APTIV™ 1103
APTIV™ 1103 is a mineral-filled, semi-crystalline film produced from VICTREX™ PEEK polymer, available in thicknesses from 12 to 125 µm with a density of 1.54 g/cm³ — the highest density in the APTIV™ 1100 Series. It provides tensile modulus values up to 5500 MPa (MD, 25 µm and 50 µm) and dielectric strength of 200 kV/mm at 50 µm, with thermal conductivity of 0.61 W/m·K through-plane and 1.3 W/m·K in-plane. Compared to the APTIV™ 1000 Series, APTIV™ 1103 delivers a higher modulus and a lower coefficient of linear thermal expansion.
Key Properties
- Tensile Stress, MD: Break, 23°C, 50 µm: 90.0 MPa (ISO 527-3)
- Tensile Elongation, MD: Break, 23°C, 25 µm: >10 % (ISO 527-3)
- Dielectric Strength @ 0.25 inch electrode (23°C, 50.0 µm): 200 kV/mm (ASTM D149)
- Dielectric Constant (23°C, 50.0 µm, 10 MHz): 3.5 (ASTM D150)
- Film Thickness — Recommended/Available: 12 to 125 µm
- Density (23°C): 1.54 g/cm³ (ISO 1183)
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Physical Properties
| Property | Value | Test Method |
| Density (23°C) | 1.54 g/cm³ | ISO 1183 |
| Water Absorption, Equilibrium, 23°C, 0.0500 mm, 50% RH | 0.090 % | ISO 62 |
| Shrinkage MD TM-VX-84 (200°C, 50.0 µm) | <0.50 % | — |
| Shrinkage TD TM-VX-84 (200°C, 50.0 µm) | <0.50 % | — |
Mechanical Properties
| Property | Value | Test Method |
| Film Thickness — Recommended/Available | 12 to 125 µm | — |
| Tensile Modulus, MD: 23°C, 25 µm | 5500 MPa | ISO 527-3 |
| Tensile Modulus, TD: 23°C, 25 µm | 4500 MPa | ISO 527-3 |
| Tensile Modulus, MD: 23°C, 50 µm | 5500 MPa | ISO 527-3 |
| Tensile Modulus, TD: 23°C, 50 µm | 4500 MPa | ISO 527-3 |
| Tensile Modulus, MD: 23°C, 100 µm | 5000 MPa | ISO 527-3 |
| Tensile Modulus, TD: 23°C, 100 µm | 4500 MPa | ISO 527-3 |
| Tensile Stress, MD: Break, 23°C, 25 µm | 70.0 MPa | ISO 527-3 |
| Tensile Stress, TD: Break, 23°C, 25 µm | 70.0 MPa | ISO 527-3 |
| Tensile Stress, MD: Break, 23°C, 50 µm | 90.0 MPa | ISO 527-3 |
| Tensile Stress, TD: Break, 23°C, 50 µm | 90.0 MPa | ISO 527-3 |
| Tensile Stress, MD: Break, 23°C, 100 µm | 90.0 MPa | ISO 527-3 |
| Tensile Stress, TD: Break, 23°C, 100 µm | 90.0 MPa | ISO 527-3 |
| Tensile Elongation, MD: Break, 23°C, 25 µm | >10 % | ISO 527-3 |
| Tensile Elongation, TD: Break, 23°C, 25 µm | <10 % | ISO 527-3 |
| Tensile Elongation, MD: Break, 23°C, 50 µm | >10 % | ISO 527-3 |
| Tensile Elongation, TD: Break, 23°C, 50 µm | <10 % | ISO 527-3 |
| Tensile Elongation, MD: Break, 23°C, 100 µm | >5.0 % | ISO 527-3 |
| Tensile Elongation, TD: Break, 23°C, 100 µm | <10 % | ISO 527-3 |
| Trouser Tear Resistance @ 23°C, MD: 50 µm | 5.00 N/mm | ISO 6383-1 |
| Trouser Tear Resistance @ 23°C, TD: 50 µm | 6.00 N/mm | ISO 6383-1 |
| Puncture Resistance (23°C, 50.0 µm) | 4 kJ/m² | Internal Method |
Thermal Properties
| Property | Value | Test Method |
| CLTE — Flow below Tg (0.0500mm) | 1.8E-5 cm/cm/°C | ASTM D696 |
| Thermal Conductivity, Through Plane | 0.61 W/m/K | ASTM E1461 |
| Thermal Conductivity, In-Plane | 1.3 W/m/K | ASTM E1461 |
Electrical Properties
| Property | Value | Test Method |
| Volume Resistivity @ 100 V (23°C, 50.0 µm) | 1.0E+16 ohms•cm | ASTM D257 |
