Polyimide Film
Polyimide film is the material of choice when continuous dielectric insulation is required across extreme temperature ranges — from cryogenic environments at -269°C through sustained exposure at 400°C — in flex circuits, motor slot liners, heater circuits, and aerospace blankets. Its aromatic polyimide chemistry delivers outstanding dielectric strength, dimensional stability under thermal cycling, and chemical resistance without degradation, making it the industry-standard substrate for high-temperature electrical insulation where other polymer films fail. H-O Products carries the full range of polyimide film families, from Kapton® HN general-purpose and FEP-coated bondable grades to Kaneka Apical® NP for flex PCB and aerospace applications, and converts them to customer specification.
Apical® 100NP High Modulus Aromatic Polyimide Film
Apical® 100NP is a tough aromatic polyimide film engineered for use as a dielectric substrate in flexible printed circuits and semiconductor assembling base materials, with tensile strength of 44 kpsi (302 MPa) MD and 46 kpsi (314 MPa) TD and a modulus of 580–609 kpsi (4.0–4.2 GPa) at a nominal thickness of 0.98 mils (25 µm). The film combines low coefficient of thermal expansion (15–16 ppm/°C), low coefficient of humidity expansion (13 ppm/%RH), and high modulus for demanding base material applications requiring dimensional accuracy through thermal and humidity cycling.
Key Properties
- Tensile Strength: MD: 44 kpsi (302 MPa); TD: 46 kpsi (314 MPa) — ASTM D882
- Elongation: MD: 80%; TD: 75% — ASTM D882
- Dielectric Strength: 7.8 kV/mil — ASTM D149
- Heat Shrinkage at 200°C: MD: 0.06%; TD: 0.02% — 200°C, 2 hrs
- Nominal Thickness: 0.98 mils (25 µm)
- Density: 1.45 g/cm³ — ASTM D1505
Kapton® 100CRC Corona Resistant Polyimide Film
Kapton® 100CRC is a state-of-the-art corona resistant polyimide film with tensile strength of 33 kpsi (228 MPa) and dielectric strength of 6500 V/mil (256 kV/mm) at 1 mil thickness. Its corona resistance provides improved service life and operational efficiencies beyond conventional insulation materials under high voltage environments where partial discharge is present. The film carries UL Electrical RTI of 240°C, UL Mechanical RTI of 200°C, and a UL-94 V-0 flammability rating.
Key Properties
- Tensile Strength: 33 kpsi (228 MPa) — ASTM D882
- Elongation: 65% — ASTM D882
- Dielectric Strength: 6500 V/mil (256 kV/mm) — ASTM D149
- UL Electrical RTI / Mechanical RTI: 240°C / 200°C — UL 746B
- Thickness: 1 mil (25.4 µm) — ASTM D374
- Density: 1.55 g/cc — ASTM D1505
Kapton® 120FMT616 Thermally Conductive FEP-Coated Polyimide Film
Kapton® 120FMT616 is a thermally conductive Kapton® film with three times the thermal conductivity of standard Kapton®, combined with low moisture permeation, high temperature resistance, and high tear strength, at a nominal thickness of 1.15 mils. The film is constructed of a 1.0 mil (25 µm) thermally conductive Kapton® base film with a 0.1 mil (2.5 µm) FEP coating on both sides, combining thermal management performance with moisture barrier and electrical insulation properties.
Key Properties
- Tensile Strength: 19 kpsi — ASTM D882
- Elongation: 67% — ASTM D882
- Dielectric Strength: 5200 V/mil — ASTM D149
- Tear Strength: 2.3 lbf — ASTM D1922
- Nominal Thickness: 1.15 mils — ASTM D374
- Water Vapor Permeation: 17.5 g/(m²·24h) — ASTM D96
Kapton® 150FCR019 Corona Resistant Composite Polyimide Film
Kapton® 150FCR019 is a composite film combining Kapton® 100CR corona resistant polyimide film with a heat fusible fluoropolymer film, with tensile strength of 18.7 kpsi (129 MPa) and dielectric strength of 4300 V/mil (169 kV/mm) at 1.50 mil thickness. The composite construction withstands corona discharge in partial discharge environments while providing heat fusibility for magnet wire wrapping applications. The film has a proven long-term performance history in rail traction, industrial motors, and generators.
