Missile, UAV & Weapons System Materials
H-O Products die-cuts and converts SOLIMIDE polyimide foam, PORON microcellular urethane, eGRAF graphite heat spreaders, thermal interface pads, aramid paper, and RF-transparent silicone gasketing into cushioning, insulation, thermal, and sealing parts for the electronics enclosures, airframe compartments, and ground support equipment of missile, UAV, and weapons-system programs, built to your drawing. H-O supplies converted materials and the source manufacturer's documentation; weapons-system design, integration, and qualification stay with your program.
Built for: UAV avionics and payload electronics thermal management, high-shock electronics cushioning and isolation, radome and antenna aperture sealing, and lightweight airframe-compartment insulation.
To specify converted materials for missile, UAV, or weapons-system hardware, start from the duty. For electronics that must survive shock, specify PORON 4701 / 4790 microcellular urethane, stepping to ShockSeal 4790-79 where energy absorption governs; programs commonly evaluate these parts against MIL-STD-810 derived requirements. The remaining zones and duties are mapped in the When-to-spec list on this page. Also converted for this application: aerogel blanket. Values are per the TDS on file; see the material reference below for ordering details.
MIL-STD-810 (environmental engineering considerations and laboratory test methods; cited by designation as the program-level context) · MIL-STD-461 (EMI control requirements, by designation) · MIL-DTL-83528 (conductive elastomer EMI gasket detail specification, by designation) · ASTM D3574 (flexible cellular foam test methods, on the PORON TDS) · ASTM D5470 (thermal impedance of thin thermally conductive solids, on the graphite and TIM TDS) · ASTM E595 (outgassing screening, reported on several PORON and SOLIMIDE TDS) · ASTM C518 (thermal transmission, on insulation TDS) · UL 94 (flammability classes as reported per grade TDS).
- High-shock electronics cushioning: PORON ShockSeal 4790-79
- Cushion + gasket in one part: PORON 4701 / 4790 series
- Spread heat from a hot chip: SpreaderShield graphite
- High-watt interface to a chassis: eGRAF HiTherm TIM / Sil-Pad insulating TIM
- RF-transparent radome gasket: BISCO silicone sponge / kSil V-0
- Fuel / fluid-exposed aperture seal: fluorosilicone sponge
- Lightweight compartment insulation: SOLIMIDE aerospace grades
- Dielectric barrier / wrap: Nomex aramid paper
- Hot-zone barrier: mica sheet / Pyrogel XTE
- Conductive EMI gasket instead: see the aerospace EMI shielding page
Where are you in the spec process?
This page serves hardware engineers who already know the material they want and engineers still working out the duty. Pick the path that matches where you are; you don't have to read the rest.
Send a drawing, get a quote
SOLIMIDE, PORON ShockSeal, eGRAF graphite, thermal pads, Nomex, RF-transparent silicone gasketing, or a custom die-cut configuration on your drawing.
Skip to the quote form →Walk through material selection
Six selection factors (shock duty, thermal path, RF transparency, weight, temperature band, documentation), a duty-combiner tool, and six material families with TDS-cited test methods.
Start with selection factors →
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1Send drawingUpload a DXF, STEP, or PDF, or describe the part and where it sits. A sample part works too.
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2Material reviewEngineering reviews the duty against the vendor TDS: shock and vibration exposure, thermal path, RF-transparency requirement, temperature band, weight budget, and the documentation your program requires.
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3PrototypeSamples typically ship in 3–5 business days for common die-cut configurations on materials we keep on hand. Made-to-order; MOQ varies by material and part.
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4ProductionStandard production runs ship about 2 weeks after drawing approval, including laminated stack-ups and kiss-cut-on-liner parts. Expedited service available. Ongoing parts run with material traceability and lot-code TDS records.
What does your part have to do?
Application Zones
Four distinct material problems hide inside missile, UAV, and weapons-system hardware: the avionics and payload bay, where dense electronics shed heat without fans; the shock path, where boards, batteries, and modules must ride out handling, transport, and operational shock; the radome and antenna aperture, where the seal must close the environment without attenuating the RF path; and the airframe compartment, where insulation buys thermal margin at the lowest possible weight.
The equipment-level environmental requirements come from your program, commonly derived from MIL-STD-810 method designations [1]; the materials below are what H-O converts to meet the drawing. Click a tab to see the duty, the controlling properties, and the material families for that zone.
UAV avionics & payload electronics thermal management
Small airframes concentrate computing, radios, and payload electronics into sealed bays with no fan and little spare mass, so the thermal design lives or dies on conduction: move the heat sideways out of the hot spot, then hand it to the chassis or skin.
Flexible graphite owns the first job: SpreaderShield natural-graphite sheet carries heat in-plane far faster than through-plane, flattening hot spots under processors and FPGAs, and eGRAF HiTherm grades serve as the compressible interface to the cold wall, with thermal impedance reported per ASTM D5470 on the TDS.
Where the interface must also isolate electrically, a reinforced silicone TIM (Sil-Pad class) or a boron-nitride-filled gap pad carries the watt load with dielectric data per ASTM D149. H-O die-cuts all of these to the board geometry, kiss-cut on liner for assembly. [5]
SpreaderShield Natural GraphiteIn-plane heat spreading under hot components. SKUs: SS400 · SS500 · SS600. Thin-gauge sheet per TDS designations.
eGRAF HiTherm Graphite TIMCompressible graphite interface to chassis and cold walls; the HT-C3200 TDS reports its conductivity class and a −40 to 400 °C service band. [9]
Sil-Pad Insulating TIMElectrically insulating thermal path for power devices to chassis, dielectric per ASTM D149 on the TDS; Gap-Pad class fillers take up tolerance stacks.