| Dielectric Strength @ 0.25 inch electrode (23°C, 50.0 µm) | 200 kV/mm | ASTM D149 |
| Dielectric Constant (23°C, 50.0 µm, 10 MHz) | 3.5 | ASTM D150 |
| Dissipation Factor (23°C, 50.0 µm, 10 MHz) | 1.0E-3 | ASTM D150 |
- Electrical insulation films in high-temperature electronics requiring high stiffness and low thermal expansion
- Thermally conductive dielectric layers in electronic packaging or thermal management assemblies
- Precision structural film components where minimum dimensional change under thermal cycling is critical
- High-purity barrier films in chemically aggressive or radiation-exposed environments
- Flame-resistant insulation films for aerospace and industrial applications
Common industries: Electronics, aerospace, thermal management, industrial manufacturing, semiconductor.
APTIV™ 1103 is part of the APTIV™ 1100 Series of mineral-filled, semi-crystalline PEEK films, representing the highest-density grade in the series at 1.54 g/cm³. It is engineered for ultra-high-performance applications demanding high modulus, dimensional stability under thermal load, and strong electrical insulation in a thin film format.
Compared to both the unfilled APTIV™ 1000 Series and the APTIV™ 1102 grade, APTIV™ 1103 achieves the highest tensile modulus values within the 1100 family — up to 5500 MPa in the machine direction at 25 µm and 50 µm gauges.
The film provides outstanding resistance to radiation, hydrolysis, and chemicals, along with strong electrical insulation and high-purity barrier performance. Thermal conductivity values of 0.61 W/m·K through-plane and 1.3 W/m·K in-plane (ASTM E1461) differentiate this grade from others in the APTIV™ family.
The material carries a CLTE below Tg of 1.8E-5 cm/cm/°C — the lowest in the 1100 Series — confirming exceptional dimensional stability over a thermal range. It is inherently flame resistant without added flame retardants, produces low toxicity combustion products, and is naturally halogen-free with low moisture absorption.
No compliance standards are specified on the manufacturer’s TDS for this material.
Specifications
Physical Properties
| Property | Value | Test Method |
| Density (23°C) | 1.54 g/cm³ | ISO 1183 |
| Water Absorption, Equilibrium, 23°C, 0.0500 mm, 50% RH | 0.090 % | ISO 62 |
| Shrinkage MD TM-VX-84 (200°C, 50.0 µm) | <0.50 % | — |
| Shrinkage TD TM-VX-84 (200°C, 50.0 µm) | <0.50 % | — |
Mechanical Properties
| Property | Value | Test Method |
| Film Thickness — Recommended/Available | 12 to 125 µm | — |
| Tensile Modulus, MD: 23°C, 25 µm | 5500 MPa | ISO 527-3 |
| Tensile Modulus, TD: 23°C, 25 µm | 4500 MPa | ISO 527-3 |
| Tensile Modulus, MD: 23°C, 50 µm | 5500 MPa | ISO 527-3 |
| Tensile Modulus, TD: 23°C, 50 µm | 4500 MPa | ISO 527-3 |
| Tensile Modulus, MD: 23°C, 100 µm | 5000 MPa | ISO 527-3 |
| Tensile Modulus, TD: 23°C, 100 µm | 4500 MPa | ISO 527-3 |
| Tensile Stress, MD: Break, 23°C, 25 µm | 70.0 MPa | ISO 527-3 |
| Tensile Stress, TD: Break, 23°C, 25 µm | 70.0 MPa | ISO 527-3 |
| Tensile Stress, MD: Break, 23°C, 50 µm | 90.0 MPa | ISO 527-3 |
