. [7]
SSP502 Fluorosilicone BaseConductive fluorosilicone for fuel- and solvent-exposed devices where standard silicone chemistry swells.
SSP502 Flame-Retardant (UL 94 V-0)Nickel-graphite conductive silicone with a UL 94 V-0 class per its grade TDS for flame-rated locations. [8]
BISCO® Silicone Sponge (non-conductive companion seal)The environmental seal that keeps water and dust out alongside the conductive gasket; compression class per ASTM D1056. [9]Six decisions that drive your shielding & grounding spec
A shielded device is a set of seams, apertures, and ground points, and each has one controlling property. Miss one and the failure is rarely obvious at the bench: SE holds on the coupon, then the assembled device fails its scan because one aperture radiates, one gasket relaxed, or one "ground" was inductive.
Materials carry properties; the device carries the compliance result. Volume resistivity, a UL 94 class, and a salt-spray rating belong to a material grade per its TDS. Shielding effectiveness (SE) and FCC Part 15 / CISPR 32 compliance belong to the tested device at a stated method and frequency. Write material properties on the part callouts, cite emissions limits by designation, and never let a drawing imply a gasket "provides 100 dB SE" — the gasket supports a design evaluated to it.
An unbridged opening radiates as a slot near a half wavelength (λ/2), so the design rule is to keep every gasket, clip, and fastener contact pitch below one twentieth of a wavelength at the highest frequency of concern. Below that pitch the seam reads as a continuous bond; above it, as a row of slots. The gasket is the material that makes the pitch real — the compliance result belongs to the tested device.
Read the six factors below in order. The first two pick the part and protect it from corrosion (form factor, galvanic match); the next two make it close and make it honest (closure force, SE qualifier); the last two carry the ground and survive the environment. Every factor names its method, because in EMC work the documentation is part of the part.
Six factors, each with the property that governs it. Expand to read them all.
Show all 6 selection factors tap to expand
Form factor: pick the part before the grade
Four form factors carry board- and device-level shielding, and the choice is set by the joint, not the dB number. Conductive fabric-over-foam and conductive silicone sponge for low-closure-force seams and light plastic lids; a MIL-DTL-83528 conductive elastomer where the joint can supply real closure force and needs the highest, most repeatable SE; conductive foil tape for seam bridges and cable-shield terminations; and a ground-contact pad or strip for the PCB-to-chassis bond.
Decide the form factor from the joint geometry and the closure force first; the specific grade falls out of the galvanic and environmental factors below. [2]
Galvanic compatibility: match the filler to the housing metal
A conductive gasket forms a galvanic couple with its housing, and a mismatched pairing corrodes in humidity and salt-fog until contact resistance climbs and SE degrades over service life. The classic failure is a silver-copper filler on bare aluminum.
Match the chemistry to the metal before optimizing resistivity: nickel-graphite (Type M) and nickel-aluminum are the aluminum-tolerant choices; silver-copper (Type A) is highest-conductivity but belongs on tin, copper, brass, and stainless. Name the housing metal and finish, and verify the pairing by salt-spray per ASTM B117. [7]
Closure force: spec the gasket to the force the housing supplies
A gasket is a spring, and a device that cannot supply the compression force a rigid elastomer needs will hold it only intermittently — the lid bows, the contact chatters, and SE is worse than a softer choice would give. Thin plastic housings, snap-fit lids, and long serviceable seams want the low-closure-force families (fabric-over-foam, conductive silicone sponge). Metal housings and bolted board-level shields can take a firmer conductive elastomer and get its higher, more repeatable SE.
State the real closure force and the gap, and let those pick between the soft and firm tracks before conductivity does.
The SE qualifier: keep the claim on the device, not the coupon
Shielding effectiveness is a property of the tested enclosure at a stated frequency and method — not of the material coupon. A drawing note that says a gasket "provides 100 dB SE" invites a review stall, because the coupon number (per the MIL-DTL-83528 method, or an enclosure method such as IEEE Std 299) is a comparison figure, and the device's real SE depends on every aperture and seam around it.