Secure / Protect TIM FilmsThin adhesive-format thermal films for bonded interfaces where a separate fastener is not available; per TDS on file. SKUs: Protect 1500FG · Secure 1500 KT2.
High-shock electronics cushioning & isolation
Boards, batteries, optics, and recorder modules in defense hardware see shock and vibration at every stage of life: handling, transport, captive carry, and the operational events the program defines. The material job is energy management at a controlled stiffness: a pad that is too hard transmits the pulse, one that is too soft bottoms out and transmits it anyway.
PORON microcellular urethane is the workhorse because its energy absorption and compression-set resistance are documented per grade: the 4701 series spans very soft through very firm, the 4790-92 slow-rebound grades absorb impact energy, and ShockSeal 4790-79 is the dedicated shock-pad grade.
Foam properties are tested per ASTM D3574 on the TDS; the E595 outgassing data matters for sealed optics: 4701-50, 4701-60 and AquaPro meet the screening limits per TDS, while 4701-30 and 4790-92 exceed them. Programs commonly evaluate the finished assembly against MIL-STD-810 method designations; that qualification belongs to the equipment test, not to the material claim. [4] [1]
PORON ShockSeal 4790-79The dedicated shock-pad grade: energy absorption with sealing function in one die-cut part; foam data per ASTM D3574 on the TDS. [8]
PORON 4701 / 4790 SeriesFirmness-graded cushioning and gasketing: 4701-30 very soft · 4701-50 firm · 4790-92 slow rebound. Pick firmness to the load, not the catalog.
Vinyl Nitrile FoamClosed-cell elastomeric cushioning for larger isolation pads and liner duty where a rubber-like foam fits the geometry; per TDS on file.
BISCO Silicone FoamCushioning that must also survive wide temperature swings: HT-870 soft and siblings, silicone chemistry with flammability data per grade TDS.Radome, antenna & RF aperture sealing
A radome or antenna window has one job the rest of the enclosure does not: pass RF. The perimeter gasket that seals it against rain, dust, and altitude therefore must be electrically non-conductive, a standard silicone or fluorosilicone, never a nickel-graphite or silver-filled EMI grade placed by habit, because a conductive ring around an aperture changes the electrical behavior of the very interface the radome exists to keep clean.
Closed-cell silicone sponge gives the low closure force thin composite radome walls need; fluorosilicone sponge adds fuel and fluid resistance for apertures near fueling points and exhaust washes; solid silicone serves bolted, higher-pressure joints. Where the adjacent electronics bay does need a conductive EMI gasket to meet MIL-DTL-83528 / MIL-STD-461 derived requirements, that is a deliberate, separate selection covered on the aerospace EMI shielding page.
BISCO Silicone Sponge (7xxx)Low-closure-force, RF-transparent perimeter seals: 7130 soft FR and siblings; compression data per ASTM D1056 class on the TDS.
kSil V-0 Silicone SpongeFlame-retardant silicone sponge for apertures where the program wants UL 94 V-0 documentation on the gasket: KSV001–KSV006 (UL 94 V-0, FAR 25 Appendix F and 1% compression set per TDS); kSil V-0 70 is the solid 70 A grade for bolted flanges. [7]Airframe-compartment & equipment-bay insulation
Between the skin and the electronics, insulation buys thermal margin: it slows solar soak on the ramp, evens out cold soak at altitude, and shields equipment bays from hot neighbors. The aerospace default is SOLIMIDE polyimide foam, an open-cell foam light enough to line large compartment areas at minimal mass penalty, with thermal and acoustic data per ASTM C518 / C423 and flammability behavior documented per grade on the TDS; its AC grades also report ASTM E595 outgassing screening.
Nomex aramid paper wraps harnesses and lines bays as a tough dielectric barrier. Beside genuinely hot zones, exhaust-adjacent structure, heater banks, high-watt power bricks, the inorganic ladder takes over: mica sheet and aerogel blankets (Pyrogel XTE for hot faces, ArmaGel HT class for industrial-format wraps) carry the band organics should not. [10] [6]
SOLIMIDE Aerospace GradesLightweight polyimide foam insulation: AC-530 · AC-550 · HT-340 · AC-550H; TA-301 is the 400 °F industrial / marine thermal-acoustic grade without a FAR 25.856 entry; densities and standards per grade TDS.
Nomex Aramid PaperTough dielectric barrier and wrap stock: 410 standard · 414 high-density; thermal class per the maker's designations. [11]
Pyrogel XTE AerogelHigh-temperature aerogel blanket for hot-face barriers: Pyrogel XTE; thermal data per ASTM C177 on the TDS.
Mica Barrier SheetInorganic, non-carbonizing barrier plates for the hottest compartment faces; muscovite and phlogopite forms per the maker's designations.Six decisions that drive your missile & UAV material spec
Material selection for defense hardware is not a single-property choice. The right part satisfies six independent constraints at once, and missing one produces hardware that passes its design review, ships fine, and fails in test when the cushion bottomed out, the aperture gasket attenuated the antenna, or the insulation outgassed onto a sealed optic.
Equipment qualification belongs to your program; material data belongs to the TDS. MIL-STD-810, MIL-STD-461, and their siblings test equipment, not sheet stock. Specify materials by the grade's documented properties, then qualify the assembly. H-O supplies the converted part and the source manufacturer's documentation; this page cites military standards by designation only.
Show all 6 selection factors tap to expand
Cushion (PORON, vinyl nitrile, silicone foam), conduct (graphite spreaders, TIM pads), seal-transparent (silicone and fluorosilicone sponge at RF apertures), and insulate (SOLIMIDE, aramid paper, mica, aerogel). The most common spec error on dense defense hardware is letting one material try to do two of these jobs because it happened to be in the bay already.