| Tensile Stress, TD: Break, 23°C, 50 µm | 90.0 MPa | ISO 527-3 |
| Tensile Stress, MD: Break, 23°C, 100 µm | 90.0 MPa | ISO 527-3 |
| Tensile Stress, TD: Break, 23°C, 100 µm | 90.0 MPa | ISO 527-3 |
| Tensile Elongation, MD: Break, 23°C, 25 µm | >10 % | ISO 527-3 |
| Tensile Elongation, TD: Break, 23°C, 25 µm | <10 % | ISO 527-3 |
| Tensile Elongation, MD: Break, 23°C, 50 µm | >10 % | ISO 527-3 |
| Tensile Elongation, TD: Break, 23°C, 50 µm | <10 % | ISO 527-3 |
| Tensile Elongation, MD: Break, 23°C, 100 µm | >5.0 % | ISO 527-3 |
| Tensile Elongation, TD: Break, 23°C, 100 µm | <10 % | ISO 527-3 |
| Trouser Tear Resistance @ 23°C, MD: 50 µm | 5.00 N/mm | ISO 6383-1 |
| Trouser Tear Resistance @ 23°C, TD: 50 µm | 6.00 N/mm | ISO 6383-1 |
| Puncture Resistance (23°C, 50.0 µm) | 4 kJ/m² | Internal Method |
Thermal Properties
| Property | Value | Test Method |
| CLTE — Flow below Tg (0.0500mm) | 1.8E-5 cm/cm/°C | ASTM D696 |
| Thermal Conductivity, Through Plane | 0.61 W/m/K | ASTM E1461 |
| Thermal Conductivity, In-Plane | 1.3 W/m/K | ASTM E1461 |
Electrical Properties
| Property | Value | Test Method |
| Volume Resistivity @ 100 V (23°C, 50.0 µm) | 1.0E+16 ohms•cm | ASTM D257 |
| Dielectric Strength @ 0.25 inch electrode (23°C, 50.0 µm) | 200 kV/mm | ASTM D149 |
| Dielectric Constant (23°C, 50.0 µm, 10 MHz) | 3.5 | ASTM D150 |
| Dissipation Factor (23°C, 50.0 µm, 10 MHz) | 1.0E-3 | ASTM D150 |
What differentiates APTIV™ 1103 from APTIV™ 1102 and the APTIV™ 1000 Series?
APTIV™ 1103 is the highest-density grade in the APTIV™ 1100 Series (1.54 g/cm³) and achieves the highest tensile modulus values in the family — up to 5500 MPa MD — along with the lowest CLTE (1.8E-5 cm/cm/°C). It also uniquely reports in-plane thermal conductivity of 1.3 W/m·K, making it the most dimensionally stable and thermally conductive option in the APTIV™ film range.
Why does tensile strength matter when selecting a PEEK film?
Tensile strength determines whether the film can sustain the mechanical demands of fabrication and end-use without failure. APTIV™ 1103 achieves tensile stress at break of 70.0 MPa at 25 µm and 90.0 MPa at 50 and 100 µm gauges. The higher modulus of this grade means it resists deformation at lower stresses, which is important in precision die-cutting and thin-film structural applications.
What is the operating temperature range for APTIV™ 1103?
The TDS does not specify an explicit operating temperature range. The CLTE below Tg is reported as 1.8E-5 cm/cm/°C (ASTM D696). Contact H-O Products or the manufacturer for application-specific temperature guidance.
Is APTIV™ 1103 suitable for flame-rated environments?
The TDS states that APTIV™ 1103 films provide inherent flame resistance without added flame retardants and produce low toxicity combustion products, and the material is naturally halogen-free. However, no specific flame rating standards or compliance certifications are listed on the manufacturer's TDS for this material.
How should APTIV™ 1103 be specified?
Specify grade (APTIV™ 1103), thickness, compliance requirements, dimensional tolerances, and finished format
