Custom TIMs, EMI Gaskets & Environmental Seals for EV BMS, Inverters & Onboard Chargers
H-O Products converts thermal interface materials (graphite TIMs, boron nitride silicone thermal pads, soft conformable gap pads and TIM pads and films), conductive silicone EMI gaskets and soft conductive solid gaskets into die-cut pads, films, frames and environmental seals for battery management systems, traction inverters, onboard chargers, and DC-DC converters. Made to your drawing, under an ISO 9001:2015 certified quality management system in Winsted, Connecticut.
Built for: IGBT and SiC power-module heat paths, BMS board and busbar cooling, inverter and onboard-charger housings, EMI gasketing to control conducted and radiated emissions, and ingress-protected enclosure seals.
Thermal interface materials (TIMs), EMI gaskets and environmental seals are the parts that keep EV power electronics cool, shielded and sealed — three different jobs. Thermal management: a thin, conformable interface carrying heat from a power device or busbar into a heat sink, characterized by thermal impedance per ASTM D5470. EMI control: a conductive gasket bonding a housing seam so the enclosure behaves as a continuous shield within CISPR 25 / IEC 61000 limits.
Environmental sealing: a compression seal holding an ingress rating per IEC 60529. Each is mapped in the When-to-spec list. Values are per the TDS on file; see the material reference below for ordering details.
ASTM D5470 (Standard Test Method for Thermal Transmission Properties of Thermally Conductive Electrical Insulation Materials; the thermal-impedance and apparent-conductivity method for TIMs) · CISPR 25 (Vehicles, boats and internal combustion engines – Radio disturbance characteristics; limits and methods for component-level conducted and radiated emissions) · IEC 61000 series (Electromagnetic compatibility; emission and immunity test methods) · IEC 60529 (Degrees of protection provided by enclosures, the IP code).
Materials are evaluated against and support compliance with these methods; H-O does not independently certify materials to them unless explicitly stated on the quote.
- Thin, high-flux module bondline: graphite TIM or TIM film
- Larger air gap to a housing or lid: soft conformable gap pad
- Dielectric isolation with heat transfer: boron nitride silicone thermal pad
- Shielded housing seam (board level): soft conductive solid gasket
- Compression EMI seal on a cover: conductive silicone EMI gasket
- Combined EMI + ingress seal: conductive silicone gasket selected for IP duty
Where are you in the spec process?
This page serves engineers who already know the material family they need and engineers still working out whether the problem is heat, EMI, or ingress. Pick the path that matches where you are; you don't have to read the rest.
Send a drawing, get a quote
A graphite TIM, boron nitride thermal pad, soft gap pad, TIM film, EMI gasket or soft conductive solid part on your drawing – with adhesive, liner, thickness and bondline called out.
Skip to the quote form →Walk through the material decisions
The decisions that drive a TIM or EMI material choice (thermal vs. EMI vs. sealing, heat flux, bondline and pressure, dielectric needs, temperature, environment), the thermal-impedance relationship that governs heat flow, an interactive selector, and a material-family reference with cited test methods.
Start with the decisions →
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1Send drawingUpload a DXF, STEP, or PDF of the module, board, busbar or housing, or describe the heat path and the seam. A sample part works too.
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2Material reviewEngineering reviews the call-out against the manufacturer's current TDS and checks the goal (thermal, EMI, or sealing), the heat flux, the bondline and pressure, the dielectric needs, the temperature class, and the environment.
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3PrototypeSamples typically 3–5 business days for common configurations. Standard production runs about 2 weeks; special orders run custom lead times.
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4ProductionTooling refined, ongoing converted parts to drawing with material traceability and lot-level TDS records.
This page is for EV power-electronics engineers, hardware and packaging engineers, thermal and EMC engineers, and sourcing teams specifying thermal interface materials, EMI gaskets or environmental seals for battery management systems, traction inverters, onboard chargers, DC-DC converters and power-distribution units. It introduces the theme and routes you up to the EV & Battery industry page and its application overview, and across to the related EV sub-applications.
Heat, EMI or ingress problem → material selection → converted part → prototype → production supply → ongoing program.
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1Define the problemName the job: pull heat from a power module, close an EMI seam, isolate a busbar dielectrically, or seal a housing to an IP rating.
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2Select the material familyMatch the goal, the heat flux, the bondline and pressure, the dielectric need, the temperature and the environment to a family direction (use the selector tool).
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3Converted partDefine the pad, film, gasket frame or seal geometry, adhesive side, liner, and stack-to-thickness or compression set point.
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4PrototypeH-O die-cuts, kiss-cuts, laser- or waterjet-cuts a prototype to your drawing for fit and a first thermal or EMI check on the bench.
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5Production supplyTooling is refined and converted parts ship to drawing with material traceability and lot-level TDS records.
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6Ongoing programReleases against a blanket or kanban, with kitting and revision control as the design and volume evolve.
What are you solving?
TIMs, EMI gaskets and seals — what the terms actually mean.
The most common specification error in this field is reaching for the wrong job. A gap filler is not a thin bondline TIM; an EMI gasket is not an environmental seal; a thick pad is not automatically "cooler." These six terms separate the jobs. Get the job right and the material family follows.
Show all 6 terms tap to expand
A conformable material placed between a heat source and a heat sink to replace the insulating air in the microscopic gap between two surfaces. A TIM is judged by how little it adds to the heat path, not by how thick it is. Its key figure is thermal impedance per ASTM D5470.
The temperature drop across an interface per unit of heat flux, reported at a stated pressure and thickness per ASTM D5470. It combines the bulk resistance of the material with the contact resistance at each face, which is why mounting pressure matters as much as conductivity.
A soft, thick, highly conformable TIM used to bridge a large or uneven air gap, such as a board to a housing lid, at low assembly pressure. A gap pad trades a higher bulk thickness for the ability to fill a gap a thin film cannot, and is chosen when the gap, not the bondline, dominates.