Read the six factors below in order. Each one constrains the others: the shock duty sets the foam class, the thermal path narrows the interface stack, the RF requirement vetoes conductive grades at apertures, and the weight budget arbitrates everything. Selecting one factor at a time and re-checking the others is the discipline.
Shock duty: match the foam's energy behavior to the event, not the brochure
A shock pad works by converting impact energy at a stiffness that keeps the transmitted load below what the board or battery tolerates. That makes two TDS behaviors decisive: compression-force-deflection (the load the pad carries at useful strains) and rebound character (slow-rebound grades like PORON 4790-92 absorb energy instead of bouncing it back). ShockSeal 4790-79 is the dedicated shock grade; the 4701 series covers firmness-graded cushioning and gasketing.
Size the pad so the working strain sits in the grade's documented range, with travel left before bottom-out; a bottomed pad transmits the pulse as if it were not there. State the fragility target and the available pad envelope on the drawing; foam properties are tested per ASTM D3574 and values are per the TDS on file. [4]
Thermal path: spread first, then interface, and keep dielectric needs explicit
Fanless bays reward a two-step thermal design: a graphite spreader flattens the hot spot (in-plane conduction is graphite's signature, far higher than through-plane, per the TDS), then a compliant interface hands the heat to the chassis. If the interface must also isolate electrically, say so on the drawing: a graphite path is conductive, so the insulating job belongs to a reinforced silicone TIM or boron-nitride-filled pad with dielectric data per ASTM D149.
Thermal impedance for thin interfaces is compared per ASTM D5470 on the TDS, at stated pressures; compare grades at the same pressure or the comparison is fiction. One interface, one job: conduction or isolation is a property; doing both is a documented grade selection, not an assumption. [5]
RF transparency: at apertures, conductive gasketing is a defect, not a feature
Around most of a defense enclosure, a conductive EMI gasket is exactly right, and the families that serve it carry MIL-DTL-83528 designations on their TDS. At the radome or antenna aperture the logic inverts: the gasket must be electrically non-conductive so the sealed joint stays RF-transparent. The failure is silent and common: a conductive grade gets reused at the aperture because it sealed well elsewhere, and the antenna's behavior shifts.
Write "non-conductive / RF-transparent" on the aperture gasket callout and pick from the silicone sponge, fluorosilicone sponge, and solid silicone families; route conductive needs to the EMI families deliberately, on the enclosure seams that want them. [3]
Weight: insulation and cushioning are bought in grams
On a UAV, every gram of converted material is a gram of payload or endurance given away. That is why SOLIMIDE polyimide foam owns large-area compartment insulation (its density classes are fractions of conventional elastomer foams, per grade TDS), why graphite spreaders displace metal plates for heat spreading, and why cushioning is die-cut as discrete pads at load points instead of blanket liners.
Give the weight budget to the converter: a kiss-cut pad set on liner, placed only where the loads are, routinely halves the converted mass of a naive full-footprint liner while doing the same mechanical work. Density and mass data come from each grade's TDS; the placement strategy comes from your drawing review.
Temperature band: organic cushioning has a ceiling; plan the hand-off
Urethane cushioning, silicone gasketing, and polyimide foam each carry their own service-band designations on the TDS, and dense defense hardware crosses bands within centimeters: a battery pad, a hot power brick, an exhaust-adjacent wall. The discipline is the same ladder used across H-O's aerospace pages: urethanes for ordinary bays, silicones where swings are wide, polyimide foam for light insulation, and the inorganic step, mica sheet, Pyrogel XTE aerogel, where faces run genuinely hot.
The eGRAF HT-C3200 TDS, for example, reports a −40 to 400 °C band for the graphite interface itself. Map the bay's hot faces on the drawing and let each layer carry its own documented band rather than stretching one material across all of them. [9]
Documentation: specify what the program will ask the file for
Defense hardware reviews ask for paper: flammability classes (UL 94 per grade TDS), outgassing screening for sealed optics and high-altitude bays (ASTM E595, reported on several PORON and SOLIMIDE grades), fluid compatibility for fuel-adjacent seals, and material traceability through production. The clean path is to specify grades whose TDS already carries the data lines the program will request, and to say at quote which records must travel with the parts.
H-O runs an ISO 9001:2015 certified quality management system and ships converted parts with material traceability and lot-code TDS records; program-specific compliance and documentation requirements are reviewed at quote, and equipment-level qualification stays with your test program. [6] [7]
Specification Tools
Two tools to take you from "I have a hardware material problem" to here's what to put on the drawing: a duty combiner that crosses your part's primary job with its environment and returns a material family, and a side-by-side comparison matrix of every family on this page.
1. Shock / thermal / RF duty combiner
Pick the part's primary duty and the environment it serves in. The combiner returns a starting material family with the reasoning and a link into the material reference. Directional only: confirm every value against the grade's TDS, and keep equipment-level qualification with your program.
PORON 4701 series, firmness-graded
For bench and GSE cushioning, a firmness-graded 4701 urethane pad set carries the everyday handling loads economically; step firmness to the load per the TDS.
