PEEK Film (APTIV® — Victrex)
PEEK film is the material of choice when slot liners, PCB interlayer insulation, or phase separators demand dielectric performance, chemical resistance, and mechanical strength that polyimide film cannot provide at the required thickness and stiffness. Its polyether ether ketone chemistry delivers a continuous service temperature to 260°C, exceptional dielectric strength, and resistance to hydrolysis, fuels, and aggressive solvents in a thin, dimensionally stable film. H-O Products carries APTIV® PEEK film across the standard 1000/2000 series and the extreme-performance XPI series, and converts them to customer specification.
APTIV™ 1000
APTIV™ 1000 is an unfilled, semi-crystalline film manufactured from VICTREX™ PEEK polymer, available in thicknesses from 8 to 750 µm. It delivers outstanding high-temperature capability combined with excellent mechanical strength, electrical insulation, and long-term durability. The film exhibits strong resistance to radiation, hydrolysis, and aggressive chemicals, and provides inherent flame resistance without added flame retardants.
Key Properties
- Tensile Stress, MD: Break, 23°C, 25 µm: 140 MPa (ISO 527-3)
- Tensile Elongation, MD: Break, 23°C, 25 µm: >150 % (ISO 527-3)
- Dielectric Strength @ 0.25 inch electrode, 23°C, 50 µm: 190 kV/mm (ASTM D149)
- Dielectric Constant (23°C, 50.0 µm, 10 MHz): 3.5 (ASTM D150)
- Film Thickness — Recommended/Available: 8 to 750 µm
- Density (23°C): 1.30 g/cm³ (ISO 1183)
APTIV™ 1102
APTIV™ 1102 is a mineral-filled, semi-crystalline film manufactured from VICTREX™ PEEK polymer, available in thicknesses from 12 to 125 µm with a density of 1.45 g/cm³. It delivers high mechanical strength and excellent electrical insulation, with tensile modulus values up to 5000 MPa (MD, 25 µm) and dielectric strength of 200 kV/mm at 50 µm. Compared to the APTIV™ 1000 Series, APTIV™ 1102 offers a higher modulus and a lower coefficient of linear thermal expansion.
Key Properties
- Tensile Stress, MD: Break, 23°C, 25 µm: 100 MPa (ISO 527-3)
- Tensile Elongation, MD: Break, 23°C, 25 µm: >100 % (ISO 527-3)
- Dielectric Strength @ 0.25 inch electrode (23°C, 50.0 µm): 200 kV/mm (ASTM D149)
- Dielectric Constant (23°C, 50.0 µm, 10 MHz): 3.6 (ASTM D150)
- Film Thickness — Recommended/Available: 12 to 125 µm
- Density (23°C): 1.45 g/cm³ (ISO 1183)
APTIV™ 1103
APTIV™ 1103 is a mineral-filled, semi-crystalline film produced from VICTREX™ PEEK polymer, available in thicknesses from 12 to 125 µm with a density of 1.54 g/cm³ — the highest density in the APTIV™ 1100 Series. It provides tensile modulus values up to 5500 MPa (MD, 25 µm and 50 µm) and dielectric strength of 200 kV/mm at 50 µm, with thermal conductivity of 0.61 W/m·K through-plane and 1.3 W/m·K in-plane. Compared to the APTIV™ 1000 Series, APTIV™ 1103 delivers a higher modulus and a lower coefficient of linear thermal expansion.
Key Properties
- Tensile Stress, MD: Break, 23°C, 50 µm: 90.0 MPa (ISO 527-3)
- Tensile Elongation, MD: Break, 23°C, 25 µm: >10 % (ISO 527-3)
- Dielectric Strength @ 0.25 inch electrode (23°C, 50.0 µm): 200 kV/mm (ASTM D149)
- Dielectric Constant (23°C, 50.0 µm, 10 MHz): 3.5 (ASTM D150)
- Film Thickness — Recommended/Available: 12 to 125 µm
- Density (23°C): 1.54 g/cm³ (ISO 1183)
APTIV™ 1300
APTIV™ 1300 is a black, unfilled, semi-crystalline film manufactured from VICTREX™ PEEK polymer, available in thicknesses from 50 to 100 µm with a density of 1.30 g/cm³. It delivers high tensile elongation exceeding 150% in both MD and TD directions across all listed gauges, with tensile stress at break up to 120 MPa (MD). The film provides an alternative to the natural-colored APTIV™ 1000 Series where a black film is required.