An electrically conductive elastomer or sponge placed in a housing seam so the enclosure behaves as a continuous shield. By bonding two mating surfaces electrically, it closes the slot that would otherwise leak conducted and radiated emissions, evaluated against CISPR 25 and the IEC 61000 series.
Electrical separation between a live part (a busbar, a device tab) and a grounded heat sink, while still allowing heat to cross. Boron nitride filled silicone is the classic move because boron nitride raises thermal conductivity without making the pad electrically conductive, so one part both cools and isolates.
The rated ability of an enclosure to keep solids and water out, expressed as an IP code per IEC 60529 (for example IP67). An environmental seal holds the rating by compressing in the housing seam; the rated number belongs to the tested enclosure, not to the raw seal material.
Decisions that drive your TIM, EMI or sealing material choice
Material selection for power-electronics thermal and EMI work returns to a handful of decisions, in order. Answer them and the family follows; the interactive selector below walks the same logic. None of these is a headline conductivity figure – the job and the duty decide the material, and grade-level values are always confirmed against the manufacturer's current technical data sheet.
Show all 6 selection factors tap to expand
What is the job: thermal, EMI, or sealing?
This is the first fork and it sorts the families. Thermal wants a conformable, high-conductivity interface (graphite TIM, boron nitride silicone pad, gap pad, TIM film). EMI wants an electrically conductive gasket that bonds a seam (conductive silicone, soft conductive solid). Environmental sealing wants a compression seal that holds an IP rating (silicone sponge, closed-cell elastomer).
Some parts do two jobs at once – a conductive gasket that also seals – but naming the primary job first prevents the classic mistake of using one where another belongs.
How much heat, and across what gap and pressure?
For a thermal part, the heat flux and the bondline geometry set everything. A thin, flat, high-flux interface under real mounting pressure (a module baseplate to a cold plate) wants a thin, high-conductivity TIM or graphite, where contact resistance is squeezed out. A large or uneven air gap at low pressure (a board to a lid) wants a soft gap pad that fills the gap without forcing the parts apart. Send the gap, the flatness, the clamp pressure and the heat to dissipate so the impedance can be checked against the data-sheet curve.
Does the part need dielectric isolation?
If the heat path crosses from a live conductor to a grounded sink – a busbar, a device tab, a FET drain – the interface must be thermally conductive but electrically insulating. Boron nitride filled silicone is the standard answer because boron nitride carries heat without carrying current, so a single pad both cools and isolates and can also support a dielectric-strength requirement.
A graphite TIM, by contrast, is electrically conductive and is the wrong choice where isolation is required. State the working voltage and any dielectric-strength target.
What frequency range and emissions limit must the EMI part meet?
For an EMI gasket, the seam geometry, the closure force and the frequency range drive the choice. A conductive elastomer gives a robust, reusable compression seal for a cover or flange; a soft conductive solid gives a softer, lower-closure-force seal for a board-level shield can. Both bond the seam so the housing shields across the band of interest, with conducted and radiated emissions evaluated against CISPR 25 and the IEC 61000 series. Send the seam length, the available closure force, and the emissions limit the assembly must meet.
What is the operating temperature, and any flame rating?
Silicone-based TIMs and gaskets cover the broad temperature span typical of inverter and charger housings and hold their properties hot; graphite is stable to high temperature as well. Where a continuous-service limit or a UL 94 flame rating governs, that narrows the grade. Confirm the continuous-service range and any flame class on the grade TDS, because these are grade- and thickness-specific and are not a property of the family alone.
What is the environment, and how is the part assembled?
The environment and the assembly method can override the mechanics. A sealed automotive housing exposed to coolant, road spray and thermal cycling points to silicone-based parts with the right environmental resistance; a part that must peel-and-place on a line needs the correct adhesive side and liner. Closed-cell sealing materials keep moisture and fluids out where an IP rating is required. Call out the environment, the adhesive and liner needs, and whether the part is hand-placed or applied on an automated line.
EV inverter & BMS thermal / EMI failures you can prevent at spec
These failures show up as a throttling inverter, a dielectric breakdown, or a failed emissions scan — all decided in the material callout.
The converter’s thermal and EMC ratings assume specified interfaces. Choosing a TIM by thickness or confusing cooling with isolation is where these specs go wrong.
Show all 5 failure modes tap to expand
1. A gap pad chosen by thickness, not impedance
Fix — select the TIM by thermal impedance per ASTM D5470 at the actual mounting pressure; graphite or boron-nitride silicone as the job needs.
2. Dielectric isolation lost under a live tab
Fix — use a boron-nitride-filled silicone that both cools and isolates the device from the sink.
3. An EMI leak at the inverter enclosure
Fix — bond the seam with a conductive gasket to hold CISPR 25 / IEC 61000 limits.
4. An under-rated housing IP seal
Fix — size the compression seal to the required IEC 60529 IP rating.
5. Hand-placed TIMs with inconsistent coverage
Fix — deliver kiss-cut TIM kits placed to the drawing.
Interactive specification tools
Two interactive tools to take you from "I have a heat, EMI or ingress problem" to here is the material family to put on the drawing: an interface material trade profile that overlays graphite, boron-nitride silicone pad and conductive EMI silicone on the four roles where their duties collide, and a TIM and EMI material-family selector that turns your goal, gap, dielectric need and environment into a cautiously framed family direction.
A third tool, an exploded 3D view of a power-module stack, places the converted interface in context. Each renders with a static fallback when JavaScript is off.
Why this tool This is the one place in the pack where three different electrical and thermal duties collide in a single part: an interface may need to move heat, isolate electrically, and bond an EMI seam – and no single family does all three. A graphite interface spreads heat but is electrically conductive; a boron-nitride-filled silicone pad cools and isolates at once; a conductive EMI silicone bonds the seam but is the wrong part where isolation is required.
The trade profile below overlays the three families on the four roles so the trade is visible at a glance – which is why the job must be named before the family. Positions are ordinal and illustrative, drawn from this page's decision framework; no conductivity, dielectric or shielding value is shown.