2. Side-by-side: missile & UAV material comparison matrix
Every material family called out on this page, with duty, the key data lines its TDS carries, and the zone it fits. Click a column header to sort. Click any material name to jump to its accordion entry and full TDS reference.
| Material | Duty | Electrical character | Key data on TDS | Form factor | Best for | |
|---|---|---|---|---|---|---|
| Cushioning & shock management | ||||||
| PORON ShockSeal 4790-79Dedicated shock grade | Shock pad + seal | Insulating | ASTM D3574 foam data | High-shock electronics | ||
| PORON 4701 / 4790 SeriesFirmness-graded urethane | Cushion / gasket | Insulating | D3574; E595 on several grades | Boards, batteries, modules | ||
| BISCO Silicone Foam + Vinyl NitrileWide-band cushioning | Cushion / liner | Insulating | D1056 class; UL 94 per grade | Wide temperature swings | ||
| Thermal management | ||||||
| SpreaderShield GraphiteNatural graphite sheet | Heat spreading | Conductive | D5470; in-plane k per TDS | Hot-spot flattening | ||
| eGRAF HiTherm TIMCompressible graphite | Thermal interface | Conductive | D5470; −40 to 400 °C band (HT-C3200 TDS) | Chassis interfaces | ||
| Sil-Pad / Gap-Pad / TIM FilmsInsulating TIM class | Thermal interface | Insulating | D5470; D149 dielectric | Power device isolation | ||
| RF-transparent aperture sealing | ||||||
| BISCO / kSil Silicone SpongeClosed-cell sponge | Aperture seal | Non-conductive | D1056 class; UL 94 V-0 (kSil) | Radome perimeters | ||
| Fluorosilicone Sponge + Solid SiliconeFluid-resistant seals | Aperture seal | Non-conductive | Fluid resistance per TDS | Fuel-adjacent apertures | ||
| Insulation & barriers | ||||||
| SOLIMIDE Polyimide FoamAC / HT / TA grades | Light insulation | Insulating | C518 thermal; E595; FAR 25.856(a) on AC and HT-340 grades | Compartment lining | ||
| Nomex Aramid Paper410 / 411 / 414 | Dielectric barrier | Insulating | Maker thermal class; D149 | Harness & bay barriers | ||
| Mica + Pyrogel XTE AerogelInorganic hot-zone band | Hot-face barrier | Insulating | C177 thermal; inorganic | Exhaust-adjacent faces | ||
Skip ahead and request your engineering review now
If your drawing already calls out a SOLIMIDE, PORON, eGRAF, Sil-Pad, Nomex, or silicone-sponge grade, send it over for engineering review.
Hardware material failures you can prevent at spec
Material failures on defense hardware rarely show at assembly. The unit builds clean, passes bench checks, and ships. Then a qualification run finds a board that moved, a thermal survey finds a hot spot the spreader never reached, or a range data review finds the antenna behaving differently with the new gasket installed. Five patterns cover most of what fails in this hardware class, and each is a specification decision made before the line runs, not a defect on the part.
A material that is wrong for its duty fails in test, at the worst possible time. Bottomed-out cushions, mismatched interfaces, and habit-specified gaskets surface during qualification, when schedule is shortest. The fix is at spec, where duty, environment, and TDS data are matched.
Show all 5 failure modes tap to expand
1. The shock pad bottomed out before the event ended
A cushion that looked generous on the drawing compresses solid partway through the shock pulse, and from that instant the electronics ride metal-to-metal. The error is sizing by thickness instead of by strain: every foam grade carries a working-strain range in which it absorbs energy, documented through its compression-force-deflection data per ASTM D3574, and beyond it the pad is effectively rigid.
The fix: size the pad area and thickness so the expected load lands inside the grade's documented working range with travel to spare; use slow-rebound grades (PORON 4790-92, ShockSeal 4790-79) where energy absorption governs; and re-check the strain math whenever mass or envelope changes, because a heavier module on the same pad moves the operating point. Values per the TDS on file.
2. A conductive gasket crept onto the radome flange
The enclosure team standardized on a conductive EMI gasket for the electronics bay, and during a build it migrated to the antenna aperture because it was on hand and sealed beautifully. The aperture now has a conductive ring where the design assumed a transparent one, and the antenna's behavior shifts in ways that surface at range time, not at assembly.
The fix: write the electrical character into both callouts: "conductive, MIL-DTL-83528 designation per TDS" on enclosure seams that need shielding; "non-conductive / RF-transparent" on the aperture gasket, drawn from the silicone sponge, fluorosilicone sponge, or solid silicone families. Two part numbers, two bins, no substitutions without engineering sign-off. [3]
3. The graphite spreader was asked to insulate
A graphite sheet went under a power device to "manage heat," and the first power-up found the device shorted to chassis: graphite conducts electricity as enthusiastically as it conducts heat. The reverse error also ships: an insulating silicone pad chosen for a job that needed raw conduction, leaving the chip throttling. The fix: declare the electrical requirement of every thermal interface on the drawing.
Conduction-only paths go to graphite (SpreaderShield, HiTherm); isolation paths go to reinforced silicone TIMs (Sil-Pad class) or boron-nitride pads with dielectric data per ASTM D149; and combined stacks are built as laminations where each layer carries its own documented property. Compare candidates per ASTM D5470 at the same pressure. [5]
4. Compartment insulation outgassed onto sealed optics
A bay lined with a generic foam performs perfectly in thermal test, then a sealed camera develops a film on its window after weeks at altitude cycling. Organic materials outgas, and in a closed bay the condensables find the coldest optical surface. The screening data exists precisely for this: ASTM E595 total-mass-loss and condensables screening, reported on the PORON TDS (4701-50, 4701-60 and AquaPro within limits; 4701-30 and 4790-92 exceed them) and on the SOLIMIDE AC-series TDS.
The fix: for bays sharing volume with optics, seekers' windows, or sensor apertures, specify grades whose TDS reports E595 screening, keep the values with the order file, and route the truly vacuum-exposed cases to the dedicated spacecraft & launch vehicle materials page. [6]
5. One material was stretched across two temperature bands
The same urethane that cushions the avionics stack gets specified against the wall the exhaust duct warms, because it was already in the BOM. Months later the hot-face pads are embrittled and crumbling while the cool-bay pads are fine.