Key Properties
- Tensile Strength: 18.7 kpsi (129 MPa) — ASTM D-882
- Elongation: 70% — ASTM D-882
- Dielectric Strength: 4300 V/mil (169 kV/mm) — ASTM D-149 (1/4 in electrode)
- Key Performance Attribute: Corona resistant composite construction; heat fusible fluoropolymer layer
- Thickness: 1.50 mil (38.1 µm) — ASTM D-374
- Yield: 76.7 ft²/lb (15.7 m²/kg) — —
Kapton® 150FWN019 FEP-Coated Heat-Fusible Polyimide Magnet Wire Insulation
Kapton® 150FWN019 is a two-layer, polyimide/FEP fluoropolymer dispersion-coated heat-fusible composite film with tensile strength of 17.3 kpsi (119 MPa) and dielectric strength greater than 3600 V/mil (>142 kV/mm). The film is constructed of 1.0 mil Kapton® polyimide film dispersion-coated with 0.5 mil of enhanced FEP fluoropolymer on one side, yielding a total thickness of 1.50 mil (38 µm). It is rated UL 94 V-0 and delivers superior scrape abrasion resistance with reduced frictional properties reported by motor manufacturers versus other commonly used polyimide materials.
Key Properties
- Tensile Strength: 17.3 kpsi (119 MPa) — ASTM D-882
- Elongation to Break: 55% — ASTM D-882
- Dielectric Strength: >3600 V/mil (>142 kV/mm) — ASTM D-149
- Service Temperature: Mechanical 200°C; Glass Transition >350°C
- Thickness: 1.50 mil (38 µm) — Qnity
- Specific Gravity: 1.68 gms/cc — ASTM D-1505-90
Kapton® 150PRN411 High-Temperature Fluoropolymer/Polyimide Composite Magnet Wire Insulation
Kapton® 150PRN411 is a high-temperature magnet wire insulation film consisting of a 25 µm Kapton® HN polyimide core sandwiched between two high melt temperature fluoropolymer layers — a tan abrasion-resistant outer layer (~10 µm) and a red high-adhesion inner layer (~3 µm) — at a total thickness of 1.5 mil (38 µm). Tensile strength is 27 kpsi (186 MPa) and dielectric strength is 5400 V/mil (212 kV/mm). The film carries UL Electrical RTI 240°C, UL Mechanical RTI 200°C, and UL-94 V-0 ratings, and achieves a 350°C heat seal strength to copper of 930 gms/in (366 gms/cm).
Key Properties
- Tensile Strength: 27 kpsi (186 MPa) — ASTM D882
- Elongation: 88% — ASTM D882
- Dielectric Strength: 5400 V/mil (212 kV/mm) — ASTM D149
- UL Electrical RTI / Mechanical RTI: 240°C / 200°C — UL 746B
- Thickness: 1.5 mil (38 µm) — ASTM D374
- Density: 1.68 g/cc — ASTM D1505
Kapton® 200RS100 Resistive Heating Polyimide Film
Kapton® 200RS100 is a two-layer, all-polyimide resistive heating film with a precisely controlled surface resistivity of 100 ohms/sq (range 92–104 ohm/sq) on a black matte conductive side and a dielectric insulating layer on the shiny smooth opposite side, at 50 µm total thickness. Heating temperature is customizable based on electrode geometry and can be designed for continuous operation up to 200°C or short-term use up to 240°C. The film is durable from -270°C to 200°C, thermally stable to 325°C in oxygen-free environments, and continues to function even if punctured. Rated UL-94 V-0.