Cite the material's coupon SE and volume resistivity per TDS, and cite the emissions limit (FCC Part 15, CISPR 32) by designation; the compliance result is the tested device's. [3]
The grounding path: a pad is only as good as its impedance
A shield grounded through a long PCB trace is not grounded at RF: the trace is inductive and the reference rises with frequency. The converted ground-contact pad or strip is one link in a path that also needs a continuous perimeter ground pad (roughly 0.5–1.0 mm) and via stitching (roughly every 1.5–2 mm) under the shield, plus a short, wide bond to the chassis.
Where the pad sits next to live traces, a Kapton® or Nomex® dielectric window keeps it from shorting. Send the contact geometry, the gap to the chassis, and whether isolation is needed; the pad and its dielectric come off the drawing. [6]
Environment: flame, fuel, and outdoor pick the chemistry
Most board-level shielding is indoor, but the exceptions decide the grade.
A flame-class location takes the UL 94 V-0 nickel-graphite grade; a fuel- or solvent-exposed device takes conductive fluorosilicone; an outdoor or industrial gateway takes the corrosion-resistant nickel-aluminum grade, salt-spray-verified per ASTM B117; and where the shield also seals against water and dust, a non-conductive companion silicone-sponge seal handles the environmental side. Name the flame, chemical, and outdoor requirements; they narrow the chemistry before conductivity and cost do. [8]
Specification Tools
Three tools to take you from "we have an EMI-shielding problem" to here's the shielding-and-grounding checklist for the drawing set: a form-factor checklist builder that assembles the part list with its citations, a side-by-side comparison of every family on this page, and a galvanic look-up for filler chemistry vs. housing metal.
1. EMI shielding & grounding form-factor checklist builder
Check the shielding jobs your device carries. The builder assembles the corresponding form factors into a checklist with the family, what to send with the drawing, and the citation language (material properties per TDS; SE and emissions limits by designation, the compliance result with the tested device). The default selection is pre-built for a typical shielded IoT device; every part is also printed in the material reference section, so nothing here exists only behind a script.
Shielding checklist: 3 parts selected
Each checked job adds its form factor below. The list is the starting bill of materials for the engineering review, not a compliance claim: material properties (volume resistivity, UL 94) come from the grade TDS, and SE and emissions limits (FCC Part 15 / CISPR 32) are cited by designation with the result belonging to the tested device.
- Seam gasket: conductive elastomer (MIL-DTL-83528) or fabric-over-foamSend: seam geometry, gap, closure force, target band, housing metal. Cite: ASTM D991 resistivity; SE per TDS coupon method.
- Soft seam: BISCO® EC-2130 conductive silicone sponge / fabric-over-foamSend: closure force available, gap, seam length. Cite: low-closure-force family; SE per the maker TDS.
- Grounding: die-cut conductive-elastomer ground-contact pad / stripSend: contact footprint, gap to chassis, isolation plan. Cite: ASTM D991 resistivity; grounding-path design guidance.
2. Side-by-side: shielding & grounding family comparison matrix
Every family called out on this page, with construction, the property that drives its selection, the standards its TDS cites, and the zone it serves. Click a column header to sort. Click any material name to jump to its accordion entry.
| Material | Construction | Selection property | Standards on the TDS / by designation | Zone | |
|---|---|---|---|---|---|
| Soft / low-closure-force shielding | |||||
| BISCO® EC-2130 Conductive Silicone SpongeNi-graphite-filled silicone sponge | Conductive silicone sponge | Low closure force | Rogers TDS; UL 94 (per grade) | Light plastic lids | |
| Conductive Fabric-Over-Foam (Ni/Cu, Sn/Cu)Conductive fabric over PU/PET foam core | Fabric-over-foam | SE ~70–100 dB per TDS | MIL-DTL-83528 coupon; ASTM D991 | BLS & housing seams | |
| Conductive elastomer (MIL-DTL-83528 grades) | |||||
| SSP502 Nickel-Graphite Silicone (Type M)Aluminum-tolerant workhorse conductive elastomer | Ni/graphite silicone | Galvanic match on aluminum | MIL-DTL-83528 Type M; ASTM D991 | Metal housings, aluminum | |
| SSP502 Flame-Retardant (UL 94 V-0)Ni/graphite conductive silicone, fire-rated | Ni/graphite silicone | UL 94 V-0 class | UL 94 V-0 (per TDS); ASTM D991 | Flame-rated locations | |
