APTIV™ 1102
APTIV™ 1102 is a mineral-filled, semi-crystalline film manufactured from VICTREX™ PEEK polymer, available in thicknesses from 12 to 125 µm with a density of 1.45 g/cm³. It delivers high mechanical strength and excellent electrical insulation, with tensile modulus values up to 5000 MPa (MD, 25 µm) and dielectric strength of 200 kV/mm at 50 µm. Compared to the APTIV™ 1000 Series, APTIV™ 1102 offers a higher modulus and a lower coefficient of linear thermal expansion.
Key Properties
- Tensile Stress, MD: Break, 23°C, 25 µm: 100 MPa (ISO 527-3)
- Tensile Elongation, MD: Break, 23°C, 25 µm: >100 % (ISO 527-3)
- Dielectric Strength @ 0.25 inch electrode (23°C, 50.0 µm): 200 kV/mm (ASTM D149)
- Dielectric Constant (23°C, 50.0 µm, 10 MHz): 3.6 (ASTM D150)
- Film Thickness — Recommended/Available: 12 to 125 µm
- Density (23°C): 1.45 g/cm³ (ISO 1183)
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- Specifications
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Physical Properties
| Property | Value | Test Method |
| Density (23°C) | 1.45 g/cm³ | ISO 1183 |
| Water Absorption, Equilibrium, 23°C, 0.0500 mm, 50% RH | 0.080 % | ISO 62 |
| Shrinkage MD TM-VX-84 (200°C, 50.0 µm) | <0.50 % | — |
| Shrinkage TD TM-VX-84 (200°C, 50.0 µm) | <0.50 % | — |
Mechanical Properties
| Property | Value | Test Method |
| Film Thickness — Recommended/Available | 12 to 125 µm | — |
| Tensile Modulus, MD: 23°C, 25 µm | 5000 MPa | ISO 527-3 |
| Tensile Modulus, TD: 23°C, 25 µm | 4500 MPa | ISO 527-3 |
| Tensile Modulus, MD: 23°C, 50 µm | 4800 MPa | ISO 527-3 |
| Tensile Modulus, TD: 23°C, 50 µm | 4300 MPa | ISO 527-3 |
| Tensile Modulus, MD: 23°C, 100 µm | 4500 MPa | ISO 527-3 |
| Tensile Modulus, TD: 23°C, 100 µm | 4200 MPa | ISO 527-3 |
| Tensile Stress, MD: Break, 23°C, 25 µm | 100 MPa | ISO 527-3 |
| Tensile Stress, TD: Break, 23°C, 25 µm | 80.0 MPa | ISO 527-3 |
| Tensile Stress, MD: Break, 23°C, 50 µm | 100 MPa | ISO 527-3 |
| Tensile Stress, TD: Break, 23°C, 50 µm | 80.0 MPa | ISO 527-3 |
| Tensile Stress, MD: Break, 23°C, 125 µm | 100 MPa | ISO 527-3 |
| Tensile Stress, TD: Break, 23°C, 125 µm | 80.0 MPa | ISO 527-3 |
| Tensile Elongation, MD: Break, 23°C, 25 µm | >100 % | ISO 527-3 |
| Tensile Elongation, TD: Break, 23°C, 25 µm | >10 % | ISO 527-3 |
| Tensile Elongation, MD: Break, 23°C, 50 µm | >100 % | ISO 527-3 |
| Tensile Elongation, TD: Break, 23°C, 50 µm | >10 % | ISO 527-3 |
| Tensile Elongation, MD: Break, 23°C, 100 µm | >100 % | ISO 527-3 |
| Tensile Elongation, TD: Break, 23°C, 100 µm | >10 % | ISO 527-3 |
| Trouser Tear Resistance @ 23°C, MD: 50 µm | 6.00 N/mm | ISO 6383-1 |
| Trouser Tear Resistance @ 23°C, TD: 50 µm | 8.00 N/mm | ISO 6383-1 |
| Puncture Resistance (23°C, 50.0 µm) | 5 kJ/m² | Internal Method |
Thermal Properties
| Property | Value | Test Method |
| CLTE — Flow below Tg (0.0500mm) | 3.5E-5 cm/cm/°C | ASTM D696 |
| Thermal Conductivity, Through Plane | 0.43 W/m/K | ASTM E1461 |
| Thermal Conductivity, In-Plane | 0.91 W/m/K | ASTM E1461 |
Electrical Properties
| Property | Value | Test Method |
| Volume Resistivity @ 100 V (23°C, 50.0 µm) | 1.0E+16 ohms•cm | ASTM D257 |
| Dielectric Strength @ 0.25 inch electrode (23°C, 50.0 µm) | 200 kV/mm | ASTM D149 |
| Dielectric Constant (23°C, 50.0 µm, 10 MHz) | 3.6 | ASTM D150 |