1. Thermal vs. EMI vs. both: interface material trade profile
Three interface families – graphite, boron-nitride-filled silicone pad, conductive EMI silicone – overlaid on four qualitative roles: heat-spreading, electrical isolation, EMI seam-bonding, and conformability. Toggle the families to compare; the shapes never match, which is the point. Positions are ordinal (lower / typical / higher), not measured values; confirm every property on the grade TDS. With JavaScript off, all three profiles render statically with a ratings table.
Interactive: Thermal vs. EMI vs. Both – Interface Material Trade Profile
Toggle the three families to overlay their trade profiles on four qualitative roles. Each axis runs lower → typical → higher from the center, and the positions are ordinal and illustrative only, restating this page's decision framework: boron-nitride pads are electrically insulating; graphite is electrically conductive; conductive EMI silicone bonds a seam. No thermal-conductivity, dielectric-strength or shielding value is shown; confirm every property on the grade TDS.
Graphite interface: high heat-spreading and stable to high temperature, but electrically conductive – the wrong choice where isolation is required.
Boron-nitride silicone pad: carries heat without carrying current, so a single pad both cools and isolates and can also support a dielectric-strength requirement.
Conductive EMI silicone: an electrically conductive gasket that bonds a seam as a robust, reusable compression seal; some parts also seal environmentally.
No single family tops every axis – that is why the job must be named first.
| Family | Heat-spreading | Electrical isolation | EMI seam-bonding | Conformability |
|---|---|---|---|---|
| Graphite interface | ●●● higher | ● lower (electrically conductive) | ● lower (a flat interface, not a seam gasket) | ● lower (thin; relies on mounting pressure) |
| Boron-nitride silicone pad | ●● typical | ●●● higher (electrically insulating) | ● lower (insulating, cannot bond a seam) | ●●● higher (conformable silicone pad) |
| Conductive EMI silicone | ● lower (its job is the seam, not the heat path) | ● lower (electrically conductive) | ●●● higher (bonds the seam under compression) | ●● typical (compression seal) |
About this profile. The positions are ordinal and illustrative – a three-step ranking (lower / typical / higher) of qualitative roles restated from this page's decision framework, not measured data. No thermal-conductivity, dielectric-strength or shielding value is shown or implied.
Measured thermal impedance is reported per ASTM D5470 at a stated pressure and thickness on the manufacturer's data sheet; dielectric and shielding behavior are grade- and assembly-specific. Confirm every property for your grade, gauge and assembly on the grade TDS before final spec; treat this profile as a map of the trade, not a ranking of grades.
Why this tool The TIM, gap-pad and EMI families overlap, and the right one depends on four inputs at once – the job, the gap, the dielectric need and the environment. This selector encodes the same decision logic an H-O engineer applies, so you arrive at the material reference already pointed at the right family direction instead of reading all of it. It is a starting direction, deliberately cautious; the final grade is always confirmed against the manufacturer's data sheet.
2. TIM / EMI material-family selector
Pick your primary goal, the gap or bondline, the dielectric need and the environment. The selector returns a cautiously framed family direction and the reason. With JavaScript off, a static decision table covers the same ground.
Interactive: TIM / EMI Material-Family Selector
Four inputs in, one cautiously framed family direction out. This is a starting point that mirrors the decision logic on this page, not a substitute for an engineering review or the manufacturer's technical data sheet.
| If your goal is… | Lead family direction | Why |
|---|---|---|
| Thin, high-flux module bondline | Graphite TIM or TIM film | Thin, high-conductivity interface squeezes contact resistance out under real clamp pressure |
| Fill a larger air gap, low pressure | Soft conformable gap pad | High conformability bridges an uneven gap without forcing the parts apart |
| Heat transfer with dielectric isolation | Boron nitride silicone thermal pad | Boron nitride carries heat without carrying current, so one pad cools and isolates |
| EMI shield seam, compression | Conductive silicone EMI gasket | Robust, reusable conductive seal that bonds a cover or flange seam |
| EMI shield, low closure force | Conductive solid silicone gasket | Soft soft conductive solid seals a board-level shield can at low closure force |
| Environmental / ingress seal | Silicone sponge or closed-cell elastomer | Compression seal holds an IEC 60529 IP rating against dust and water |
All directions are cautious starting points; the final grade is confirmed against the manufacturer's current technical data sheet for your gap, pressure, dielectric and environment.
About this selector. The output is a family-level direction based on general engineering principles, not a grade recommendation and not a guarantee of fit. Several families can serve the same job; the selector points at the most common starting choice for the inputs given. Confirm the specific grade, thickness, thermal impedance, dielectric strength and any flame rating against the manufacturer's current technical data sheet, and send the part to H-O for an engineering review.
Why this tool A power-module heat path is a stack, not a single part, and where the converted interface sits relative to the device, the baseplate and the cold plate decides how it behaves. The exploded 3D view makes the stack legible – power device, baseplate, thermal interface, cold plate, EMI gasket frame – so the parts H-O converts (the TIM and the gasket frame) are shown in their real context. It is a reference model, not customer CAD, and it degrades to a static caption when WebGL is unavailable.
3. Exploded power-module stack (3D)
A representative power-module thermal and EMI stack, exploded along its heat axis – power device, module baseplate, thermal interface, cold plate, and a conductive EMI gasket frame – to show where the converted parts live. Drag to rotate; click a layer to isolate it.
3D Exploded View: Power-Module Thermal & EMI Stack
Representative power-module heat and shield path, exploded along the heat axis: power device → module baseplate → die-cut thermal interface → cold plate, with a conductive EMI gasket frame closing the housing seam. Drag to rotate, click a layer to isolate its role, toggle explode with the icon or the E key. The hero layers in amber are the converted parts — the TIM and the gasket frame H-O converts.
Open the interactive 3D exploded stack — drag to rotate, click a layer to isolate
3D viewer unavailable
The interactive 3D model could not load. This pilot needs WebGL; the stack it shows is, from top to bottom: power device, module baseplate, thermal interface (an H-O part), the cold plate, and a conductive EMI gasket frame (an H-O part). Please try a current desktop browser with hardware acceleration enabled.