| SSP502 Fluorosilicone BaseFuel- and solvent-resistant conductive elastomer | Conductive fluorosilicone | Fuel / solvent resistance | MIL-DTL-83528; ASTM D991 | Chemical exposure | |
| SSP502 Corrosion-Resistant (Ni-Aluminum class)Nickel-aluminum for outdoor / salt-fog | Ni/aluminum silicone | Salt-spray endurance | ASTM B117; ASTM D991 | Outdoor / marine | |
| High-conductivity solid & foil | |||||
| BISCO® EC-2265 High-Conductivity SolidFilled solid conductive silicone | Solid conductive silicone | High conductivity, firm section | Rogers TDS; ASTM D991 | Aperture frames, firm bonds | |
| Copper / Aluminum Conductive Foil TapeFoil + conductive adhesive, slit to width | Cu / Al foil tape | Through-tape contact / seam bridge | Maker TDS (foil + adhesive) | Seam bridge, cable term | |
| Ground contact & dielectric isolation | |||||
| Die-Cut Conductive-Elastomer Ground-Contact PadSSP502 / conductive-elastomer contact pad | Die-cut conductive pad | Low-impedance PCB-to-chassis bond | ASTM D991; grounding-path guidance | PCB-to-chassis grounding | |
| Kapton® HN Polyimide FilmPolyimide dielectric window under a pad | Polyimide film | Dielectric isolation | Maker TDS (dielectric methods) | Under ground pads | |
| Nomex® 410 Aramid PaperAramid-paper dielectric spacer | Aramid paper | Conformable dielectric barrier | Maker TDS | Isolation spacers | |
3. Galvanic compatibility: EMI filler vs. device housing metal
Pick your device housing material and the gasket filler chemistry. The verdict comes from the galvanic potential difference and field-service experience from salt-fog testing, per MIL-DTL-83528 filler-chemistry × housing-metal guidance.
Pick a housing and filler to see the compatibility verdict
The result includes the galvanic verdict, the typical salt-fog endurance before measurable SE degradation, and the recommended grade or corrosion-resistant substitute if the primary combination is marginal.
Skip ahead and request your engineering review now
If your drawing set already calls out a fabric-over-foam gasket, a MIL-DTL-83528 grade, a foil-tape width, or a ground-contact pad, send it over for engineering review against the TDSs and the standards language.
Shielding & grounding failures you can prevent at spec
Shielded devices fail quietly first: a seam that reads as a slot, a gasket that relaxed, a filler that corroded on the wrong metal, a "ground" that was inductive, a radio that lost range to its own board. Five patterns cover most of what goes wrong, and each is a specification decision made before the first part is cut.
The coupon passes; the device fails. Shielding effectiveness on a material coupon is a comparison figure; the device's real SE depends on every aperture, seam, and ground point around it. Cite material properties per TDS and the emissions result (FCC Part 15, CISPR 32) by designation, and design the seams and grounds, not just the gasket.
Five patterns, each a spec decision. Expand to read them all.
Show all 5 failure modes tap to expand
1. An aperture nobody gasketed radiated as a slot
The shield metal was intact and the device still failed its scan, because one unbridged opening — a connector cut-out, an unused port, a display window — radiated as a slot antenna once its longest dimension neared a half wavelength. Coupon SE looked fine; the assembled device did not. The fix: treat shielding as a geometry problem first: frame every aperture with a conductive gasket and bridge every seam so the gasket / fastener contact pitch stays below λ/20 at the highest frequency of concern.
Die-cut aperture-frame gaskets and slit foil tape with accurate edges remove the field-trimming that starts most aperture leaks. [3]
2. A silver-copper filler corroded on a bare-aluminum housing
The classic galvanic failure.
A high-conductivity silver-copper gasket was specified for its dB number and mated against a bare-aluminum die-cast housing; in humidity and salt-fog the galvanic couple corroded, contact resistance climbed, and SE degraded over months in the field. The fix: match the filler to the housing metal before optimizing resistivity: nickel-graphite (Type M) and nickel-aluminum are the aluminum-tolerant chemistries; keep silver-copper on tin, copper, brass, and stainless.
Verify the pairing by salt-spray per ASTM B117, and use the galvanic look-up above before committing a drawing note. [7]
3. A gasket relaxed and SE fell below the bond threshold
The device passed at build and failed a field return two years later.