Key Properties
- Surface Resistivity: 100 ohms/sq (range 92–104 ohm/sq MD and TD) — Four-point probe measurement
- Tensile Strength MD/TD: >100 MPa — ASTM D-882
- Dielectric Strength: >2,500 V/25µm — ASTM D-149 (60Hz, 0.25 in electrodes, 500V/sec rise)
- Service Temperature: -270°C to 200°C continuous; to 325°C in oxygen-free environments
- Thickness: 50 µm — —
- Density: 1.46 g/cc — ASTM D-1505
Kapton® B Black Homogeneous Opaque Polyimide Film
Kapton® B is a black, homogeneous, opaque polyimide film exhibiting an excellent balance of physical, chemical, and electrical properties over a wide temperature range, with tensile strength of 35–38 kpsi (241–262 MPa) and shrinkage of less than 0.1% MD and TD at 200°C across all gauges. The homogeneous matte black pigmentation provides better color integrity against flexural cracking or abrasion than black coatings or dyes. Available in five gauges from 0.5 to 5.0 mil.
Key Properties
- Tensile Strength: 50B: 38 kpsi (262 MPa); 100–300B: 35–37 kpsi (241–255 MPa); 500B: 35 kpsi (241 MPa) — ASTM D-882-91
- Elongation: 50–100B: 65%; 200B: 80%; 300–500B: 90% — ASTM D-882-91
- Dielectric Strength: 50B: 2900 V/mil; 100B: 2800 V/mil; 200B: 2700 V/mil; 300B: 2200 V/mil; 500B: 1600 V/mil — ASTM D-149-94
- Shrinkage (MD and TD @ 200°C): <0.1%, all gauges — IPC-TM-650
- Available Thickness Range: 0.5–5.0 mil (12.7–127 µm)
- Tensile Modulus: 50B: 450 kpsi (3100 MPa); 100–500B: 440 kpsi (3034 MPa) — ASTM D-882-91
Kapton® EN Premium Performance Polyimide Film for Fine Pitch Circuitry
Kapton® EN is a premium performance polyimide film developed as a dielectric substrate for flexible printed circuits, high density interconnects, and fine pitch circuitry, with tensile strength of 335–380 MPa across grades and directions per JIS K 7161. The film is the thinnest polyimide film available worldwide — offered from 5 µm to 50 µm — with a coefficient of thermal expansion closely matched to copper and heat shrinkage of 0.01% MD and TD at 200°C across all grades. It is also laser ablatable.
Key Properties
- Tensile Strength MD: 335–375 MPa (varies by grade) — JIS K 7161
- Elongation MD: 55–70% (varies by grade) — JIS K 7161
- Breakdown Voltage: 375–400 kV/mm (varies by grade) — JIS C 2151
- Heat Shrinkage [200°C]: 0.01% MD and TD, all grades — JIS K 7133
- Available Thickness Range: 5.0–50 µm (0.2–2.0 mil) — JIS K 7130
- Water Absorption: 1.6–1.9% (varies by grade) — JIS K 7209
Kapton® EN-A, EN-C, EN-Z Premium CTE-Controlled Polyimide Film
Kapton® EN-A, EN-C, and EN-Z are premium performance polyimide films engineered as dielectric substrates for chip on film, flexible printed circuits, and high density interconnects, with tensile strength of 375–450 MPa depending on grade and direction. All three grades feature very low surface roughness (Ra 0.01–0.03 µm), heat shrinkage of 0.01% MD and TD at 200°C, and a wide CTE line-up spanning normal isotropic, low anisotropic, and ultra-low isotropic to match silicone, glass, or copper. All grades are rated UL-94 V-0.
Key Properties
- Tensile Strength MD: 150EN-C: 375 MPa; 150EN-A: 375 MPa; 140EN-Z: 385 MPa — JIS K 7161
- Elongation MD: 150EN-C: 80%; 150EN-A: 85%; 140EN-Z: 70% — JIS K 7161
- Breakdown Voltage: 150EN-C: 380 kV/mm; 150EN-A: 385 kV/mm; 140EN-Z: 430 kV/mm — JIS C 2151
- Heat Shrinkage [200°C]: 0.01% MD and TD, all grades — JIS K 7133
- Thickness: 150EN-C: 37.5 µm; 150EN-A: 37.5 µm; 140EN-Z: 35.0 µm — JIS K 7130
- Surface Roughness (Ra): 0.01~0.03 µm, all grades — JIS B 0601
Kapton® FN FEP-Coated / Laminated Polyimide Film
Kapton® FN is a general purpose Kapton® HN film coated or laminated on one or both sides with FEP fluoropolymer, with ultimate tensile strength of 162–207 MPa (23,500–30,000 psi) at 23°C depending on construction. The FEP layer imparts heat sealability, a moisture barrier, and enhanced chemical resistance not achievable with uncoated Kapton® films. It is available in multiple constructions per general specification QE-10167.
