APTIV™ 2000
APTIV™ 2000 is an unfilled, amorphous film manufactured from VICTREX™ PEEK polymer, available in thicknesses from 6 to 300 µm with a density of 1.26 g/cm³. It delivers tensile elongation exceeding 200% in all directions across all listed gauges, with tensile stress at break up to 130 MPa (MD/TD at 25 µm) and a dielectric strength of up to 270 kV/mm at 25 µm. This film will crystallize irreversibly if exposed to temperatures above its glass transition temperature of approximately 143°C (289°F).
Key Properties
- Tensile Stress, MD: 23°C, 25 µm: 130 MPa (ISO 527-3)
- Tensile Elongation, MD: Break, 23°C, 25 µm: >200 % (ISO 527-3)
- Dielectric Strength @ 0.25 inch electrode, 23°C, 25 µm: 270 kV/mm (ASTM D149)
- Dielectric Constant (23°C, 50.0 µm, 10 MHz): 3.3 (ASTM D150)
- Film Thickness — Recommended/Available: 6 to 300 µm
- Density (23°C): 1.26 g/cm³ (ISO 1183)
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- Specifications
- Applications
- General Info
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Physical Properties
| Property | Value | Test Method |
| Density (23°C) | 1.26 g/cm³ | ISO 1183 |
| Water Absorption, Equilibrium, 23°C, 0.0500 mm, 50% RH | 0.21 % | ISO 62 |
| Shrinkage MD TM-VX-84 (200°C, 50.0 µm) | <10 % | — |
| Shrinkage TD TM-VX-84 (200°C, 50.0 µm) | <5.0 % | — |
Mechanical Properties
| Property | Value | Test Method |
| Film Thickness — Recommended/Available | 6 to 300 µm | — |
| Tensile Modulus, MD: 23°C, 25 µm | 1800 MPa | ISO 527-3 |
| Tensile Modulus, TD: 23°C, 25 µm | 1800 MPa | ISO 527-3 |
| Tensile Modulus, MD: 23°C, 50 µm | 1800 MPa | ISO 527-3 |
| Tensile Modulus, TD: 23°C, 50 µm | 1800 MPa | ISO 527-3 |
| Tensile Modulus, MD: 23°C, 100 µm | 1600 MPa | ISO 527-3 |
| Tensile Modulus, TD: 23°C, 100 µm | 1600 MPa | ISO 527-3 |
| Tensile Stress, MD: 23°C, 25 µm | 130 MPa | ISO 527-3 |
| Tensile Stress, TD: 23°C, 25 µm | 130 MPa | ISO 527-3 |
| Tensile Stress, MD: 23°C, 50 µm | 120 MPa | ISO 527-3 |
| Tensile Stress, TD: 23°C, 50 µm | 120 MPa | ISO 527-3 |
| Tensile Stress, MD: 23°C, 100 µm | 120 MPa | ISO 527-3 |
| Tensile Stress, TD: 23°C, 100 µm | 120 MPa | ISO 527-3 |
| Tensile Elongation, MD: Break, 23°C, 25 µm | >200 % | ISO 527-3 |
| Tensile Elongation, TD: Break, 23°C, 25 µm | >200 % | ISO 527-3 |
| Tensile Elongation, MD: Break, 23°C, 50 µm | >200 % | ISO 527-3 |
| Tensile Elongation, TD: Break, 23°C, 50 µm | >200 % | ISO 527-3 |
| Tensile Elongation, MD: Break, 23°C, 100 µm | >200 % | ISO 527-3 |
| Tensile Elongation, TD: Break, 23°C, 100 µm | >200 % | ISO 527-3 |
| Trouser Tear Resistance @ 23°C, MD: 50 µm | 6.00 N/mm | ISO 6383-1 |
| Trouser Tear Resistance @ 23°C, TD: 50 µm | 6.00 N/mm | ISO 6383-1 |
| Puncture Resistance (23°C, 50.0 µm) | 40 kJ/m² | Internal Method |
Thermal Properties
| Property | Value | Test Method |
| Peak Crystallization Temperature (DSC) | 143 °C | — |
| CLTE — Flow below Tg (0.0500mm) | 6.0E-5 cm/cm/°C | ASTM D696 |
Electrical Properties
| Property | Value | Test Method |
| Volume Resistivity @ 100 V (23°C, 50.0 µm) | 2.0E+16 ohms•cm | ASTM D257 |
| Dielectric Strength @ 0.25 inch electrode, 23°C, 25 µm | 270 kV/mm | ASTM D149 |
| Dielectric Strength @ 0.25 inch electrode, 23°C, 50 µm | 190 V | ASTM D149 |
| Dielectric Strength @ 0.25 inch electrode, 23°C, 100 µm | 120 V | ASTM D149 |
| Dielectric Constant (23°C, 50.0 µm, 10 MHz) | 3.3 | ASTM D150 |
| Dissipation Factor (23°C, 50.0 µm, 10 MHz) | 3.0E-3 | ASTM D150 |
| Dielectric Breakdown, 23°C, 25.0 µm | 6750 V | — |
| Dielectric Breakdown, 23°C, 50.0 µm | 9500 V | — |
| Dielectric Breakdown, 23°C, 125.0 µm | 15000 V | — |
- Thermoformable film components for applications requiring high elongation and impact resistance
- Dielectric insulation films in electronic assemblies where conformability and flexibility are required
- High-purity barrier films in medical, semiconductor, or chemical processing equipment
- Lightweight flexible film insulation for wire and cable in high-performance systems
- Flame-resistant conformable film layers in aerospace or industrial assemblies
Common industries: Electronics, aerospace, medical, semiconductor, industrial manufacturing.