Select to isolate
Representative power-module thermal and EMI stack; not customer CAD.
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Skip ahead and request your engineering review now
If your drawing already calls out a graphite TIM, boron nitride pad, gap pad, TIM film, conductive gasket or sealing part – send it over for engineering review against the current data sheet.
The five jobs this theme covers
Power-electronics thermal and EMI work is not one application but five related ones, each with a different physics and a different material lead. Click a tab to see the environment, the standards commonly referenced, and the material families H-O converts for that job. Each maps to the EV pack and power-electronics assemblies these parts go into.
Power-module heat paths: IGBT and SiC modules to the cold plate
This is the classic power-electronics thermal problem: a switching device dumps heat into a baseplate that must shed it into a liquid cold plate or heat sink with the smallest possible temperature rise. The fix is a thin, high-conductivity interface that wets both surfaces and squeezes contact resistance out under the module's clamp pressure.
The higher the flux and the flatter the joint, the more this favors a thin interface: graphite TIMs for a very thin, high-conductivity dry interface, and TIM pads and films for a conformable thin bondline. H-O these to the module footprint, with clearance holes and liners as the drawing calls out.
Graphite TIMThin, high in-plane and through-plane conductivity dry interface for high-flux module bondlines; conformable and clean to handle, electrically conductive, so not for dielectric isolation.
TIM pads & filmsConformable thin thermal interface pads and films for module and device bondlines; impedance reported per ASTM D5470 at a stated pressure and thickness.
Boron nitride silicone padWhere the module path also needs dielectric isolation, a boron nitride filled silicone pad carries heat while keeping the device electrically separated from the sink.
Soft conformable gap padFor a module or device that sits above a non-flat sink with a real air gap, a soft gap pad fills the gap at low pressure where a thin film cannot.Grade-level properties, standards and caveats for these families are in the material reference below — one card per family, with the TDS links.
BMS board and busbar cooling and dielectric isolation
A battery management system board, a balancing FET, or a busbar often has to lose heat into a housing wall or a cold plate across a real air gap, and frequently across a voltage.
The fix is a soft, conformable gap-filling pad that bridges the gap at low assembly pressure, with dielectric isolation where the heat path crosses from a live conductor to a grounded sink. Soft conformable gap pads bridge the gap, and boron nitride silicone thermal pads add dielectric isolation while still carrying heat. H-O these to the board or busbar footprint with clearance for components and fasteners.
Soft conformable gap padHighly conformable boron nitride silicone gap filler that bridges an uneven board-to-housing gap at low closure force without stressing components; many grades are dielectric.
Boron nitride silicone thermal padThermally conductive, electrically insulating pad for cooling a busbar or device while holding it off a grounded sink; supports a dielectric-strength requirement.
TIM pads & filmsThinner conformable interface for a flatter board-to-cold-plate joint where the gap is small and the pressure is controlled.
Graphite TIMFor a non-isolated, high-flux spot on a board where a very thin, high-conductivity dry interface is wanted and electrical conductivity is acceptable.Grade-level properties, standards and caveats for these families are in the material reference below — one card per family, with the TDS links.
EMI gasketing and shielding for inverter and charger housings
A power-electronics housing only shields if its seams are electrically closed. A switching inverter or charger generates conducted and radiated emissions that escape through any unbonded slot, so a conductive gasket is placed in the cover or flange seam to bond the two surfaces into a continuous shield.
A conductive silicone EMI gasket gives a robust, reusable compression seal for a housing cover, while a soft conductive solid gasket gives a softer, lower-closure-force seal for a board-level shield can. Emissions are evaluated against CISPR 25 and the IEC 61000 series; the gasket supports the assembly's compliance. H-O these to the seam profile with adhesive and liners.
Conductive silicone EMI gasketFilled, electrically conductive silicone for a robust, reusable compression seal on a cover or flange; bonds the seam so the housing shields across the band of interest.
Conductive solid silicone gasketSoft soft conductive solid silicone for a board-level shield can or a low-closure-force seam where a firm elastomer would over-stress the enclosure.
High-conductivity conductive elastomerHigher-conductivity solid conductive elastomer for seams that need stronger shielding effectiveness; selected by the frequency band and the emissions limit.
EMI shielding elastomersThe broader conductive-elastomer family from which the gasket grade is chosen by closure force, environment and shielding target.Grade-level properties, standards and caveats for these families are in the material reference below — one card per family, with the TDS links.
Environmental and ingress seals for power-electronics housings
A sealed BMS, inverter or charger housing has to keep dust and water out to a rated ingress level. The fix is a compression seal placed in the housing seam, sized so it holds a controlled set point across temperature and assembly tolerance. Soft silicone sponge and closed-cell elastomer seals compress to close the seam and hold an IEC 60529 IP rating, with silicone covering a broad temperature span and flame-rated grades available.
Where the same seam must both seal and shield, a conductive silicone gasket can be selected for combined duty. H-O these to the seam profile, with adhesive and corner joints as drawn.
Silicone sponge sealClosed-cell silicone sponge compression seal for housing covers; holds an IP rating across a broad temperature span, with flame-rated grades available.
EPDM foam sealWeather- and ozone-resistant closed-cell foam seal for housing seams where a lower-cost environmental seal suits the temperature range.
Flame-retardant silicone spongeFlame-retardant silicone sponge seal where a UL 94 flame rating governs alongside the ingress seal; verify the rating on the grade TDS.
Conductive silicone gasket (combined)Where one seam must both seal and shield, a conductive silicone gasket selected for IP duty closes the slot electrically and environmentally at once.Grade-level properties, standards and caveats for these families are in the material reference below — one card per family, with the TDS links.
Onboard charger and DC-DC converter assemblies
An onboard charger or DC-DC converter is where all three jobs meet in one assembly: a magnetics or FET stage that has to lose heat, a switching circuit whose emissions must stay inside the limits, and a housing that has to seal. The result is usually a set of converted parts, not one – a gap pad or boron nitride pad on the thermal path, a conductive silicone gasket on the shield seam, and a silicone sponge seal on the housing. H-O converts and, where useful, kits these together so they drop onto the line in sequence.
