APTIV™ 1000
APTIV™ 1000 is an unfilled, semi-crystalline film manufactured from VICTREX™ PEEK polymer, available in thicknesses from 8 to 750 µm. It delivers outstanding high-temperature capability combined with excellent mechanical strength, electrical insulation, and long-term durability. The film exhibits strong resistance to radiation, hydrolysis, and aggressive chemicals, and provides inherent flame resistance without added flame retardants.
Key Properties
- Tensile Stress, MD: Break, 23°C, 25 µm: 140 MPa (ISO 527-3)
- Tensile Elongation, MD: Break, 23°C, 25 µm: >150 % (ISO 527-3)
- Dielectric Strength @ 0.25 inch electrode, 23°C, 50 µm: 190 kV/mm (ASTM D149)
- Dielectric Constant (23°C, 50.0 µm, 10 MHz): 3.5 (ASTM D150)
- Film Thickness — Recommended/Available: 8 to 750 µm
- Density (23°C): 1.30 g/cm³ (ISO 1183)
We want to help!
Enter your information and we'll get you in touch with our knowledgable staff. We know how important to the right product for your project.
Request a Consultation
- Specifications
- Applications
- General Info
- FAQs
Physical Properties
| Property | Value | Test Method |
| Density (23°C) | 1.30 g/cm³ | ISO 1183 |
| Water Absorption, Equilibrium, 23°C, 0.0500 mm, 50% RH | 0.040 % | ISO 62 |
| Shrinkage MD TM-VX-84 (200°C, 50.0 µm) | <0.50 % | — |
| Shrinkage TD TM-VX-84 (200°C, 50.0 µm) | <0.50 % | — |
Mechanical Properties
| Property | Value | Test Method |
| Film Thickness — Recommended/Available | 8 to 750 µm | — |
| Tensile Modulus, MD: 23°C, 25 µm | 2600 MPa | ISO 527-3 |
| Tensile Modulus, TD: 23°C, 25 µm | 2800 MPa | ISO 527-3 |
| Tensile Modulus, MD: 23°C, 50 µm | 2500 MPa | ISO 527-3 |
| Tensile Modulus, TD: 23°C, 50 µm | 2500 MPa | ISO 527-3 |
| Tensile Modulus, MD: 23°C, 125 µm | 2400 MPa | ISO 527-3 |
| Tensile Modulus, TD: 23°C, 125 µm | 2300 MPa | ISO 527-3 |
| Tensile Modulus, MD: 23°C, 250 µm | 2300 MPa | ISO 527-3 |
| Tensile Modulus, TD: 23°C, 250 µm | 2300 MPa | ISO 527-3 |
| Tensile Stress, MD: 23°C, 25 µm | 140 MPa | ISO 527-3 |
| Tensile Stress, TD: 23°C, 25 µm | 120 MPa | ISO 527-3 |
| Tensile Stress, MD: 23°C, 50 µm | 130 MPa | ISO 527-3 |
| Tensile Stress, TD: 23°C, 50 µm | 120 MPa | ISO 527-3 |
| Tensile Stress, MD: 23°C, 125 µm | 120 MPa | ISO 527-3 |
| Tensile Stress, TD: 23°C, 125 µm | 120 MPa | ISO 527-3 |
| Tensile Stress, MD: 23°C, 250 µm | 110 MPa | ISO 527-3 |
| Tensile Stress, TD: 23°C, 250 µm | 110 MPa | ISO 527-3 |
| Tensile Elongation, MD: Break, 23°C, 25 µm | >150 % | ISO 527-3 |
| Tensile Elongation, TD: Break, 23°C, 25 µm | >150 % | ISO 527-3 |
| Tensile Elongation, MD: Break, 23°C, 50 µm | >150 % | ISO 527-3 |
| Tensile Elongation, TD: Break, 23°C, 50 µm | >150 % | ISO 527-3 |
| Tensile Elongation, MD: Break, 23°C, 125 µm | >150 % | ISO 527-3 |
| Tensile Elongation, TD: Break, 23°C, 125 µm | >150 % | ISO 527-3 |
| Tensile Elongation, MD: Break, 23°C, 250 µm | >150 % | ISO 527-3 |
| Tensile Elongation, TD: Break, 23°C, 250 µm | >150 % | ISO 527-3 |
| Trouser Tear Resistance @ 23°C, MD: 50 µm | 6.00 N/mm | ISO 6383-1 |
| Trouser Tear Resistance @ 23°C, TD: 50 µm | 8.00 N/mm | ISO 6383-1 |
| Puncture Resistance (23°C, 50.0 µm) | 26 kJ/m² | Internal Method |
Thermal Properties
| Property | Value | Test Method |
| CLTE — Flow below Tg (0.0500mm) | 4.75E-5 cm/cm/°C | ASTM D696 |
Electrical Properties
| Property | Value | Test Method |
| Volume Resistivity @ 100 V (23°C, 50.0 µm) | 4.0E+16 ohms•cm | ASTM D257 |
| Dielectric Strength @ 0.25 inch electrode, 23°C, 25 µm | 270 kV/mm | ASTM D149 |
| Dielectric Strength @ 0.25 inch electrode, 23°C, 50 µm | 190 kV/mm | ASTM D149 |
| Dielectric Strength @ 0.25 inch electrode, 23°C, 125.0 µm | 120 kV/mm | ASTM D149 |
| Dielectric Strength @ 0.25 inch electrode, 23°C, 250.0 µm | 70 kV/mm | ASTM D149 |