| Dissipation Factor (23°C, 50.0 µm, 10 MHz) | 1.0E-3 | ASTM D150 |
- Electrical insulation films in high-temperature electronics where dimensional stability is critical
- Precision structural film components requiring controlled thermal expansion
- High-purity barrier layers in chemically aggressive processing environments
- Dielectric insulation substrates requiring high modulus and low moisture uptake
- Flame-resistant insulation films for industrial and aerospace wire and cable applications
Common industries: Electronics, aerospace, industrial manufacturing, medical, semiconductor.
APTIV™ 1102 belongs to the APTIV™ 1100 Series, a family of mineral-filled, semi-crystalline PEEK films engineered for ultra-high-performance applications where dimensional stability, high modulus, and reduced thermal expansion are required. Positioned as a step up from the unfilled APTIV™ 1000 Series, the 1102 grade delivers a higher tensile modulus (up to 5000 MPa MD at 25 µm) and a lower CLTE (3.5E-5 cm/cm/°C), making it well suited for applications requiring precision dimensional control across a thermal operating range.
The film provides excellent high-temperature performance combined with outstanding resistance to radiation, hydrolysis, and chemicals. Electrical insulation properties are strong, with volume resistivity of 1.0E+16 ohms•cm and a dielectric constant of 3.6 at 10 MHz. Thermal conductivity is reported at 0.43 W/m·K through-plane and 0.91 W/m·K in-plane. The material is inherently flame resistant without added flame retardants, produces low smoke toxicity, and is naturally halogen-free with low moisture absorption in film form.
What differentiates APTIV™ 1102 from the APTIV™ 1000 Series films?
APTIV™ 1102 is a mineral-filled grade that delivers a higher tensile modulus (up to 5000 MPa MD at 25 µm versus 2600 MPa for APTIV™ 1000 at the same thickness) and a lower CLTE (3.5E-5 versus 4.75E-5 cm/cm/°C), making it the preferred choice when dimensional stability under thermal cycling is required. The tradeoff is reduced elongation in the TD direction (>10% versus >150% for APTIV™ 1000).
Why does tensile strength matter when selecting a PEEK film?
Tensile strength governs a film's ability to withstand mechanical loads during fabrication — such as handling, laminating, and die-cutting — as well as mechanical stresses in end-use service. APTIV™ 1102 achieves tensile stress at break of 100 MPa (MD) across all listed thicknesses, ensuring consistent mechanical performance even as gauge varies from 12 to 125 µm.
What is the operating temperature range for APTIV™ 1102?
The TDS does not specify an explicit operating temperature range. The CLTE below Tg is reported as 3.5E-5 cm/cm/°C (ASTM D696). Contact H-O Products or the manufacturer for application-specific temperature guidance.
Is APTIV™ 1102 suitable for flame-rated environments?
The TDS states that APTIV™ 1102 films provide inherent flame resistance without added flame retardants and produce low smoke toxicity during combustion, and the material is naturally halogen-free. However, no specific flame rating standards or compliance certifications are listed on the manufacturer's TDS for this material.
How should APTIV™ 1102 be specified?
Specify grade (APTIV™ 1102), thickness, compliance requirements, dimensional tolerances, and finished format.