APTIV™ 2000 Series films are unfilled, amorphous films produced from VICTREX™ PEEK polymer, designed for engineers requiring high-performance materials in demanding, ultra-high-performance applications.
As an amorphous grade, APTIV™ 2000 exhibits higher elongation than semi-crystalline APTIV™ grades — exceeding 200% in both MD and TD directions across all gauges from 25 to 100 µm — along with excellent impact resistance reflected in its puncture resistance of 40 kJ/m² at 50 µm. The broad thickness range from 6 to 300 µm supports design flexibility across a wide range of applications.
An important processing and use consideration applies to this grade: APTIV™ 2000 will crystallize if exposed to temperatures above its glass transition temperature of approximately 143°C (289°F). This crystallization is not reversible without re-melting the material, so temperature exposure during both secondary processing and end-use must be carefully controlled.
The film exhibits outstanding resistance to radiation, hydrolysis, and chemicals, along with excellent electrical insulation and high-purity barrier properties. The CLTE below Tg is 6.0E-5 cm/cm/°C and the peak crystallization temperature (DSC) is 143°C. The material is inherently flame resistant without added flame retardants, produces low toxicity combustion products, and is naturally halogen-free with low moisture absorption.
What differentiates APTIV™ 2000 from the APTIV™ 1000 Series and APTIV™ 2100?
APTIV™ 2000 is an amorphous PEEK film, which gives it significantly higher elongation (>200% in all directions versus >150% for APTIV™ 1000) and higher puncture resistance (40 kJ/m² versus 26 kJ/m²), making it the most impact-resistant and conformable option in the APTIV™ range. However, being amorphous, it will permanently crystallize above 143°C — a critical processing and use constraint not present in semi-crystalline grades. Compared to APTIV™ 2100, APTIV™ 2000 is unfilled and offers a lower modulus with a wider thickness range.
Why does tensile strength matter when selecting a PEEK film?
Tensile strength governs performance during forming, handling, and end-use mechanical loading. APTIV™ 2000 achieves tensile stress values of 120–130 MPa across its gauges, paired with elongation exceeding 200% — making it well suited for thermoforming and deep-draw applications where the film must stretch significantly without tearing before achieving its final geometry.
What is the operating temperature range for APTIV™ 2000?
The TDS identifies a peak crystallization temperature (DSC) of 143°C. APTIV™ 2000 will irreversibly crystallize if exposed to temperatures above approximately 143°C (289°F) during processing or end use. The CLTE below Tg is 6.0E-5 cm/cm/°C (ASTM D696). Applications must be designed to remain below this temperature threshold.
Is APTIV™ 2000 suitable for flame-rated environments?
The TDS states that APTIV™ 2000 films provide inherent flame resistance without added flame retardants and produce low toxicity combustion products, and the material is naturally halogen-free. However, no specific flame rating standards or compliance certifications are listed on the manufacturer's TDS for this material.
How should APTIV™ 2000 be specified?
Specify grade (APTIV™ 2000), thickness, compliance requirements, dimensional tolerances, finished format, and confirm that application temperature exposure remains below 143°C (289°F).