A gasket sized at the edge of its compression range, or a material with high compression set, relaxed over thermal cycles and mate/de-mate events until contact force dropped below the low-impedance-bond threshold; SE fell at the seam and emissions crept back up. The fix: size compression mid-range so recovery is left, prefer low-compression-set materials (conductive silicone sponge holds recovery widest across temperature), and verify recovery to the grade TDS (ASTM D395 / D1056).
Serviceable covers need extra margin for repeated reseating. [9]
4. A stiff gasket on a light plastic lid made SE worse, not better
Someone specified a firm conductive elastomer for its dB number on a snap-fit plastic housing that could not supply the compression force it needed. The lid bowed, contact went intermittent around the perimeter, and the assembled SE came out worse than a soft fabric-over-foam gasket would have delivered. The fix: spec the gasket to the closure force the housing actually supplies.
Light plastic lids and long serviceable seams take the low-closure-force families (conductive silicone sponge, fabric-over-foam); reserve the firm conductive elastomers for metal housings and bolted board-level shields that can compress them. Match the compression class to the real force, not the target dB.
5. A shield can grounded through one long trace still radiated
The can was there, the gasket was right, and the device still emitted, because the shield was grounded through a single long PCB trace. At RF that trace is inductive, the ground reference rises with frequency, and the can radiates instead of shielding. The antenna-coexistence version of the same failure: a radio's noise floor stays high because the aggressor-section can never got a low-impedance chassis bond.
The fix: ground the shield with a continuous perimeter pad (roughly 0.5–1.0 mm) and via stitching (roughly every 1.5–2 mm), and make the board-to-chassis bond short and wide with a conductive-elastomer ground-contact pad or strip. Add a Kapton® or Nomex® dielectric window where the pad sits next to live traces. [6]
Material reference
Detailed specs for the shielding and grounding families referenced on this page: the conductive gaskets (fabric-over-foam and the MIL-DTL-83528 conductive elastomers), the soft and solid conductive silicones (BISCO® EC-2130 sponge, EC-2265 solid), the conductive foil tape, the ground-contact pads, and the dielectric barriers (Kapton® film, Nomex® paper).
Values are per the maker TDS on file for each grade with the method named; shielding effectiveness and emissions limits are cited by designation, with the compliance result belonging to the tested device. H-O die-cuts, kiss-cuts, slits, and kits every family to drawing.
Conductive Elastomer (MIL-DTL-83528) & Fabric-Over-Foam GasketsBLS perimeter & split-line gaskets · MIL-DTL-83528 types · SE per TDS coupon method

SE is a comparison figure on the coupon; the device's real SE and its FCC Part 15 / CISPR 32 compliance belong to the tested equipment. Specify volume resistivity and the coupon method per TDS; cite the emissions limit by designation.
BISCO® EC-2130 Conductive Silicone SpongeLow-closure-force conductive sponge · Ni-graphite filler · light plastic lids

Size compression mid-range so recovery is left after thermal and mate/de-mate cycles; verify recovery to the grade TDS.
BISCO® EC-2265 High-Conductivity Solid SiliconeFirm, high-conductivity solid section · aperture frames & firm bonds

Confirm the UL 94 status and volume resistivity against the current Rogers grade TDS before final spec.
Conductive Foil Tape (Copper / Aluminum)Seam bridging & cable-shield termination · conductive adhesive · slit to width

Tape and adhesive are validated against the substrate, its surface energy, the temperature and exposure the joint sees, the dwell and pressure at application, the surface prep, and the part geometry and assembly method; send those with the drawing.
Die-Cut Conductive-Elastomer Ground-Contact Pads & StripsPCB-to-chassis and shield-can-to-chassis bond · ASTM D991 resistivity

Send the contact footprint, the gap to the chassis, and whether a dielectric isolation layer is needed; the pad and its dielectric come off the drawing.
Kapton® HN Polyimide Film & Nomex® 410 Aramid Paper (dielectric barriers)Isolation windows & spacers under ground pads · dielectric methods per TDS

Specify film gauge or paper designation by name; the maker TDS carries the dielectric methods.
Silicone Sponge — BISCO® 7xxx SeriesBISCO® Silicone Sponge (non-conductive companion seal)
Electronics EMI shielding & grounding: engineer-grade FAQ
Twelve of the questions we hear most from hardware, RF, and EMC teams. If your question isn't here, send a drawing or call, engineering picks up.