Soft conformable gap padBridges a magnetics or FET stage to the housing wall for heat removal at low assembly pressure across a real gap.
TIM pads & filmsThin conformable interface for the flatter, higher-flux thermal joints inside the charger or converter.
Conductive silicone EMI gasketBonds the housing seam so the switching stages stay within CISPR 25 and IEC 61000 emissions limits.
Silicone sponge sealCompression seal that holds the housing IP rating across the temperature span the charger sees.Grade-level properties, standards and caveats for these families are in the material reference below — one card per family, with the TDS links.
TIM and EMI material families compared by job
The families a power-electronics engineer weighs, compared on the properties that actually decide the spec. Values are cautious and qualitative; where a property is grade- and thickness-specific, the cell says so. This is a family-level orientation, not a grade datasheet – confirm exact values against the manufacturer's current TDS.
| Property | Graphite TIM | Boron nitride silicone pad | Soft gap pad | Conductive silicone gasket | Conductive solid silicone |
|---|---|---|---|---|---|
| Primary job it leads | |||||
| Best-fit job | Thin high-flux bondline | Heat + dielectric isolation | Fill a larger air gap | EMI seam, compression | EMI seam, low force |
| Thermal & electrical behavior | |||||
| Thermal performance | Very low impedance Thin, high-conductivity; per ASTM D5470 | Good Conductive while insulating; grade-dependent | Gap-dependent Bridges a gap a film cannot; thicker bulk | Not a thermal part Chosen for shielding, not heat | Not a thermal part Chosen for shielding, not heat |
| Electrical behavior | Conductive Not for dielectric isolation | Insulating Dielectric; supports isolation | Often insulating Many grades dielectric; verify on TDS | Conductive seal Bonds the seam electrically | Conductive seal Soft conductive seam closure |
| Mechanical & environment | |||||
| Conformability / closure force | Thin, firm Needs real clamp pressure to seat | Moderate Conformable pad; grade-dependent | Very conformable Low closure force; fills uneven gaps | Firm seal Robust, reusable compression | Soft Low closure force for shield cans |
| Temperature / environment | High temp Stable hot; verify on TDS | Silicone span Broad range; flame grades available | Silicone span Broad range; grade-dependent | Silicone span Broad range; weather-resistant | Silicone span Broad range; verify on TDS |
How to read this. Graphite TIMs and TIM films lead for thin, high-flux module bondlines; boron nitride silicone pads lead where heat transfer must come with dielectric isolation; soft gap pads lead where a larger or uneven air gap dominates; conductive silicone gaskets lead for robust EMI seam compression; soft conductive solid leads for soft, low-closure-force board-level shielding. Several families overlap, so the job, the gap and the dielectric need decide the lead.
All values are family-level and qualitative; confirm grade-level thermal impedance, dielectric strength, temperature and flame rating against the manufacturer's current technical data sheet for your part.
What H-O converts these materials into.
H-O Products is a precision converter. We do not extrude or mold the raw material; we buy sheet, slab and roll stock from the material manufacturers and convert it to your drawing. For power-electronics thermal and EMI work, that converting capability turns the families above into finished parts in low and high volume.
Show all 6 part types tap to expand
Thin TIM pads and films and conformable thermal pads cut to a module, device or board footprint – from graphite, boron nitride silicone and TIM film stock – with clearance holes, liners and pull-tabs as drawn.
Soft, conformable gap-filling pads cut to the board or device footprint to bridge an air gap to a housing or lid at low assembly pressure, with dielectric isolation where required.
Conductive silicone gaskets and soft conductive solid to a housing seam, flange or shield-can profile so a cover bonds electrically into a continuous shield, with adhesive and liners for placement.
Silicone sponge and closed-cell elastomer seals cut to the housing seam to hold an IP rating, with corner joints, adhesive sides and liners set on the drawing.
Conductive gaskets selected for combined EMI and ingress duty, so one seam part closes the slot both electrically and environmentally.
Multi-layer laminations (adhesive, liner, pad, film), stacks built to a target thickness, and kitted, sequenced sets of thermal, EMI and sealing parts that drop straight onto your line.
Converting processes include rotary and flatbed die-cutting, kiss-cutting, laser and waterjet cutting, adhesive lamination, slitting, and kitting. Tolerances, adhesive systems, liners and packaging are set on the drawing and confirmed at quote. See die-cutting, lamination and kitting under related capabilities.
TIM, EMI and sealing materials H-O converts
Family-level notes on the materials referenced on this page, with where each one fits across the five jobs. These are the families H-O converts; they are commonly used for the duties described, and a given grade may be suitable depending on heat flux, gap, pressure, dielectric need and environment. Grade-level values are thickness- and grade-specific; confirm against the material manufacturer's current technical data sheet. H-O converts these to drawing in low and high volume.