Key Properties
- Tensile Strength at 23°C: 120FN616: 207 MPa (30,000 psi); 150FN019: 162 MPa (23,500 psi); 250FN029: 200 MPa (29,000 psi) — ASTM D882, Method A
- Elongation at 23°C: 120FN616: 75%; 150FN019: 70%; 250FN029: 85% — ASTM D882
- Dielectric Strength: 120FN616: 272 V/µm (6,900 V/mil); 150FN019: 197 V/µm (5,000 V/mil); 250FN029: 197 V/µm (5,000 V/mil) — ASTM D149
- Key Performance Feature: Heat sealable; moisture barrier; enhanced chemical resistance
- Available Constructions: 120FN616, 150FN019, 250FN029 (per specification QE-10167)
- Density: 120FN616: 1.53 g/cc; 150FN019: 1.67 g/cc; 250FN029: 1.57 g/cc — ASTM D1505
Kapton® FPC Two-Sided Treated Polyimide Film for Flex Circuit Manufacturing
Kapton® FPC is a two-sided surface-treated polyimide film with the same balance of physical, chemical, and electrical properties as general purpose Kapton® HN, with superior dimensional stability and adhesion specifically engineered for flexible circuit manufacturers. Shrinkage at 150°C is 0.03% across all gauges, and adhesion measures 10 pli (1.8 N/mm) to copper via acrylic adhesive. The film is rated UL-94 94V0 and is available in 1–5 mil gauges.
Key Properties
- Tensile Strength: 1 & 5 mil: 33.5 kpsi (231 MPa); 2 & 3 mil: 34 kpsi (234 MPa) — ASTM D-882-91
- Elongation: 1–2 mil: 72%; 3 mil: 78%; 5 mil: 82% — ASTM D-882-91
- Dielectric Strength: 1 mil: 303 V/µm (7,700 V/mil); 5 mil: 154 V/µm (3,900 V/mil) — ASTM D-149-91
- Service Temperature Range: Wide temperature range; glass transition 360–410°C
- Available Thickness Range: 1–5 mil (25–125 µm)
- Density: 1.42 g/cc, all gauges — ASTM D-1505-90
Kapton® FWR Hydrolysis Resistant Heat-Fusible Polyimide-FEP Composite Film
Kapton® FWR is a heat-fusible polyimide-FEP fluoropolymer composite film providing tough, high dielectric strength insulation with significantly improved hydrolysis resistance compared to other commonly used polyimide materials, including higher modulus and lower water vapor permeability than equivalent Kapton® FN films. Tensile strength is 34 kpsi (234 MPa) for 150FWR019 and 30 kpsi (207 MPa) for 200FWR919. The film carries UL Electrical RTI 240°C, UL Mechanical RTI 200°C, and UL 94 V-0 ratings. Available in two constructions.
Key Properties
- Tensile Strength: 150FWR019: 34 kpsi (234 MPa); 200FWR919: 30 kpsi (207 MPa) — ASTM D882
- Elongation: 150FWR019: 60%; 200FWR919: 63% — ASTM D882
- Dielectric Strength: 150FWR019: 4500 V/mil (177 kV/mm); 200FWR919: 5000 V/mil (197 kV/mm) — ASTM D149
- UL Electrical RTI / Mechanical RTI: 240°C / 200°C — UL746B
- Thickness: 150FWR019: 1.5 mil (38 µm); 200FWR919: 2.0 mil (50 µm) — ASTM D374
- Density: 150FWR019: 1.69 g/cc; 200FWR919: 1.83 g/cc — ASTM D1505
Kapton® HN General Purpose Polyimide Film
Kapton® HN is an all-polyimide film offering an excellent balance of physical, thermal, and electrical properties across a wide temperature range, with ultimate tensile strength of 33,500 psi (231 MPa) at 23°C consistent across all gauges. The film has been used successfully in applications from -269°C (-452°F) to 400°C (752°F). Kapton® HN can be laminated, metallized, punched, formed, or adhesive coated.