Organic cushioning ages fast above its documented band even when nothing ever burns. The fix: map the bay's hot faces and let the ladder do its work: urethanes in ordinary bays, silicone foam where swings are wide, SOLIMIDE for light insulation duty, and the inorganic step, mica sheet, Pyrogel XTE aerogel blanket, on faces that run genuinely hot.
Each grade's band is the maker's designation on its TDS; say on the drawing whether exposure is continuous or event-only. [10]
Material reference
Detailed reference for the six material families on this page: the PORON urethanes including ShockSeal that own cushioning and shock duty; the graphite thermal family (SpreaderShield, HiTherm) that spreads and interfaces heat; the insulating TIM class (Sil-Pad, Gap-Pad, Secure / Protect films); the RF-transparent sealing silicones (BISCO and kSil sponge, fluorosilicone, solid silicone); the SOLIMIDE polyimide foams for lightweight insulation; and the aramid / inorganic barrier set (Nomex paper, mica, Pyrogel XTE).
Foam data per ASTM D3574 / D1056, thermal impedance per ASTM D5470, dielectric per ASTM D149, outgassing screening per ASTM E595, flammability per UL 94, all as reported on each grade's TDS. H-O die-cuts and converts to drawing in low and high volume; values are per the TDS on file, not headline numbers.
PORON Microcellular Urethane (4701 / 4790 Series, ShockSeal 4790-79)Cushioning, shock pads & gasketing · ASTM D3574 foam data per TDS · E595 screening on several grades

Size shock pads by working strain from the grade's CFD data, not by thickness; slow-rebound grades absorb event energy, firm grades carry static preload. Values per the TDS on file. [8]
eGRAF Graphite: SpreaderShield Sheet & HiTherm TIMIn-plane heat spreading & conductive interfaces · ASTM D5470 per TDS · HT-C3200 band −40 to 400 °C

Graphite is electrically conductive: where the interface must isolate, pair it with or substitute an insulating TIM. Values per the TDS on file. [9]
Insulating Thermal Interface Pads & Films (Sil-Pad, Gap-Pad, Secure / Protect)Heat transfer with dielectric isolation · ASTM D5470 + D149 per TDS

Compare grades per ASTM D5470 at the same pressure, and keep the dielectric requirement explicit on the drawing. Values per the TDS on file.
RF-Transparent Sealing Silicones (BISCO / kSil Sponge, Fluorosilicone, Solid Silicone)Non-conductive aperture & enclosure seals · D1056 class per TDS · kSil V-0 carries UL 94 V-0

Keep this family's callouts marked "non-conductive / RF-transparent" so conductive EMI grades cannot substitute in by habit. Values per the TDS on file. [7]
SOLIMIDE Polyimide Foam (AC-530 / AC-550 / HT-340 / TA-301)Lightweight compartment insulation · C518 thermal + E595 screening on AC grades per TDS

For vacuum-exposed spacecraft duty, the dedicated page covers E595 framing in depth; here the AC grades' screening data serves sealed-bay and optics-adjacent work. Values per the TDS on file. [10]
Aramid & Inorganic Barriers (Nomex Paper, Mica Sheet, Pyrogel XTE)Dielectric wraps & hot-zone barriers · maker thermal classes per TDS

Use the inorganic step only where the band demands it; it costs more and converts harder than the organics below it. Values per the TDS on file. [11]
Nitrile (NBR) & Vinyl-Nitrile FoamOil/fuel sealing & isolation · good properties to ~10⁷ rad · to drawing

Where the dose or the fuel exposure is higher, step to fluorosilicone (below) for the chemistry or EPDM for the dose retention. The TDS on file governs for the selected grade; dose figures are degradation thresholds.
AeroZero® Polyimide-Aerogel Film & Laminates (Blueshift)Thin transient heat barriers for weight-critical bays · film, faced films & laminates
- AZ-TPS 100 · AZ-TPS 101 single- and double-sided silicone-PSA aerogel film, 190–216 µm, UL 94 VTM-0
- AZ-TPS 102 / 103 / 104 low-outgassing acrylic-adhesive configurations, ASTM E595 TML <1% / CVCM <0.1% — the acrylic system carries a lower temperature ceiling than silicone grades, verify on the TDS
- AZ-TPS GR 100 · DualZero TPS GR 201 · QuadZero TPS GR 400 graphite-faced constructions — spread heat along the face while insulating through the thickness (UL 94 VTM-0 film; laminate ratings per the TDS on file)
- AZ-TPS VDA PI 100 vapor-deposited-aluminum reflective face, 240 µm, UL 94 VTM-0 — turns back radiant load (IR reflectivity 0.94 per manufacturer data)
- TripleZero TPS 300 three-layer aerogel laminate, 570 µm, UL 94 V-0 — passes the FAR 25 Appendix F 12-second vertical burn per manufacturer data
Missile & UAV hardware materials: engineer-grade FAQ
Twelve of the questions we hear most from defense hardware engineers, UAV integrators, and program purchasing. If your question isn't here, send a drawing or call, engineering picks up.
What materials cushion electronics in high-shock defense environments?
Microcellular urethane is the workhorse: PORON ShockSeal 4790-79 is the dedicated shock-pad grade, the 4790-92 slow-rebound grades absorb impact energy rather than bouncing it back, and the 4701 series covers firmness-graded cushioning and gasketing. Closed-cell vinyl nitrile and BISCO silicone foams serve larger liners and wide-temperature duty. The selection logic is energy management at controlled stiffness: size the pad so its working strain sits inside the grade's documented compression-force-deflection range with travel to spare.