Graphite Thermal Interface MaterialThin, high-conductivity dry interface · high-flux module bondlines

- eGRAF HT-1205thin flexible graphite TIM
- eGRAF HT-2505mid-range graphite TIM
- eGRAF HT-C3200high-conductance grade
AeroZero® Graphite-Faced Aerogel FilmSpreads heat along the face, blocks it through the thickness · shields boards beside hot modules
- AZ-TPS GR 100 · DualZero TPS GR 201 · QuadZero TPS GR 400 graphite-faced constructions — spread heat along the face while insulating through the thickness (UL 94 VTM-0 film; V-0 laminates)
- AZ-TPS 100 · AZ-TPS 101 single- and double-sided silicone-PSA aerogel film, 190–216 µm, UL 94 VTM-0
- AZ-TPS PI 100 polyimide-faced aerogel film, 240 µm, UL 94 VTM-0 — durable outer skin for handling and wear
Boron Nitride Silicone Thermal PadThermally conductive, electrically insulating · dielectric isolation

- Sil-Pad TSP-K1300Kapton-reinforced insulator
- Sil-Pad TSP-1800STsoft-tack insulating elastomer
- Sil-Pad TSP-900silicone-fiberglass pad
Soft Conformable Gap PadHighly conformable boron nitride silicone · fills larger air gaps at low pressure

- Gap Pad TGP-1000VOUSultra-soft viscoelastic gap filler
- Gap Pad TGP-1500un-reinforced gap filler
- Gap Pad TGP-5000high-conductivity soft grade
TIM Pads & FilmsConformable thin thermal interface · module and device bondlines

- Kapton MTthermally conductive polyimide film
- Kapton 120FMT616FEP-coated thermally conductive film
- Sil-Pad TSP-1600Slow-pressure applications
Conductive Silicone EMI GasketFilled conductive silicone · robust compression shield seal

- 502-40nickel-graphite conductive silicone, 40 Shore A (standard grade)
- 502-65nickel-graphite conductive silicone, 65 Shore A (standard grade)
- 502F-50conductive fluorosilicone, 50 Shore A, for coolant- or oil-wetted seams only
- 502F-60conductive fluorosilicone, 60 Shore A, for coolant- or oil-wetted seams only
- 502-40-V0UL 94 V-0 grade
Conductive Solid Silicone GasketSoft soft conductive solid silicone · low-closure-force shielding

- 2368conductive solid silicone
- EC-2130electrically conductive silicone
- BISCO EC2265conductive silicone gasket stock
The governing specifications these materials are designed to meet.
The test methods and specifications a power-electronics thermal and EMI spec returns to, grouped by what they govern. Materials are evaluated against and support compliance with these methods through the manufacturer's data sheet; H-O does not independently certify materials to them unless explicitly stated on the quote. Cite the designation, not a pass: "evaluated against ASTM D5470," not "certified to."
Show all 4 standards groups tap to expand
- ASTM D5470 – Standard Test Method for Thermal Transmission Properties of Thermally Conductive Electrical Insulation Materials. The reference method for thermal impedance and apparent conductivity of a TIM, reported at a stated pressure and thickness.
- Thermal-impedance basis – the temperature-drop-per-unit-flux relationship behind the impedance-versus-pressure behavior described on this page; the basis for sizing a bondline and a clamp force.
- CISPR 25 – Vehicles, boats and internal combustion engines, radio disturbance characteristics. Limits and methods for protecting on-board receivers, widely applied to EV component-level conducted and radiated emissions.
- IEC 61000 series – Electromagnetic compatibility (EMC). The emission and immunity test-method framework an EV power-electronics assembly is evaluated against; a conductive gasket supports the assembly's compliance.
- IEC 60529 – Degrees of protection provided by enclosures (IP code). Defines the IP rating an environmental seal helps a housing hold against solids and water.
- Material role – a seal supports an enclosure's IP rating; the rated result belongs to the tested enclosure, not the raw seal material.
- Dielectric strength – reported on the grade data sheet for boron nitride silicone and TIM-film grades used for isolation; confirm the rated value for your gauge.
- UL 94 – the flammability classification referenced for silicone gasket and sealing grades; grade- and thickness-specific and confirmed on the manufacturer's data sheet.
Standard editions are current as of June 2026; verify against the publishing body before final spec. Dielectric and flame ratings referenced for specific grades are grade- and thickness-specific and are confirmed on the manufacturer's data sheet.
Related EV & Battery sub-applications
This page sits inside the EV & Battery industry and its thermal-management and insulation application family. These links route up to the industry and application overview, and across to the sibling EV sub-applications where related materials do their jobs. (Some pages are being published; links that are not live yet resolve gracefully.)
EV power-electronics TIM & EMI: engineer-grade FAQ
Ten of the questions we hear most from EV power-electronics, thermal and EMC engineers. If your question isn't here, send a drawing or describe the assembly and call, engineering picks up.
What is the difference between a thin TIM and a gap filler?
They solve the heat path at two different scales. A thin TIM, graphite or a thin film, is for a flat, high-flux bondline under real clamp pressure, where the goal is the smallest possible thickness so contact resistance is squeezed out and the bulk resistance is tiny. A gap filler is a soft, thick, highly conformable pad for a large or uneven air gap at low assembly pressure, where the goal is to fill a gap a thin film could never close.
Using a thin film across a real gap leaves air behind and ruins the heat path; using a thick gap pad on a flat high-flux joint adds unnecessary bulk resistance. The first decision is which one your geometry needs: a controlled thin bondline, or a gap to fill.
Why does mounting pressure matter as much as conductivity for a TIM?
Because most of the real interface resistance is contact resistance, not bulk resistance. Two surfaces only touch at their high spots; the rest is air, which is a poor conductor. A TIM's job is to displace that air and wet both faces, and how well it does that depends on pressure. As mounting pressure rises, the material conforms further into the surface roughness, the contact area grows, and the apparent impedance falls steeply before flattening toward a floor set by the material's thickness and conductivity.
That is the impedance-versus-pressure shape this page describes; the full reference chart lives on the Thermal Management & Insulation overview. The practical consequence is that a high-conductivity TIM applied at too little pressure can underperform a modest TIM applied correctly, so the bondline pressure and surface finish belong on the drawing alongside the grade.
When do I need a dielectric TIM, and what material gives it?
You need a dielectric TIM whenever the heat path crosses from an electrically live part to a grounded heat sink and the two must stay isolated, a busbar, a device tab, a FET drain pad sitting on a grounded cold plate. The material that does both jobs is boron nitride filled silicone: boron nitride raises the silicone's thermal conductivity without making it electrically conductive, so a single pad carries heat while holding off the voltage and supporting a dielectric-strength requirement.
A graphite TIM is the opposite, electrically conductive, and is the wrong choice anywhere isolation is required. State the working voltage and any dielectric-strength target so the grade and thickness can be confirmed against the data sheet.
How does a conductive gasket actually reduce EMI?
By closing the electrical slot in a housing seam. A metal enclosure shields well only if it is continuous; any unbonded gap between a cover and a body behaves like a slot antenna that leaks the conducted and radiated emissions a switching inverter or charger generates. A conductive gasket placed in that seam bonds the two mating surfaces electrically, so current can flow across the joint and the housing acts as one continuous shield across the frequency band of interest.