Do these gaskets make my device FCC Part 15 or CISPR 32 compliant?
No material is compliant on its own, and no honest supplier will claim otherwise: FCC Part 15 (US unintentional radiators) and CISPR 32 / EN 55032 (multimedia equipment emissions) are evaluated on the tested device, so the compliance result belongs to the equipment. What the materials on this page carry is their own documentation: volume resistivity, a coupon shielding-effectiveness figure per the MIL-DTL-83528 method, a UL 94 class where rated, and lot-code traceability.
They support designs evaluated to the emissions limits; H-O supplies the converted parts and the paperwork, and the device team owns the EMC test. [4]
Fabric-over-foam vs conductive elastomer vs foil tape: which do I use?
By the joint. Fabric-over-foam (and conductive silicone sponge) is the low-closure-force gasket for light plastic lids and long serviceable seams, with typical SE around 70–100 dB per the maker TDS. A MIL-DTL-83528 conductive elastomer is the choice where the joint can supply real closure force and you want the highest, most repeatable SE, with the Type set by galvanic match.
Conductive foil tape is not a gasket at all; it bridges seams and terminates cable shields. And a ground-contact pad or strip is the discrete PCB-to-chassis bond. The form-factor checklist builder on this page assembles the set. [2]
What are the MIL-DTL-83528 types, and which one do I need?
MIL-DTL-83528 covers conductive elastomer types by filler chemistry: Type A (silver-copper), Type B (silver-aluminum), Type C (silver-glass), Type D (silver-nickel), and Type M (nickel-graphite), each with its own maximum volume resistivity and coupon SE. Type A silver-copper is the highest-conductivity register (capable of roughly 110 dB plane-wave SE at 10 GHz on a QPL grade TDS, about -55 to +160 °C), but it corrodes on bare aluminum.
Type M nickel-graphite is the cost-effective, aluminum-tolerant workhorse. Pick the Type by galvanic compatibility with your housing metal first, then by the SE the band needs; specify the Type on the callout. [2]
Why is silver-copper on aluminum a problem?
Galvanic corrosion. Silver and copper sit far from aluminum on the galvanic series, so a silver-copper-filled gasket against a bare-aluminum housing forms an aggressive galvanic couple. In humidity and salt-fog it corrodes, contact resistance at the seam climbs, and shielding effectiveness degrades over months in the field, even though it tested fine at build.
Use the aluminum-tolerant chemistries (nickel-graphite Type M, nickel-aluminum) on aluminum housings, keep silver-copper on tin, copper, brass, and stainless, and verify the pairing by salt-spray per ASTM B117.
The galvanic look-up tool on this page returns the verdict for each combination. [7]
Why does my shielded enclosure still leak if the metal is solid?
Because enclosures leak at their apertures and seams, not through the metal. Any unbridged opening — a connector cut-out, an unused port, a seam that contacts only intermittently — behaves as a slot antenna once its longest dimension nears a half wavelength, and SE collapses at that frequency. The design rule is to keep every gasket, clip, and fastener contact pitch below one twentieth of a wavelength at the highest frequency of concern, so the boundary reads as one continuous bond rather than a row of slots.
Gaskets and foil-tape bridges are the parts that make that pitch real. [3]
How do I ground a board-level shield to the chassis properly?
Not through a single long trace, which is inductive at RF and lets the can radiate. Give the shield a continuous perimeter ground pad (roughly 0.5–1.0 mm wide) around its footprint, with via stitching (roughly every 1.5–2 mm) tying it to the internal ground plane, then make the board-to-chassis bond short and wide with a conductive-elastomer ground-contact pad or a foil / fingerstock-style strip.
Where the pad sits next to live traces, add a Kapton® or Nomex® dielectric window. H-O converts the contact pad, the strip, and the dielectric layer; the pad width and via pitch are board-layout guidance. [6]
What goes on a light plastic housing that can't take much force?
A low-closure-force gasket: conductive silicone sponge (BISCO® EC-2130) or fabric-over-foam. A rigid conductive elastomer needs real compression force to make continuous contact; on a snap-fit plastic lid that cannot supply it, the lid bows and contact goes intermittent, and the assembled SE comes out worse than a soft gasket would have delivered. Match the gasket's compression class to the closure force the housing actually supplies, and reserve the firm conductive elastomers for metal housings and bolted board-level shields.
