Boron Nitride Silicone Thermal Pads (Henkel / Bergquist®)
Boron nitride silicone thermal pads are the material of choice when component-to-heatsink isolation in power electronics, avionics, EV battery modules, or medical equipment requires thermally conductive gap filling that cannot use graphite due to its electrical conductivity. BN-filled silicone matrices in the Bergquist® Sil-Pad® and Gap Pad® families deliver thermal conductivity from 0.9 W/m·K to 5.0 W/m·K while maintaining dielectric isolation, with reinforced fiberglass variants for firm interfaces and ultra-soft conformable grades for uneven multi-height component stacks. H-O Products carries the full range of Bergquist® boron nitride silicone pads, from Sil-Pad® 400 through Sil-Pad® 2000 and Kapton®-reinforced TSP K1300 to the Gap Pad® conformable series, and converts them to customer specification.
BERGQUIST® SIL PAD TSP 1600S High-Performance Silicone / Fiberglass Insulator for Low-Pressure Applications (formerly SIL-PAD 900S)
BERGQUIST SIL PAD TSP 1600S is a fiberglass-reinforced silicone thermally conductive insulator engineered for low-pressure component clamping, such as spring-clip-mounted discrete semiconductors (TO-220, TO-247, TO-218). The 0.229 mm pad delivers 1.6 W/(m·K) thermal conductivity and a thermal impedance of 0.61°C·in²/W at 50 psi across an operating range of -60°C to +180°C. The smooth, highly compliant surface minimizes interfacial thermal resistance and maximizes thermal performance at low mounting pressures, with UL 94 V-0 flammability.
Key Properties
- Thermal Conductivity: 1.6 W/(m·K) (ASTM D5470)
- Thermal Impedance @ 50 psi: 0.61 °C·in²/W
- Dielectric Breakdown Voltage: 5,500 Vac (ASTM D149)
- Hardness: 92 Shore A (ASTM D2240)
- Operating Temperature Range: -60°C to +180°C
- Total Thickness: 0.229 mm
BERGQUIST® SIL PAD TSP 1800ST Soft-Tack Electrically Insulating Thermally Conductive Elastomer (formerly SIL-PAD 1500ST)
BERGQUIST SIL PAD TSP 1800ST is a fiberglass-reinforced thermal interface elastomer that is naturally tacky on both sides, delivering 1.8 W/(m·K) thermal conductivity and thermal impedance of 0.23°C·in²/W at 50 psi. The 0.203 mm pad is designed for auto-dispensing and auto-placement in high-volume assemblies with dielectric breakdown voltage of 3,000 Vac across an operating range of -60°C to +180°C. The naturally tacky surface allows repositionable placement without separate adhesive layers, with UL 94 V-0 flammability.
Key Properties
- Thermal Conductivity: 1.8 W/(m·K) (ASTM D5470)
- Thermal Impedance @ 50 psi: 0.23 °C·in²/W
- Dielectric Breakdown Voltage: 3,000 Vac (ASTM D149)
- Hardness: 75 Shore 00 (ASTM D2240)
- Operating Temperature Range: -60°C to +180°C
- Total Thickness: 0.203 mm
BERGQUIST® SIL PAD TSP 3500 Higher-Performance High-Reliability Silicone / Fiberglass Insulator (formerly SIL-PAD 2000)
BERGQUIST SIL PAD TSP 3500 is a high-performance fiberglass-reinforced silicone elastomer insulator engineered for aerospace, avionics, and other high-reliability electronic packaging, delivering 3.5 W/(m·K) thermal conductivity — the highest in the Sil-Pad family — and thermal impedance of 0.33°C·in²/W at 50 psi (at 0.01" thickness). The pad provides dielectric breakdown voltage of 4,000 Vac across an extended operating range of -60°C to +200°C, available in 0.254 to 0.508 mm thickness with UL 94 V-0 flammability. Grease-free and conformable.
Key Properties
- Thermal Conductivity: 3.5 W/(m·K) (ASTM D5470)
- Thermal Impedance @ 50 psi (0.01"): 0.33 °C·in²/W
- Dielectric Breakdown Voltage: 4,000 Vac (ASTM D149)
- Hardness: 90 Shore A (ASTM D2240)
- Operating Temperature Range: -60°C to +200°C
- Total Thickness: 0.254 to 0.508 mm
BERGQUIST® SIL PAD TSP 900 Silicone / Fiberglass Thermally Conductive Insulator Pad (formerly SIL-PAD 400)
BERGQUIST SIL PAD TSP 900 is a silicone rubber / fiberglass composite thermally conductive insulator pad — the original Sil-Pad material — with a thermal conductivity of 0.9 W/(m·K) and a thermal impedance of 1.13°C·in²/W at 50 psi (0.007" thickness). The pad delivers dielectric breakdown voltage of 3,500 to 4,500 Vac across an operating temperature range of -60°C to +180°C, with documented UL 94 V-0 flammability. The reinforcing fiberglass provides excellent cut-through resistance, and the material is non-toxic and resists damage from cleaning agents.
Key Properties
- Thermal Conductivity: 0.9 W/(m·K) (ASTM D5470)
- Thermal Impedance @ 50 psi (0.007"): 1.13°C·in²/W
- Dielectric Breakdown Voltage: 3,500 to 4,500 Vac (ASTM D149)
- Hardness: 85 Shore A (ASTM D2240)
- Operating Temperature Range: -60°C to +180°C
BERGQUIST® SIL PAD TSP K1300 Kapton®-Reinforced Thermally Conductive Insulator (formerly SIL-PAD K-10)
BERGQUIST SIL PAD TSP K1300 is a Kapton-reinforced silicone thermally conductive insulator engineered as a replacement for ceramic insulators such as Beryllium Oxide, Boron Nitride, and Alumina. The 0.15 ± 0.025 mm pad delivers 1.3 W/(m·K) thermal conductivity, dielectric breakdown voltage of 6,000 Vac minimum, and volume resistivity of 1 × 10¹² ohm-meter across an operating range of -60°C to +180°C. NASA outgassing compliant (TML 0.36%, VCM 0.09%), eliminating ceramic breakage at significantly lower cost than ceramic alternatives.