The gasket has to be compressed to the design deflection to make and keep that low-resistance contact, which is why closure force and seam flatness matter. Emissions are evaluated against CISPR 25 and the IEC 61000 series at the assembly level; the gasket supports that compliance, and the shielding effectiveness for a grade and band is confirmed on the data sheet.
Can one gasket both shield EMI and seal against water?
Often yes, and it is a common request for sealed EV housings. A filled conductive silicone gasket is an elastomer first, so when it is selected and sized for the right deflection it can hold an environmental seal at the same time it bonds the seam electrically, closing the slot both for emissions and against dust and water. The caution is that the two duties have different acceptance criteria, the shielding effectiveness across the band and the ingress rating per IEC 60529, and a single grade has to satisfy both at the as-assembled compression.
So when you need a combined seal-and-shield part, call that out explicitly, send the seam geometry and the closure force, and let engineering confirm a grade and a deflection that meet the emissions limit and the IP target together.
What thermal-impedance number should I put on the drawing?
Specify the impedance at your real bondline conditions, not a headline conductivity. Thermal impedance is reported per ASTM D5470 at a stated pressure and thickness, so a meaningful call-out names the target impedance together with the assembly pressure, the bondline thickness, and the surface finish it applies to. A bulk conductivity figure alone is misleading because it ignores contact resistance, which can dominate a thin joint.
The cleanest approach is to send the heat to dissipate, the allowable temperature rise, the gap and flatness, and the clamp pressure, and let the grade be matched to the data-sheet impedance curve for those conditions, then verified on the bench. Treat the chart on this page as a way to understand how impedance moves with pressure, not as a source of grade numbers.
Is graphite a good TIM for an EV power module, and what is the catch?
Graphite is an excellent thin, high-conductivity interface for a flat, high-flux module bondline: it conforms to surface roughness under clamp pressure, gives a very low impedance at a small thickness, and is clean and dry to handle. The catch is that flexible graphite is electrically conductive, so it cannot be used where the heat path must also isolate a live conductor from a grounded sink, that job belongs to a boron nitride silicone pad.
Graphite also needs real, even clamp pressure to seat, so it suits a bolted module-to-cold-plate joint more than a loose, low-pressure gap. Use graphite where the joint is flat, the flux is high, the pressure is controlled, and electrical conductivity at the interface is acceptable, and confirm the grade-level impedance per ASTM D5470 for your conditions.
How do I hold an IP rating on a power-electronics housing seam?
With a compression seal sized for the seam and held at a controlled set point across temperature and tolerance. The IP rating is defined per IEC 60529 and belongs to the tested enclosure, so the seal's job is to close the seam reliably at the as-assembled compression, accounting for the housing's flatness, the fastener spacing, and the thermal cycling the part will see.
Closed-cell silicone sponge and closed-cell elastomer seals are the usual choices because they keep moisture out and recover across cycles, with silicone covering a broad temperature span and flame-rated grades available. Send the seam profile, the gland or groove geometry if there is one, the closure force, and the target IP level, and the seal cross-section, material and corner joints can be set so the housing holds the rating.
Do these materials come certified to CISPR 25, IEC 61000 or IEC 60529?
Those standards apply to an assembly or a measurement, not to a raw material on its own. CISPR 25 and the IEC 61000 series are emissions and EMC test frameworks an item of equipment is evaluated against, and IEC 60529 is an ingress rating an enclosure is tested to; a gasket or a seal supports the assembly's compliance, but the rated result belongs to the tested assembly.
So the honest framing is that H-O materials are evaluated against and support compliance with these methods through the manufacturer's data sheet, and H-O does not independently certify a material to them unless that is explicitly stated on the quote. If you need a measured shielding-effectiveness or IP number, that comes from a test of the specific assembly with the gasket or seal installed at its design compression.
Does H-O make the raw TIM and gasket stock, and can I get custom parts with lead times and samples?
H-O is a precision converter, not a raw-material producer. We do not extrude or mold the TIM, gasket and sealing stock; we buy sheet, roll and slab stock from the material manufacturers and convert it to your drawing, by die-cutting, kiss-cutting, laser and waterjet cutting, adhesive lamination, slitting and kitting, with material traceability and lot-level data-sheet records.
Every thermal, EMI and sealing part is made-to-order; we do not carry finished parts in stock and we do not advertise a no-minimum policy, though prototype quantities through full production runs are equally welcome and the minimum varies by material and part.
Prototype and production timing is summarized in the process strip near the top of the page and on the quote form. Send your drawing or describe the assembly through the form below for a specific quote.
Can I get material samples before committing to a design?
Yes — material swatches and cut samples are available on request, subject to material availability. For evaluation builds, the usual path is to send the part drawing so prototype parts are cut from the actual grade and thickness under consideration; that puts representative parts in your fixture instead of a generic swatch.
Are there minimum order quantities?
Minimums depend on the material and format rather than a single policy. Prototype quantities are quoted case-by-case, and production minimums are typically driven by the vendor’s sheet or roll purchase unit for the specific material. Stating your target annual volume on the RFQ lets H-O quote realistic break points up front.
Glossary: terms used on this page
The vocabulary of power-electronics thermal and EMI materials, defined as it is used on this page. Click a term to expand its definition.
Thermal interface material (TIM)
A conformable material between a heat source and a heat sink that displaces insulating air from the microscopic gap and carries heat across the joint. Judged by thermal impedance per ASTM D5470, not by thickness.
Thermal impedance
The temperature drop across an interface per unit of heat flux, reported at a stated pressure and thickness per ASTM D5470. It combines bulk resistance and the contact resistance at each face.
Gap filler / gap pad
A soft, thick, highly conformable TIM that bridges a large or uneven air gap at low assembly pressure, where a thin film cannot fill the space. Chosen when the gap, not the bondline, dominates the heat path.