Is a gasket's shielding-effectiveness number the SE my product will get?
No. A gasket's SE figure is a coupon comparison value measured by a standard method (the MIL-DTL-83528 coupon method, or an enclosure method such as IEEE Std 299), and it tells you how one material compares to another. Your device's real SE depends on every aperture, seam, and ground point around the gasket, so a high-SE gasket on a leaky housing still fails.
Specify the material's coupon SE and volume resistivity per TDS on the callout, design the seams and grounds, and cite the emissions limit (FCC Part 15, CISPR 32) by designation; the compliance result belongs to the tested device. [3]
My IoT device's radio lost range. Can a shield fix antenna desense?
Often, yes, when the desense is self-interference. A switching regulator or high-speed digital section inches from the radio raises the receiver's noise floor with broadband hash, and no antenna tuning recovers the lost link budget. A board-level shield can over the aggressor section — a small Faraday cage that is gasketed to close its seams and grounded to the chassis on a low-impedance path — keeps that noise off the antenna's band.
The shielding job is the same continuous-bond and grounding problem covered elsewhere on this page, applied to protect a receiver rather than to pass an emissions scan.
Do you supply conductive foil tape, and what sets its performance?
Yes: copper and aluminum conductive foil tapes with conductive adhesive, slit to width and to length for seam bridging and cable-shield termination. The performance variable is the through-tape contact: the conductive adhesive and the bonded interface set the DC resistance across the joint, not the foil substrate, so surface prep, dwell, and pressure matter. We validate the tape and adhesive against the substrate, surface energy, temperature, exposure, dwell, pressure, prep, and part geometry and assembly method; send those with the drawing.
Can H-O kit the whole device shielding-and-grounding set?
Yes: perimeter gaskets, aperture-frame gaskets, ground-contact pads, dielectric windows, and foil-tape pieces can ship as a kitted set, one kit per device, parts on liner in assembly order, with lot-code TDS records per material. That is exactly the documentation an EMC review and a production line want to see, and it removes the field-trimming that starts most aperture and seam leaks.
What should I put on the drawing so the quote comes back right the first time?
By part: for seam gaskets, the seam geometry, gap, closure force available, target frequency band, and housing metal and finish; for ground-contact pads, the contact footprint, the gap to the chassis, and whether a dielectric isolation layer is needed; for foil tape, the seam or termination geometry and the substrate; and for any part, the flame, chemical, or outdoor requirement.
Plus quantities for prototype and production, and the standards language you need on the paperwork (material properties per TDS; emissions limits by designation). "Recommend the set" is a valid callout: that is what the engineering review is for.
Glossary: terms used on this page
Quick reference for the shielding, grounding, and EMC terminology used throughout. Each entry links to the relevant standard or test method where applicable.
Shielding effectiveness (SE)
The attenuation a shield provides at a stated frequency, in decibels. A material coupon carries a comparison SE figure per a standard method (MIL-DTL-83528 coupon, or an enclosure method such as IEEE Std 299 [3]); the device's real SE belongs to the tested equipment and depends on every aperture and seam around the material.
MIL-DTL-83528 (by designation)
The general specification for conductive elastomer EMI/RFI shielding materials, defining types by filler chemistry (A silver-copper, B silver-aluminum, C silver-glass, D silver-nickel, M nickel-graphite) with maximum volume resistivity and coupon SE per type. Cited by designation, via the vendor TDS, per [2].
Fabric-over-foam (FOF)
A compliant PU/PET foam core wrapped in a metallized conductive fabric (Ni/Cu or Sn/Cu). The low-closure-force EMI gasket workhorse, with typical SE around 70–100 dB from low MHz into the GHz range on the maker TDS; used where a rigid elastomer would over-compress the joint.
Ground contact pad / strip
A discrete converted part that bonds a PCB ground plane or shield can to the metal chassis on a short, low-impedance path, so RF return current does not travel a long inductive trace. Die-cut conductive elastomer or fabric-over-foam pad, or a foil / fingerstock-style strip; resistivity per ASTM D991 [6].