Key Properties
- Tensile Strength (all gauges, 23°C): 33,500 psi (231 MPa) — ASTM D-882
- Ultimate Elongation at 23°C: 65–82% (varies by gauge) — ASTM D-882
- Dielectric Strength: 154–315 V/µm / 3,900–8,000 V/mil (varies by gauge, 60 Hz) — ASTM D149
- Service Temperature Range: -269°C (-452°F) to 400°C (752°F)
- Available Thickness Range: 0.5–5 mil (12.7–125 µm)
- Density: 1.42 g/cc — ASTM D-1505
Kapton® HPP-ST Two-Sided Treated Polyimide Film
Kapton® HPP-ST is a two-sided, surface-treated polyimide film offering the same balance of physical, chemical, and electrical properties as general purpose Kapton® HN, with superior dimensional stability and excellent adhesion to most adhesive systems. Shrinkage at 150°C is 0.03% across all gauges, making it the preferred choice where low shrinkage and superior adhesion are critical. The film carries a UL-94 94V0 flammability rating and is available in 1–5 mil gauges.
Key Properties
- Tensile Strength: 1–3 mil: 34 kpsi (234 MPa); 1 & 5 mil: 33.5 kpsi (231 MPa) — ASTM D-882-91
- Elongation: 1–2 mil: 72%; 3 mil: 78%; 5 mil: 82% — ASTM D-882-91
- Dielectric Strength: 1 mil: 303 V/µm (7,700 V/mil); 5 mil: 154 V/µm (3,900 V/mil) — ASTM D-149-91
- Service Temperature Range: Wide temperature range; same as general purpose Kapton® HN
- Available Thickness Range: 1–5 mil (25–125 µm)
- Density: 1.42 g/cc — ASTM D-1505-90
Kapton® MT Thermally Conductive Polyimide Film
Kapton® MT is a homogeneous polyimide film possessing three times the thermal conductivity and cut-through strength of standard Kapton® HN, with thermal conductivity of 0.46 W/m·K across all grades. Tensile strength ranges from 20–23 kpsi (138–159 MPa) and dielectric strength from 4100–5500 V/mil depending on grade. The film is available in four grades — 100MT, 150MT, 200MT, and 300MT — offering a higher modulus than standard HN for improved strength in the final product.
Key Properties
- Thermal Conductivity: 0.46 W/m·K, all grades — ASTM D5470
- Tensile Strength: 100MT: 20 kpsi (138 MPa); 150MT: 21 kpsi (145 MPa); 200MT: 22 kpsi (152 MPa); 300MT: 23 kpsi (159 MPa) — ASTM D882
- Elongation: 100MT: 80%; 150MT: 85%; 200MT: 87%; 300MT: 100% — ASTM D882
- Dielectric Strength: 100MT: 5500 V/mil; 150MT: 5100 V/mil; 200MT: 4600 V/mil; 300MT: 4100 V/mil — ASTM D149
- Cut-Through Strength: 40 lb, all grades — Qnity Method
- Tensile Modulus: 100MT: 440 kpsi (3.0 GPa); 150MT: 450 kpsi (3.1 GPa); 200MT: 475 kpsi (3.3 GPa); 300MT: 490 kpsi (3.4 GPa) — ASTM D882
Kapton® MT+ Thermally Conductive Polyimide Film
Kapton® MT+ is a homogeneous polyimide film possessing nearly twice the thermal conductivity of Kapton® MT and four times that of standard Kapton® HN, with thermal conductivity of 0.75 W/m·K across all grades. Tensile strength is 12 kpsi (83 MPa) and modulus is 625 kpsi (4.3 GPa) across all grades; dielectric strength ranges from 3.9–5.3 kVAC/mil (154–209 kV/mm) depending on grade. Available in 150MT+, 200MT+, and 300MT+ grades at 1.5–3.0 mil thickness.