| Dielectric Constant (23°C, 50.0 µm, 10 MHz) | 3.5 | ASTM D150 |
| Dissipation Factor (23°C, 50.0 µm, 10 MHz) | 2.0E-3 | ASTM D150 |
| Dielectric Breakdown, 23°C, 25.0 µm | 6750 V | ASTM D149 |
| Dielectric Breakdown, 23°C, 50.0 µm | 9500 V | ASTM D149 |
| Dielectric Breakdown, 23°C, 125.0 µm | 15000 V | ASTM D149 |
| Dielectric Breakdown, 23°C, 250.0 µm | 17500 V | ASTM D149 |
- Electrical insulation barriers in high-temperature electronic assemblies
- Thin-wall structural film components requiring chemical and radiation resistance
- High-purity barrier layers in medical or semiconductor processing equipment
- Lightweight dielectric substrates in demanding electrical insulation systems
- Flame-resistant film insulation for aerospace and industrial wiring applications
Common industries: Electronics, aerospace, medical, semiconductor, industrial manufacturing.
APTIV™ 1000 Series films are unfilled, semi-crystalline films produced from VICTREX™ PEEK polymer, representing the foundational grade within the APTIV™ film portfolio. They are engineered for ultra-high-performance applications where exceptional combinations of thermal, mechanical, and chemical performance are required in a lightweight, thin film format. The broad thickness range of 8 to 750 µm provides substantial design flexibility across a wide range of end uses.
These films combine high-temperature capability with wear and abrasion resistance, high-purity barrier performance, and low moisture absorption. They exhibit strong resistance to radiation, hydrolysis, and aggressive chemicals, along with excellent electrical insulation properties. The material is inherently flame resistant without the addition of flame retardants, produces low smoke toxicity during combustion, and is naturally halogen-free, supporting regulatory and sustainability requirements. The CLTE below Tg is 4.75E-5 cm/cm/°C.
What differentiates APTIV™ 1000 from the APTIV™ 1100 Series films?
APTIV™ 1000 is an unfilled, semi-crystalline PEEK film that offers high elongation (>150% across all thicknesses) and the widest available thickness range in the APTIV™ portfolio (8 to 750 µm), making it the most flexible choice for applications requiring conformability and broad gauge selection. The APTIV™ 1100 Series films, by contrast, are mineral-filled and deliver a higher modulus and a lower coefficient of linear thermal expansion, suited for applications where dimensional stability under thermal load is the priority.
Why does tensile strength matter when selecting a PEEK film?
Tensile strength determines whether a film can withstand the mechanical loads imposed during both manufacturing (handling, laminating, die-cutting) and end-use service. APTIV™ 1000 achieves tensile stress at break of up to 140 MPa (MD, 25 µm), ensuring the film maintains structural integrity under tension without premature failure, which is critical in thin film applications where the margin between functional performance and failure is narrow.
What is the operating temperature range for APTIV™ 1000?
The TDS does not specify an explicit operating temperature range. The CLTE below Tg is reported as 4.75E-5 cm/cm/°C (ASTM D696). Contact H-O Products or the manufacturer for application-specific temperature guidance.
Is APTIV™ 1000 suitable for flame-rated environments?
The TDS states that APTIV™ 1000 Series films provide inherent flame resistance without added flame retardants and produce low smoke toxicity during combustion. However, no specific flame rating standards or compliance certifications are listed on the manufacturer's TDS for this material.
How should APTIV™ 1000 be specified?
Specify grade (APTIV™ 1000), thickness, compliance requirements, dimensional tolerances, and finished format.