Foam properties are tested per ASTM D3574; values are per the TDS on file. Programs commonly evaluate the finished assembly against MIL-STD-810 derived requirements, and that qualification belongs to the equipment test, not the material claim. [4]
How do UAV avionics shed heat without a fan?
By conduction, in two steps. First a flexible graphite spreader (SpreaderShield class) flattens the hot spot: graphite's in-plane conductivity far exceeds its through-plane value, so heat moves sideways out of the die footprint into a larger area. Then a compliant interface hands the heat to the chassis or skin: a compressible graphite TIM (eGRAF HiTherm) where electrical conduction is acceptable, or an insulating silicone TIM (Sil-Pad class, Gap-Pad class fillers) where the path must also isolate.
Thermal impedance is compared per ASTM D5470 on the TDS at stated pressures. H-O die-cuts the whole stack to the board geometry, kiss-cut on liner for assembly. [5]
What is a radome gasket, and which materials stay RF-transparent?
A radome gasket seals the perimeter of an RF-transparent window, radar aperture, antenna fairing, sensor dome, against rain, dust, and altitude, without changing the electrical behavior of the aperture. That requires an electrically non-conductive material: closed-cell BISCO silicone sponge for low closure force on thin composite walls, kSil V-0 where the program wants UL 94 V-0 documentation on the gasket, fluorosilicone sponge where fuel or fluids wash the joint, and solid silicone for bolted flanges.
A conductive EMI gasket in this location is a specification error: it puts a conductive ring around the aperture. Conductive shielding selection lives on the aerospace EMI shielding page. [7]
Which insulation suits missile-body and UAV equipment compartments?
SOLIMIDE polyimide foam is the aerospace default for large-area, weight-critical compartment insulation: its density classes are a fraction of conventional elastomer foams (per grade TDS), with thermal data per ASTM C518, acoustic data per ASTM C423, and ASTM E595 outgassing screening on the AC-series TDS. Nomex aramid paper adds a tough dielectric wrap for harnesses and bay walls.
Beside genuinely hot faces, exhaust-adjacent structure, heater banks, the inorganic step takes over: mica sheet and Pyrogel XTE aerogel blanket. Say on the drawing whether the exposure is continuous or event-only; the answer changes the family. [10]
PORON ShockSeal vs standard PORON: when do I specify each?
Specify ShockSeal 4790-79 when the pad's primary job is the shock event: it is the dedicated shock grade, combining energy absorption with a sealing function in one die-cut part, with foam data per ASTM D3574 on its TDS. Specify the 4701 series when the job is everyday cushioning, vibration damping, or gasketing at a chosen firmness: 4701-30 very soft through 4701-60 very firm, picked so the working strain lands in the grade's documented range.
The 4790-92 extra-soft slow-rebound grades sit between: impact energy absorption where envelope is generous. The wrong move is treating thickness as the design variable; the grade's compression-force-deflection curve is. [8]
Do these materials carry MIL-STD-810 ratings?
No, and no sheet material does. MIL-STD-810 is an environmental engineering and laboratory test-method standard applied to equipment by a program: the program derives its tailored test profiles, runs them on the assembled unit, and the qualification belongs to that unit. Materials support the result but are not themselves '810 rated.' The honest material story is the TDS: foam data per ASTM D3574, thermal impedance per ASTM D5470, outgassing screening per ASTM E595, flammability per UL 94, each reported per grade.
H-O's pages cite military standards by designation only and frame materials as commonly evaluated to program-derived requirements. [1]
Can H-O also supply conductive EMI shielding for these enclosures?
Yes. Conductive elastomer EMI gaskets, including families whose TDS carry MIL-DTL-83528 designations and QPL listings, conductive fabric-over-foam, and foil tapes are covered in depth on the dedicated EMI shielding gaskets for aerospace & defense page, with MIL-STD-461 derived requirements framed by designation.
The reason this page separates them is practical: on RF-aperture hardware the conductive and non-conductive gasket families must never substitute for one another, so the two selections are documented on two pages with two callout vocabularies.
Where one enclosure needs both, engineering reviews the pair at quote so each seam carries the right part number. [3]
What about outgassing for sealed optics or high-altitude bays?
Specify grades whose TDS reports ASTM E595 screening, the total-mass-loss and collected-volatile-condensables test developed for space hardware and widely used wherever condensable films threaten optics. On this page's families, E595 data on the PORON TDS shows 4701-50, 4701-60 and AquaPro within the TML <1% / CVCM <0.1% screening limits, while 4701-30 and the 4790-92 slow-rebound grades exceed them; SOLIMIDE AC-series and PMD foams report TML <1.0% / CVCM <0.1%.
Keep the reported values with the order file rather than quoting them from memory, and treat truly vacuum-exposed duty as its own problem: the spacecraft & launch vehicle materials page covers that framing in depth. [6]
How thin can graphite heat spreaders be die-cut?
Thin enough that the limit is usually handling, not cutting: the SpreaderShield and HiTherm lines include gauges down to fractions of a millimeter per their TDS designations, and H-O die-cuts them to board-level geometries with webs, tabs, and adhesive backings as the drawing requires.
Two practical notes from the converting side: first, thin graphite is delicate in free sheet, so kiss-cut-on-liner formats protect the part through assembly; second, graphite is electrically conductive, so cut-outs and clearances around exposed conductors must be designed in, not assumed.
Thermal impedance per ASTM D5470 and gauge designations are per the TDS on file. [9]
What quality documentation does H-O provide for defense programs?
H-O operates an ISO 9001:2015 certified quality management system and ships converted parts with material traceability, lot-code TDS records, and certificates of conformance to the purchase-order requirements. Source manufacturers' TDS and compliance statements (UL 94 listings, ASTM test reports, REACH / RoHS statements where published) travel with the material.