Key Properties
- Thermal Conductivity: 1.3 W/(m·K) (ASTM D5470)
- Thermal Resistance: 0.2 °C·in²/W (Bergquist Flat Plate Test)
- Dielectric Breakdown Voltage: 6,000 Vac min. (ASTM D149)
- Hardness: 90 Shore A (ASTM D2240)
- Operating Temperature Range: -60°C to +180°C
- Total Thickness: 0.15 ± 0.025 mm
BERGQUIST GAP PAD TGP 1000VOUS Ultra-Soft Viscoelastic Thermally Conductive Gap Filler (formerly GAP PAD VO ULTRA SOFT)
BERGQUIST GAP PAD TGP 1000VOUS is an ultra-conformable, gel-like thermally conductive gap filler with 1.0 W/(m·K) thermal conductivity and a Shore 00 hardness of 5 — the softest grade in the Gap Pad TGP family. The viscoelastic material delivers thermal impedance of 1.68 °C·in²/W at 0.040"/30% deflection with 6,000 VAC dielectric breakdown voltage and excellent vibration dampening and shock absorbing characteristics. Offered at 0.508 to 6.35 mm thickness across an operating range of -60°C to +200°C, with UL 94 V-0 flammability.
Key Properties
- Thermal Conductivity: 1.0 W/(m·K) (ASTM D5470)
- Thermal Impedance @ 0.040 in, 30% Deflection: 1.68 °C·in²/W
- Hardness: 5 Shore 00 (ASTM D2240)
- Young's Modulus: 55 kPa (8 psi) (ASTM D575)
- Dielectric Breakdown Voltage: 6,000 VAC (ASTM D149)
- Operating Temperature Range: -60°C to +200°C
BERGQUIST GAP PAD TGP 1500 Un-Reinforced Thermally Conductive Gap Filler (formerly GAP PAD 1500)
BERGQUIST GAP PAD TGP 1500 is an un-reinforced, conformable thermally conductive gap filler with 1.5 W/(m·K) thermal conductivity and natural tack on both sides. The un-reinforced construction provides additional compliancy compared to fiberglass-reinforced grades, with thermal impedance of 1.33 °C·in²/W at 0.040"/30% deflection and dielectric breakdown voltage greater than 6,000 VAC. Offered at 0.508 to 5.08 mm thickness across an operating range of -60°C to +200°C, with UL 94 V-0 flammability.
Key Properties
- Thermal Conductivity: 1.5 W/(m·K) (ASTM D5470)
- Thermal Impedance @ 0.040 in, 30% Deflection: 1.33 °C·in²/W
- Hardness: 40 Shore 00 (ASTM D2240)
- Young's Modulus: 310 kPa (45 psi) (ASTM D575)
- Dielectric Breakdown Voltage: > 6,000 VAC (ASTM D149)
- Operating Temperature Range: -60°C to +200°C
BERGQUIST GAP PAD TGP 3000 Soft “S-Class” Reinforced Thermally Conductive Gap Filler (formerly GAP PAD 3000S30)
BERGQUIST GAP PAD TGP 3000 is a fiberglass-reinforced, soft "S-Class" gap filling material with 3.0 W/(m·K) thermal conductivity, engineered for high-performance, low-stress applications using fixed standoff or clip mounting. The pad delivers exceptional thermal performance at low pressures, with dielectric breakdown voltage greater than 3,000 VAC and natural inherent tack on both sides to eliminate the need for thermally-impeding adhesive layers. Offered at 0.254 to 3.175 mm thickness across an operating range of -60°C to +200°C, with UL 94 V-0 flammability.
Key Properties
- Thermal Conductivity: 3.0 W/(m·K) (ASTM D5470)
- Hardness: 30 Shore 00 (ASTM D2240)
- Young's Modulus: 180 kPa (26 psi) (ASTM D575)
- Dielectric Breakdown Voltage: > 3,000 VAC (ASTM D149)
- Operating Temperature Range: -60°C to +200°C
- Thickness: 0.254 to 3.175 mm
BERGQUIST GAP PAD TGP 5000 High-Conductivity Soft “S-Class” Thermally Conductive Gap Filler (formerly GAP PAD 5000S35)
BERGQUIST GAP PAD TGP 5000 is a fiberglass-reinforced soft "S-Class" gap filling material delivering 5.0 W/(m·K) thermal conductivity — the highest in the Gap Pad TGP family — with a thermal impedance of 0.30 °C·in²/W at 0.040" / 30% deflection. The pad provides dielectric breakdown voltage greater than 5,000 VAC across an operating range of -60°C to +200°C, with natural inherent tack to reduce interfacial thermal resistance. Offered at 0.508 to 3.175 mm thickness, with UL 94 V-0 flammability.
Key Properties
- Thermal Conductivity: 5.0 W/(m·K) (ASTM D5470)
- Thermal Impedance @ 0.040 in, 30% Deflection: 0.30 °C·in²/W
- Hardness: 35 Shore 00 (ASTM D2240)
- Young's Modulus: 310 kPa (45 psi) (ASTM D575)
- Dielectric Breakdown Voltage: > 5,000 VAC (ASTM D149)
- Operating Temperature Range: -60°C to +200°C