Key Properties
- Tensile Stress, MD: Break, 23°C, 50 µm: 120 MPa (ISO 527-3)
- Tensile Elongation, MD: Break, 23°C, 50 µm: >150 % (ISO 527-3)
- Dielectric Strength @ 0.25 inch electrode (23°C, 50.0 µm): 190 kV/mm (ASTM D149)
- Volume Resistivity @ 100 V (23°C, 50.0 µm): 4.0E+16 ohms•cm (ASTM D257)
- Film Thickness — Recommended/Available: 50 to 100 µm
- Density (23°C): 1.30 g/cm³ (ISO 1183)
APTIV™ 2000
APTIV™ 2000 is an unfilled, amorphous film manufactured from VICTREX™ PEEK polymer, available in thicknesses from 6 to 300 µm with a density of 1.26 g/cm³. It delivers tensile elongation exceeding 200% in all directions across all listed gauges, with tensile stress at break up to 130 MPa (MD/TD at 25 µm) and a dielectric strength of up to 270 kV/mm at 25 µm. This film will crystallize irreversibly if exposed to temperatures above its glass transition temperature of approximately 143°C (289°F).
Key Properties
- Tensile Stress, MD: 23°C, 25 µm: 130 MPa (ISO 527-3)
- Tensile Elongation, MD: Break, 23°C, 25 µm: >200 % (ISO 527-3)
- Dielectric Strength @ 0.25 inch electrode, 23°C, 25 µm: 270 kV/mm (ASTM D149)
- Dielectric Constant (23°C, 50.0 µm, 10 MHz): 3.3 (ASTM D150)
- Film Thickness — Recommended/Available: 6 to 300 µm
- Density (23°C): 1.26 g/cm³ (ISO 1183)
APTIV™ 2100
APTIV™ 2100 is a mineral-filled, amorphous film manufactured from VICTREX™ PEEK polymer, available in thicknesses of 100 to 125 µm with a density of 1.42 g/cm³. It delivers tensile modulus values up to 3500 MPa (MD, 100 µm) — higher than the unfilled APTIV™ 2000 Series — and is specifically tailored for thermoforming thin-wall components requiring increased stiffness, such as speaker diaphragms. Like all amorphous PEEK grades, APTIV™ 2100 will irreversibly crystallize if exposed to temperatures above its glass transition temperature of approximately 143°C (289°F).
Key Properties
- Tensile Stress, MD: 23°C, 100 µm: 100 MPa (ISO 527-3)
- Tensile Elongation, MD: Break, 23°C, 100 µm: >150 % (ISO 527-3)
- Volume Resistivity @ 100 V (23°C, 50.0 µm): 1.0E+16 ohms•cm (ASTM D257)
- Peak Crystallization Temperature (DSC): 143 °C
- Film Thickness — Recommended/Available: 100 to 125 µm
- Density (23°C): 1.42 g/cm³ (ISO 1183)
APTIV™ XPI A105
APTIV™ XPI A105 is an unfilled, semi-crystalline film manufactured from VICTREX™ PEEK polymer, available at 100 µm with a density of 1.30 g/cm³, and is designed for high-voltage e-motor stator slot liner applications operating at 800 V and above. It delivers a breakdown voltage of 16.2 kV at 23°C, a partial discharge inception voltage of 1199 V at 23°C, and a Relative Thermal Index (Electrical) of 240°C per UL 746B. The film provides outstanding chemical and hydrolysis resistance to water, ATF, oils, and cooling fluids, supporting all cooling concepts from water-based systems to direct oil immersion.
Key Properties
- Tensile Stress, MD: 23°C, 100 µm: 120 MPa (ISO 527)
- Tensile Elongation, MD: 23°C, 100 µm: >150 % (ISO 527)
- Breakdown Voltage 1 kV/s (23°C): 16.2 kV (ASTM D149)
- Dielectric Constant (23°C) 1 kHz: 3.20 (IEC 60250)
- Film Thickness — Recommended/Available: 100 µm
- Density Crystalline (23°C): 1.30 g/cm³ (ISO 1183)
APTIV™ XPI A106
APTIV™ XPI A106 is an unfilled, semi-crystalline film manufactured from VICTREX™ PEEK polymer, available at 125 µm with a density of 1.30 g/cm³, engineered for high-voltage e-motor stator slot liner applications at 800 V and above. It delivers a breakdown voltage of 18.9 kV at 23°C, a partial discharge inception voltage of 1267 V at 23°C, and a Relative Thermal Index (Electrical) of 240°C per UL 746B. The film provides outstanding resistance to water, ATF, oils, and cooling fluids, supporting all cooling concepts from water-based systems to direct oil immersion.