H-O does not claim equipment qualifications, flight certifications, or registrations it does not hold; program-specific compliance, documentation, and handling requirements should be raised at quote so engineering can confirm scope before the order is placed.
Does H-O design missile or weapons-system components?
No. H-O is a precision converter: we die-cut, kiss-cut, slit, and laminate engineered sheet materials, foams, films, papers, elastomers, graphite, into parts built to your drawing. We advise on material selection at the level this page covers (cushioning, thermal, sealing, insulation properties and their TDS documentation), and we stay out of weapons-system design, integration, and performance entirely.
That boundary keeps the engagement clean: you own the design and its qualification; we own dimensional conformance, material traceability, and converting quality on the parts we ship.
What information does H-O need to quote a missile or UAV hardware part?
The drawing (DXF, STEP, or PDF) or a sample part, plus the duty context: cushion, thermal, aperture-seal, or insulation role; the environment (bench, transport, high-shock, hot-adjacent); any electrical requirement (insulating vs conductive); the weight budget if it is tight; and the documentation lines your program will request (UL 94 class, E595 screening, traceability records). Every part is made to order; sample and production lead times are listed in the process strip above and confirmed with your quote through the form below.
Can one converted part combine cushioning, sealing, and a thermal path?
Often, yes, as a lamination rather than a single material. H-O builds multi-layer die-cut assemblies where each layer carries its own documented property: a PORON cushion bonded to a graphite spreader, an inorganic hot-face (mica, ManniGlas) backed by silicone foam, or a gasket with an integral stiffener and pull tab. The discipline is that every layer keeps its own TDS story, so the part's documentation stays auditable.
What a lamination cannot do is make one chemistry do another's job: an insulator does not become conductive, and a hot-face rating does not transfer to the backer. Send the stack-up intent and engineering will propose the lamination and its records.
Glossary: terms used on this page
Quick reference for the shock, thermal, and RF-interface terminology used throughout. Each entry links to the relevant standard or test method where applicable.
Shock isolation vs damping
Isolation lowers the transmitted load of a discrete event by letting a compliant element deflect; damping dissipates oscillation energy over cycles. A shock pad does the first job and is sized by working strain; vibration control leans on the second. Slow-rebound foam grades blend both by absorbing event energy instead of returning it.
Compression force deflection (CFD)
The load a cellular material carries at a stated compression strain, the central design number for cushions and gaskets, reported on foam TDS per ASTM D3574 methods. Pads are sized so the expected load lands inside the grade's documented strain range with travel left before bottom-out. [4]
Bottoming out
The state where a cushion has compressed to near-solid density and stops absorbing energy; transmitted load then rises almost as if the pad were absent. The most common shock-pad failure, and a sizing error rather than a material defect: the working strain was set past the grade's useful range.
Thermal interface material (TIM)
The compliant layer that closes the microscopic air gaps between a heat source and its sink. Compared by thermal impedance per ASTM D5470 at stated pressures. Conductive TIMs (graphite) and insulating TIMs (reinforced silicone, boron-nitride-filled) are different selections; the electrical requirement must be explicit. [5]
In-plane vs through-plane conductivity
Flexible graphite conducts heat far better along the sheet (in-plane) than through its thickness, per its TDS values. That anisotropy is the design feature: a thin sheet moves heat sideways out of a hot spot into a larger footprint, which is exactly the job in a fanless avionics bay.
Radome / RF-transparent aperture
A structural window that protects an antenna or sensor while passing RF energy. Everything in the aperture's build, wall, paint, and the perimeter gasket, is chosen to avoid attenuating or detuning it, which is why the gasket must be electrically non-conductive.
MIL-STD-810 (by designation)
The military environmental engineering standard whose laboratory test methods programs tailor to their own equipment profiles. Cited on this page by designation only: it qualifies equipment, not sheet materials, so material claims stay with the TDS and assembly claims stay with your test program. [1]
MIL-DTL-83528 (by designation)
The detail specification for conductive elastomer EMI gasket material whose type designations appear on conductive-gasket TDSs. Referenced here only as the marker of the conductive family this page's aperture seals must NOT be confused with; the selection itself lives on the aerospace EMI shielding page. [3]
Outgassing screening (ASTM E595)
The screening test reporting total mass loss and collected volatile condensable materials for a sample in vacuum at elevated temperature. Reported on several PORON and SOLIMIDE grade TDSs; the data line to request whenever a foam shares a sealed bay with optics. [6]
Polyimide foam
An open-cell foam made from polyimide polymer (SOLIMIDE grades here): very low density, broad temperature tolerance, and the fire and outgassing documentation aerospace programs ask of compartment insulation, per each grade's TDS. The default when insulation is bought in grams. [10]
Last updated · Reviewed by H-O Products engineering (ISO 9001:2015 certified converter, Winsted, CT).
Standards, test methods & technical references
The standards, test methods, and vendor technical data sheets cited throughout this page. Standards editions current as of June 2026; verify against the publishing body before final spec. Military standards are cited by designation only. H-O converts materials that are tested to these methods on the source manufacturer's TDS; H-O does not independently certify materials unless explicitly stated on the quote.