EMI gasket
An electrically conductive elastomer or sponge in a housing seam that bonds two mating surfaces so the enclosure behaves as a continuous shield, closing the slot that would leak emissions.
Dielectric isolation
Electrical separation between a live part and a grounded heat sink while still allowing heat to cross. Boron nitride filled silicone provides it because boron nitride carries heat without carrying current.
Ingress protection (IP)
The rated ability of an enclosure to keep solids and water out, expressed as an IP code per IEC 60529. A compression seal helps hold the rating; the number belongs to the tested enclosure.
Contact resistance
The part of an interface's thermal resistance caused by imperfect surface contact, the air-filled valleys between two rough faces. It falls as mounting pressure and material wetting increase, often dominating a thin joint.
Boron nitride
A ceramic filler that is thermally conductive but electrically insulating. Loaded into silicone it raises a pad's thermal conductivity while keeping it dielectric, the basis for thermal pads that cool and isolate at once.
Shielding effectiveness
How much a shield attenuates an electromagnetic field, expressed in decibels and dependent on frequency. For a gasketed seam it depends on the gasket conductivity and the compression that maintains low-resistance contact.
CISPR 25
The standard giving limits and methods for conducted and radiated radio disturbance from vehicle components, widely applied to EV power electronics. Emissions are evaluated against it at the assembly level.
Last updated · Reviewed by H-O Products engineering (ISO 9001:2015 certified converter, Winsted, CT).
Standards, test methods & technical references
The standards and test methods referenced throughout this page, numbered for citation. Standard editions are current as of June 2026; verify against the publishing body before final spec. H-O materials are evaluated against and support compliance with these methods through the source manufacturer's technical data sheet, not independently certified by H-O unless explicitly stated on the quote. The references here are standards bodies and general engineering principles only.
ASTM D5470
Standard Test Method for Thermal Transmission Properties of Thermally Conductive Electrical Insulation Materials. The reference method for measuring the thermal impedance and apparent thermal conductivity of a thermal interface material at a stated pressure and thickness. ASTM International.
CISPR 25
Vehicles, boats and internal combustion engines – Radio disturbance characteristics – Limits and methods of measurement for the protection of on-board receivers. The standard widely applied to component-level conducted and radiated emissions for EV electronics. International Special Committee on Radio Interference (CISPR), IEC.
IEC 61000 series
Electromagnetic compatibility (EMC), multi-part. The framework of emission and immunity test methods an electronic assembly is evaluated against; a conductive gasket supports an assembly's compliance. International Electrotechnical Commission.
IEC 60529
Degrees of protection provided by enclosures (IP code). Defines the ingress-protection rating an enclosure is tested to against solids and water; an environmental seal helps a housing hold the rating. International Electrotechnical Commission.
Thermal-interface resistance theory
The standard treatment of interface thermal resistance as the sum of a bulk term (thickness over conductivity-area) and the contact resistance at each face, the latter falling with mounting pressure and surface wetting. The basis for the impedance-versus-pressure relationship used on this page. Presented as general engineering principle.
Updated . Standards editions current at publication; verify against the publishing body before final spec. H-O materials are “evaluated against” the test methods cited through the source manufacturer's technical data sheet; H-O does not independently certify materials against these standards unless explicitly stated on the quote.
To review your TIM, EMI or sealing part, send:
- Goal (thermal, EMI, or sealing)
- Heat to dissipate / allowable temperature rise
- Gap, flatness and clamp pressure
- Dielectric / working voltage need
- EMI frequency band and emissions limit
- Target IP rating (if sealing)
- Operating temperature and any flame class
- Part geometry or drawing
- Adhesive / liner requirements
- Prototype and annual volume
Get a power-electronics TIM / EMI material engineering quote
Send a drawing, BOM, or a description of the assembly, the heat path and the seam. We typically respond within one business day with a material-family recommendation, prototype lead time, and TDS verification against your heat flux, gap, dielectric need, temperature class, and environment.
Related H-O Products capabilities
The converting capabilities and adjacent application families that pair with power-electronics thermal and EMI work. Each page covers material selection and converter-side process detail for its area.
Capability
Precision die-cutting
Rotary and flatbed die-cutting, kiss-cutting, laser and waterjet cutting of the TIMs, gaskets, films and seals that make up power-electronics thermal and EMI parts, to your drawing and tolerance.
Read the page
Capability
Lamination & adhesive systems
Adhesive lamination, multi-layer stacks, and liner systems that turn a TIM, gasket or seal into a peel-and-place converted part for the line.
Read the page
Capability
Kitting & assembly
Sequenced, kitted and sub-assembled sets of thermal, EMI and sealing parts delivered ready to install, with revision control across a production program.
Read the page
Request a quote
Send a drawing for review
Upload a DXF, STEP, or PDF of the module, board or housing with the heat, gap, EMI band and environment, and engineering will confirm a material family, grade direction, and converting approach.
Open the RFQ form
Talk to an engineer
Contact H-O Products
Family-owned since 1971, ISO 9001:2015 certified, converting engineered materials in Winsted, Connecticut. Call or send a message and an engineer responds.
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Material data & standards. All material behavior described on this page – thermal impedance, dielectric strength, shielding effectiveness, temperature range and flame class – is taken from the source manufacturer's technical data sheets and the cited test methods. Grade-level values are thickness- and grade-specific; verify against the source TDS for your part, gauge, pressure and environment before final spec.
H-O materials are “evaluated against” and “support compliance with” the cited test methods through the source TDS; H-O does not independently certify materials against the standards unless explicitly stated on the quote.
Modeling & assembly-level performance. The interface material trade profile is ordinal and illustrative, a map of qualitative roles rather than a prediction of any bondline's performance; the impedance-versus-pressure relationship is described in prose on this page, and measured impedance comes from an ASTM D5470 test of the actual material.
Shielding effectiveness (CISPR 25 / IEC 61000) and ingress ratings (IEC 60529) are properties of a tested assembly, not of a raw material. H-O is a precision converter and does not extrude or mold raw material; parts are made-to-order to your drawing.