Apical® 100NP High Modulus Aromatic Polyimide Film
Apical® 100NP is a tough aromatic polyimide film engineered for use as a dielectric substrate in flexible printed circuits and semiconductor assembling base materials, with tensile strength of 44 kpsi (302 MPa) MD and 46 kpsi (314 MPa) TD and a modulus of 580–609 kpsi (4.0–4.2 GPa) at a nominal thickness of 0.98 mils (25 µm). The film combines low coefficient of thermal expansion (15–16 ppm/°C), low coefficient of humidity expansion (13 ppm/%RH), and high modulus for demanding base material applications requiring dimensional accuracy through thermal and humidity cycling.
Key Properties
- Tensile Strength: MD: 44 kpsi (302 MPa); TD: 46 kpsi (314 MPa) — ASTM D882
- Elongation: MD: 80%; TD: 75% — ASTM D882
- Dielectric Strength: 7.8 kV/mil — ASTM D149
- Heat Shrinkage at 200°C: MD: 0.06%; TD: 0.02% — 200°C, 2 hrs
- Nominal Thickness: 0.98 mils (25 µm)
- Density: 1.45 g/cm³ — ASTM D1505
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Construction
| Property | Mils | Microns |
| Nominal Thickness | 0.98 | 25 |
Mechanical Properties
| Property | Typical Value | Test Method |
| Tensile Strength MD, kpsi (MPa) | 44 (302) | ASTM D882 |
| Tensile Strength TD, kpsi (MPa) | 46 (314) | ASTM D882 |
| Tensile Modulus MD, kpsi (GPa) | 580 (4.0) | ASTM D882 |
| Tensile Modulus TD, kpsi (GPa) | 609 (4.2) | ASTM D882 |
| Elongation MD (TD), % | 80 (75) | ASTM D882 |
Thermal Properties
| Property | Typical Value | Test Method |
| Heat Shrinkage MD, % | 0.06 | 200°C – 2 hrs |
| Heat Shrinkage TD, % | 0.02 | 200°C – 2 hrs |
| Coefficient of Thermal Expansion MD, ppm/°C | 16 | TMA 100–200°C |
| Coefficient of Thermal Expansion TD, ppm/°C | 15 | TMA 100–200°C |
Electrical Properties
| Property | Typical Value | Test Method |
| Dielectric Strength, kV/mil | 7.8 | ASTM D149 |
| Dielectric Constant, 1 kHz | 3.2 | ASTM D150 |
| Dissipation Factor, 1 kHz | 0.0020 | ASTM D150 |
| Volume Resistivity, Ohm-cm | >1E+16 | ASTM D257 |
Physical Properties
| Property | Typical Value | Test Method |
| Water Absorption, % | 2.7 | IPC-TM650-2.6.2 |
| Coefficient of Humidity Expansion, ppm/%RH | 13 | HMA |
| Density, g/cm³ | 1.45 | ASTM D1505 |
| Yield, ft²/lb (m²/kg) | 133 (27) | — |
- Dielectric base material for Chip Scale Package (CSP), T-BGA, and similar semiconductor packaging applications requiring low CTE matched to copper
- Rigid-flex, multi-layered copper-clad laminate (CCL), and multichip module (MCM) base film requiring a high-modulus polyimide with low hygroscopic expansion
- Polyimide base material for fine-pitch flexible printed circuits where high modulus and low shrinkage improve registration and yield
- HDD suspension base materials requiring a dimensionally stable, high-modulus polyimide film with low humidity coefficient of expansion
- Semiconductor assembly base materials where consistent lot-to-lot dimensional performance is critical to fine-pitch conductor alignment
Common industries: semiconductor packaging, flexible circuit manufacturing, data storage, consumer electronics, telecommunications.
Apical® 100NP is a high-performance aromatic polyimide film manufactured by Kaneka for use as a base dielectric layer in fine-pitch flexible printed circuits, chip scale packages, and semiconductor assembly constructions.
Its modulus of 4.0–4.2 GPa is significantly higher than standard polyimide films, which provides the dimensional rigidity needed to maintain registration accuracy through the photolithographic, lamination, and etching processes used in fine-pitch FPC and chip scale package fabrication.
The film’s CTE of 15–16 ppm/°C is closely matched to copper, reducing thermally induced stress at the copper/polyimide interface during temperature cycling, and its coefficient of humidity expansion of 13 ppm/%RH limits dimensional change in response to ambient humidity variations.
Heat shrinkage at 200°C is 0.06% MD and 0.02% TD (2-hour exposure), demonstrating good dimensional stability through the elevated temperature lamination and bonding steps common in rigid-flex and multi-layer CCL construction. Dielectric strength of 7.8 kV/mil, dielectric constant of 3.2 at 1 kHz, and dissipation factor of 0.0020 at 1 kHz are consistent with high-performance polyimide film requirements. Volume resistivity exceeds 1E+16 Ohm-cm. Water absorption is 2.7% per IPC-TM650-2.6.2 and the coefficient of humidity expansion is 13 ppm/%RH.
What differentiates Apical® 100NP from standard Kapton® HN?
Apical® 100NP provides a modulus of 4.0–4.2 GPa versus 2.76 GPa for Kapton® HN — approximately 50% higher — along with a lower coefficient of humidity expansion (13 ppm/%RH) and lower CTE more closely matched to copper. These properties make 100NP better suited for fine-pitch and chip-scale applications where HN's lower modulus and higher CTE would introduce dimensional errors through the thermal and humidity cycles of semiconductor assembly processes. Apical® 100NP is a Kaneka product distinct from the Kapton® film family.
Why does tensile strength matter for polyimide film selection in semiconductor packaging base materials?
High modulus and adequate tensile strength are critical for maintaining dimensional accuracy through vacuum lamination, photolithographic exposure, and wet chemistry processes where the film must resist elongation, wrinkling, and registration shift under mechanical and thermal loads. Apical® 100NP's tensile strength of 44–46 kpsi (302–314 MPa) and modulus of 4.0–4.2 GPa provide the mechanical rigidity needed for tight-pitch pattern fidelity.
What is the thermal dimensional stability of Apical® 100NP?
Heat shrinkage at 200°C for 2 hours is 0.06% MD and 0.02% TD. Coefficient of thermal expansion is 16 ppm/°C MD and 15 ppm/°C TD measured by TMA from 100–200°C. These values reflect good dimensional stability through the elevated temperature steps typical of semiconductor packaging assembly.
Is Apical® 100NP suitable for regulated environments?
No compliance certifications are specified on the H-O Products TDS for Apical® 100NP. Contact H-O Products for additional compliance information.
How should Apical® 100NP be specified?
Specify grade (Apical® 100NP), nominal thickness (0.98 mils / 25 µm), compliance requirements, dimensional tolerances, and finished format (slit roll, sheet, or fabricated component).