MIL-STD-810
Environmental Engineering Considerations and Laboratory Tests. The military standard whose tailored methods programs apply to equipment qualification; cited here by designation as program-level context, never as a material rating. quicksearch.dla.mil
MIL-STD-461
Requirements for the Control of Electromagnetic Interference Characteristics of Subsystems and Equipment. Cited by designation as the EMI-requirements context defense enclosures are designed against; gasket-level selection lives on the aerospace EMI shielding page. quicksearch.dla.mil
MIL-DTL-83528
Gasketing Material, Conductive, Shielding Gasket, Electronic, Elastomer, EMI/RFI. The detail specification whose type designations appear on conductive elastomer TDSs; referenced on this page only to mark the conductive family that must not substitute at RF apertures. quicksearch.dla.mil
ASTM D3574
Standard Test Methods for Flexible Cellular Materials, Slab, Bonded, and Molded Urethane Foams. The method family behind the compression-force-deflection, density, and compression-set values on the PORON TDSs. astm.org/d3574
ASTM D5470
Standard Test Method for Thermal Transmission Properties of Thermally Conductive Electrical Insulation Materials. The thin-interface thermal impedance method behind the graphite and TIM comparisons on this page; compare grades at the same pressure. astm.org/d5470
ASTM E595
Standard Test Method for Total Mass Loss and Collected Volatile Condensable Materials from Outgassing in a Vacuum Environment. The screening behind the outgassing data lines on several PORON grades and the SOLIMIDE AC-series TDS. astm.org/e595
UL 94
Standard for Tests for Flammability of Plastic Materials for Parts in Devices and Appliances. The source of the V-0 classes quoted from the kSil, SOLIMIDE HT-340, and PORON 4701-40V0 TDSs on this page; the class belongs to the tested grade. shopulstandards.com (UL 94)
ASTM C518
Standard Test Method for Steady-State Thermal Transmission Properties by Means of the Heat Flow Meter Apparatus. The thermal-transmission method cited on the SOLIMIDE insulation TDSs. astm.org/c518
Rogers Corporation · PORON industrial TDS series
Technical data sheets for the PORON 4701 / 4790 lines including ShockSeal 4790-79 and the 4790-92 slow-rebound grades: the source of the CFD, compression-set, density, E595 screening, and UL 94 listings referenced for those grades. rogerscorp.com
NeoGraf Solutions · eGRAF TDS series
Technical data sheets for the SpreaderShield natural-graphite heat spreaders and HiTherm graphite interface line: the source of the in-plane conductivity classes, ASTM D5470 impedance data, and the HT-C3200 service band referenced on this page. neograf.com
SOLIMIDE polyimide foam TDS series
Technical data sheets for the SOLIMIDE AC-530, AC-550, AC-550H, HT-340, and TA-301 grades: the source of the density classes, ASTM C518 / C423 thermal-acoustic data, ASTM E595 screening, and the FAR 25.856 / ASTM E662 fire-behavior citations referenced for those grades. Supplied with the converted material on request.
DuPont · Nomex paper TDS series
Technical data sheets for Nomex 410, 411, and 414 aramid papers: the source of the thermal-class designations and dielectric data referenced for harness wraps and bay barriers. dupont.com (Nomex paper)
Henkel · Bergquist Sil-Pad / Gap-Pad TDS series
Technical data sheets for the reinforced insulator pads and gap-filler lines referenced for insulating thermal interfaces: ASTM D5470 impedance and D149 dielectric data per grade. henkel-adhesives.com
Updated . Standards editions and links current at publication; verify against the publishing body before final spec. Military standards cited by designation only. H-O converts materials tested to the methods cited; lot-specific documentation available on request.
Get a missile & UAV hardware materials quote
Send a drawing, BOM, or spec sheet. We typically respond within one business day with a material-family recommendation, prototype lead time, and TDS verification against your shock, thermal, RF-transparency, and documentation requirements.
See also: related H-O application pages
Engineering content for the adjacent product and application categories. Each page covers material selection, failure modes, and converter-side process detail for its application family.
Industry hub
Aerospace, defense & space converting
The full seventeen-application map for airframe, defense, and space hardware: insulation, shielding, sealing, thermal, and assembly materials in one place.
Read the page
Sub-application
EMI shielding gaskets for aerospace & defense
The conductive counterpart to this page's RF-transparent seals: MIL-DTL-83528 designation families, conductive sponge, and foil tapes.
Read the page
Sub-application
Aircraft vibration, NVH & shock isolation
The aircraft-side treatment of the same energy-management problem: avionics racks, LRU isolation, and equipment mounts.
Read the page
Sub-application
Avionics thermal management & interface materials
Deeper coverage of the graphite, gap-pad, and thermal-isolation families this page's UAV zone draws from.
Read the page
Sub-application
Spacecraft & launch vehicle materials
Where the outgassing framing goes all the way: ASTM E595 documentation discipline for vacuum-exposed hardware.
Read the page
Sub-application
Defense electronics, ground vehicle & naval
The same ruggedization vocabulary applied to C4ISR enclosures, ground vehicles, and shipboard systems.
Read the page
Material data & standards. All material properties and test methods on this page are taken from the source manufacturer's technical data sheets and the cited standards. This page frames performance qualitatively, references test methods (ASTM D3574, D5470, D149, E595, C518, UL 94) rather than quoting numbers that vary by grade and conditions, and cites military standards (MIL-STD-810, MIL-STD-461, MIL-DTL-83528) by designation only.
Equipment-level qualification belongs to your program's testing; H-O does not certify assemblies, does not hold or claim equipment qualifications, and does not independently certify materials against the standards unless explicitly stated on the quote. No weapons-system design or performance information appears on this page. Verify against the vendor TDS and your own qualification testing for your specific hardware.
Conversion scope. H-O die-cuts, kiss-cuts, slits, and laminates sheet stock to drawing in Winsted, Connecticut: cushioning pad sets on liner, graphite spreaders and TIM stacks, RF-transparent gasket frames, and insulation lay-ins, with material traceability and lot-code TDS records. H-O does not mold elastomers or press laminates in-house; molded components are coordinated through a partner network. Lead-time and MOQ details are on the process strip and in the quote form above.