Key Properties
- Thermal Conductivity: 0.75 W/m·K, all grades — ASTM D5470
- Tensile Strength: 12 kpsi (83 MPa), all grades — ASTM D882
- Elongation to Break: 150MT+: 44%; 200MT+: 44%; 300MT+: 35% — ASTM D882
- Dielectric Strength: 150MT+: 5.3 kVAC/mil (209 kV/mm); 200MT+: 5.0 kVAC/mil (197 kV/mm); 300MT+: 3.9 kVAC/mil (154 kV/mm) — ASTM D1491 (1/4 in brass electrode)
- Thickness: 150MT+: 1.5 mil (0.038 mm); 200MT+: 2.0 mil (0.050 mm); 300MT+: 3.0 mil (0.076 mm) — ASTM D374
- Tensile Modulus: 625 kpsi (4.3 GPa), all grades — ASTM D882
Kapton® PST Polyimide Film for Pressure Sensitive Adhesive Tape and Coating
Kapton® PST is a tough polyimide film offering an excellent balance of physical, chemical, and electrical properties over a wide temperature range, particularly at unusually high temperatures, intended for use by coaters, laminators, and manufacturers of pressure sensitive adhesive tape. Typical tensile strength for the 100PST gauge is 252 MPa (36,500 psi) at 23°C; minimum dielectric strength across gauges ranges from 3,500–6,700 V/mil. The film is available in 50, 100, 200, 300, and 500 gauges with static-controlled processing to less than 5,000 volts static charge.
Key Properties
- Tensile Strength (100PST, 23°C): 252 MPa (36,500 psi) typical — ASTM D-882
- Elongation (100PST, 23°C): 72% typical — ASTM D-882
- Dielectric Strength, Minimum: 50PST: 6,000 V/mil; 100PST: 6,700 V/mil; 200PST: 5,300 V/mil; 300PST: 4,800 V/mil; 500PST: 3,500 V/mil — ASTM D-149-81
- Shrinkage MD/TD at 400°C, Maximum: 2.0%, all gauges — MIL-P-46112B (MR)
- Thickness Range: 50PST: 0.5 mil (12.7 µm); 500PST: 5.0 mil (127 µm) nominal
- Dielectric Constant at 1 kHz, Maximum: 50PST: 4.0; 100–500PST: 3.9 — ASTM D-150-81
Kapton® XP Fluorocarbon-Coated Polyimide Insulation Substrate
Kapton® XP is a type H polyimide film coated on one or both sides with a proprietary fluorocarbon resin, with tensile strength of 24–29 kpsi (165–200 MPa) and dielectric strength of 4400–4800 V/mil (173–189 kV/mm) depending on construction. High bond strengths to copper, to itself, and to other materials are maintained at elevated temperatures, and the film demonstrates significantly improved bond strength retention versus Kapton® FN from room temperature through 200°C. Available in 1.5 mil (150XP019) and 2.0 mil (200XP919) constructions.
Key Properties
- Tensile Strength: 150XP019: 29 kpsi (200 MPa); 200XP919: 24 kpsi (165 MPa) — ASTM D882
- Elongation: 150XP019: 93%; 200XP919: 95% — ASTM D882
- Dielectric Strength: 150XP019: 4400 V/mil (173 kV/mm); 200XP919: 4800 V/mil (189 kV/mm) — ASTM D149
- Key Performance Attribute: Significantly improved bond strength retention at elevated temperature vs. Kapton® FN
- Thickness: 150XP019: 1.5 mil (38 µm); 200XP919: 2.0 mil (50 µm) — ASTM D374
- Yield: 150XP019: 82.4 ft²/lb (16.9 m²/kg); 200XP919: 57.4 ft²/lb (11.8 m²/kg) — —