Galvanic corrosion
Accelerated corrosion at the junction of two dissimilar metals in an electrolyte. In shielding it drives contact-resistance rise and SE loss when a gasket filler is mismatched to the housing metal (silver-copper on bare aluminum is the classic case); qualified by salt-spray per ASTM B117 [7].
Slot / aperture leakage
The physics that an unbridged opening in a shield radiates as a slot antenna once its longest dimension nears a half wavelength (λ/2). The design response is to keep gasket / clip / fastener contact pitch below λ/20 so a seam behaves as one continuous bond.
FCC Part 15 (by designation)
The US regulation (47 CFR Part 15) governing radio-frequency devices, including unintentional radiators, with Class A (industrial) and Class B (residential/consumer) emission limits. Cited by designation, per [4]; compliance belongs to the tested device.
CISPR 32 / EN 55032 (by designation)
The EMC emission requirements for multimedia equipment. Radiated Class B limits are 40 dBµV/m at 30–230 MHz and 47 dBµV/m at 230–1000 MHz at 3 m; Class A is measured at 10 m. Cited by designation, per [5].
Volume resistivity
The bulk electrical resistance of a conductive material, in ohm-centimeters, and the property that gauges a conductive elastomer's ability to carry RF current across a seam. Reported per ASTM D991 [6] (or the maker method) on the grade TDS; lower is more conductive.
Board-level shield (BLS)
A small Faraday can on a PCB: a one-piece stamped can, or a two-piece frame-and-cover, soldered to a perimeter ground pad and enclosing an RF, SMPS, or high-speed-digital section. The converted parts here are its perimeter gasket, clip contact, and chassis ground bond.
Compression set
Permanent deformation after sustained compression; the property that decides whether a gasket still holds enough contact force for a low-impedance bond years later. Reported per ASTM D395 / D1056 [9]; conductive silicone sponge holds recovery widest across temperature.
Antenna coexistence / desense
The problem of a radio's receiver noise floor being raised by nearby broadband self-interference (a switching regulator, high-speed digital), which cuts range and cannot be recovered by antenna tuning. A board-level shield can over the aggressor section, gasketed and grounded, restores the link budget.
Last updated · Reviewed by H-O Products engineering (ISO 9001:2015 certified converter, Winsted, CT).
Standards, test methods & technical references
The standards, test methods, and maker technical data sheets cited throughout this page. Emissions limits are cited by designation: they are evaluated on the tested device, and the compliance result belongs to the equipment. Standards editions current as of July 2026; verify against the publishing body before final spec. H-O materials are aligned to these standards through the source manufacturer's TDS, not independently certified by H-O unless explicitly stated on the quote.
[1] CISPR 11 (by designation)
Industrial, scientific and medical (ISM) equipment — Radio-frequency disturbance characteristics — Limits and methods of measurement. Context for industrial IoT emissions. webstore.iec.ch (CISPR 11)
[2] MIL-DTL-83528 (by designation)
General Specification for Conductive Elastomer Materials, Electromagnetic Interference/Radio Frequency Interference Shielding Gaskets. Defines Types A/B/C/D/M by filler chemistry, with volume resistivity and coupon SE per type; commercial companion SAE-AMS-DTL-83528. Cited by designation via the vendor TDS. quicksearch.dla.mil (MIL-DTL-83528)
[3] IEEE Std 299 (by designation)
IEEE Standard Method for Measuring the Effectiveness of Electromagnetic Shielding Enclosures. The enclosure-level SE measurement method; the result belongs to the tested enclosure. standards.ieee.org (IEEE 299)
[4] FCC Part 15, Subpart B (by designation)
47 CFR Part 15 — Radio Frequency Devices; Subpart B covers unintentional radiators with Class A (industrial) and Class B (residential) emission limits. Compliance belongs to the tested device. ecfr.gov (47 CFR Part 15)
[5] CISPR 32 / EN 55032 (by designation)
Electromagnetic compatibility of multimedia equipment — Emission requirements. Radiated Class B: 40 dBµV/m (30–230 MHz) and 47 dBµV/m (230–1000 MHz) at 3 m; Class A at 10 m. Cited by designation. webstore.iec.ch (CISPR 32)
[6] ASTM D991
Standard Test Method for Rubber Property — Volume Resistivity of Electrically Conductive and Antistatic Products. The method behind the volume-resistivity values on the conductive-elastomer TDSs. astm.org (ASTM D991)
[7] ASTM B117
Standard Practice for Operating Salt Spray (Fog) Apparatus. The corrosion-qualification method for the gasket-filler / housing-metal pairing. astm.org (ASTM B117)
[8] UL 94 (by designation)
Standard for Tests for Flammability of Plastic Materials for Parts in Devices and Appliances (HB, V-0, V-1, V-2 classes). Flame classes belong to the rated grade per its TDS. ul.com (UL 94)
[9] ASTM D395 / D1056
ASTM D395 (Rubber Property — Compression Set) and ASTM D1056 (Flexible Cellular Materials — Sponge or Expanded Rubber). The compression-set and cellular-classification methods on the sponge and gasket TDSs. astm.org (ASTM D1056)
[10] DuPont Kapton® HN & Nomex® 410 TDS
DuPont Kapton® HN general-purpose polyimide film and Nomex® 410 calendered aramid paper technical data sheets: dielectric-strength and insulation properties for the dielectric windows and spacers used under ground-contact pads. dupont.com (Kapton HN)
Updated . Standards editions and links current at publication; verify against the publishing body before final spec. H-O converts materials tested to the methods cited; H-O does not certify devices. Lot-specific documentation available on request.