Key Properties
- Tensile Stress, MD: 23°C, 125 µm: 120 MPa (ISO 527)
- Tensile Elongation, MD: 23°C, 125 µm: >150 % (ISO 527)
- Breakdown Voltage 1 kV/s (23°C): 18.9 kV (ASTM D149)
- Dielectric Constant (23°C) 1 kHz: 3.20 (IEC 60250)
- Film Thickness — Recommended/Available: 125 µm
APTIV™ XPI A107
APTIV™ XPI A107 is an unfilled, semi-crystalline film manufactured from VICTREX™ PEEK polymer, available at 150 µm with a density of 1.30 g/cm³, engineered for high-voltage e-motor stator slot liner applications at 800 V and above. It delivers a breakdown voltage of 21.6 kV at 23°C, a partial discharge inception voltage of 1280 V at 23°C, and a Relative Thermal Index (Electrical) of 240°C per UL 746B. The film provides outstanding resistance to water, ATF, oils, and cooling fluids, supporting all cooling concepts from water-based systems to direct oil immersion.
Key Properties
- Tensile Stress, MD: 23°C, 150 µm: 110 MPa (ISO 527)
- Tensile Elongation, MD: 23°C, 150 µm: >150 % (ISO 527)
- Breakdown Voltage 1 kV/s (23°C): 21.6 kV (ASTM D149)
- Dielectric Constant (23°C) 1 kHz: 3.20 (IEC 60250)
- Film Thickness — Recommended/Available: 150 µm
- Density Crystalline (23°C): 1.30 g/cm³ (ISO 1183)
APTIV™ XPI A108
APTIV™ XPI A108 is an unfilled, semi-crystalline film manufactured from VICTREX™ PEEK polymer, available at 200 µm with a density of 1.30 g/cm³, engineered for high-voltage e-motor stator slot liner applications at 800 V and above. It delivers the highest breakdown voltage in the XPI A-series at 25.9 kV (23°C), a partial discharge inception voltage of 1526 V at 23°C, and a Relative Thermal Index (Electrical) of 240°C per UL 746B. The film provides outstanding resistance to water, ATF, oils, and cooling fluids, supporting all cooling concepts from water-based systems to direct oil immersion.
Key Properties
- Tensile Stress, MD: 23°C, 200 µm: 110 MPa (ISO 527)
- Tensile Elongation, MD: 23°C, 200 µm: >150 % (ISO 527)
- Breakdown Voltage 1 kV/s (23°C): 25.9 kV (ASTM D149)
- Dielectric Constant (23°C) 1 kHz: 3.20 (IEC 60250)
- Film Thickness — Recommended/Available: 200 µm
- Density Crystalline (23°C): 1.30 g/cm³ (ISO 1183)
APTIV™ XPI B105
APTIV™ XPI B105 is a mineral-filled, semi-crystalline film manufactured from VICTREX™ PEEK polymer, available at 100 µm with a density of 1.45 g/cm³, engineered for high-voltage e-motor stator slot liner applications at 800 V and above. It delivers enhanced through-plane thermal conductivity of 0.43 W/m·K — significantly higher than the unfilled XPI A-series — a breakdown voltage of 16.5 kV at 23°C, a partial discharge inception voltage of 1187 V at 23°C, and a Relative Thermal Index (Electrical) of 240°C per UL 746B. The TDS specifically describes B105 as providing enhanced thermal conductivity at minimal slot liner thickness for ultra-low thermal resistance.
Key Properties
- Tensile Stress, MD: 23°C, 100 µm: 100 MPa (ISO 527)
- Tensile Elongation, MD: 23°C, 100 µm: >100 % (ISO 527)
- Breakdown Voltage 1 kV/s (23°C): 16.5 kV (ASTM D149)
- Dielectric Constant (23°C) 1 kHz, tested on resin feedstock: 3.20 (IEC 60250)
- Film Thickness — Recommended/Available: 100 µm
- Density Crystalline (23°C): 1.45 g/cm³ (ISO 1183)