To review your shielding-and-grounding design, send:
- Housing material and finish
- Seam / aperture geometry and gap
- Closure force available
- Target frequency band
- Ground-contact footprint and chassis gap
- Dielectric-isolation need (yes/no)
- Flame / chemical / outdoor requirement
- PSA / liner / kitting requirements
- Prototype and annual volume
Get an EMI shielding & grounding engineering quote
Send a drawing set, BOM, or device spec. We typically respond within one business day with a form-factor and galvanic recommendation, prototype lead time, and TDS verification against your seams, apertures, grounding path, and standards language.
See also: related H-O application pages
Engineering content for the adjacent electronics and IoT sub-applications and the parent hub. Each page covers material selection, failure modes, and converter-side process detail for its application family.
Sibling sub-application
Electronics enclosure sealing & IP protection
The environmental side of the same housings: the water- and dust-sealing gaskets that run alongside the conductive EMI gasket on a device enclosure.
Read the page
Sibling sub-application
Electronics thermal management
The thermal-interface and heat-spreading materials for the same boards, including the aggressor sections a shield can covers.
Read the page
Sibling sub-application
Electronics electrical insulation & dielectric
The deeper story behind the Kapton® and Nomex® dielectric windows this page uses under its ground-contact pads.
Read the page
Sibling sub-application
Outdoor & IP-rated harsh-environment sealing
The outdoor / aluminum-housing environment that drives the corrosion-resistant filler choice on this page's galvanic factor.
Read the page
Industry hub
Electronics & IoT
The full electronics and IoT application family: sealing, EMI, thermal, shock, insulation, small battery packs, and wearables.
Read the page
Related sub-application
EMI shielding for switchgear & power systems
The same shielding discipline at cabinet and switchgear scale: the galvanic, aperture, and compression logic this page retargets to the board.
Read the page
Material data & standards. All shielding-effectiveness, volume-resistivity, temperature, and compression values on this page are taken from the source maker's technical data sheets with the method named (MIL-DTL-83528 coupon method, ASTM D991, ASTM B117, ASTM D395/D1056; UL 94 classes per the listed grade TDSs).
Emissions limits (FCC Part 15, CISPR 32 / EN 55032, CISPR 11) and enclosure SE methods (IEEE Std 299) are cited by designation only: they are evaluated on the tested device or enclosure, the compliance result belongs to the equipment, and the materials on this page support designs evaluated to them.
H-O converts materials; H-O does not design PCBs, run EMC scans, or certify devices, and does not independently certify materials against the standards unless explicitly stated on the quote. Verify against the maker TDS and your device-level EMC test plan.
Conversion scope. H-O and converts sheet, roll, and blanket stock to drawing in Winsted, Connecticut: die-cut and kiss-cut gaskets, pads, and washers, slit foil tapes and films, laminations, and kitted device sets, with material traceability and lot-code TDS records. H-O does not run molding or extrusion at its own plant; molded or extruded profiles are coordinated through a partner network with the usual tooling lead times. Lead-time and MOQ details are in the process strip and the quote form above.