BERGQUIST GAP PAD TGP 1000VOUS Ultra-Soft Viscoelastic Thermally Conductive Gap Filler (formerly GAP PAD VO ULTRA SOFT)
BERGQUIST GAP PAD TGP 1000VOUS is an ultra-conformable, gel-like thermally conductive gap filler with 1.0 W/(m·K) thermal conductivity and a Shore 00 hardness of 5 — the softest grade in the Gap Pad TGP family. The viscoelastic material delivers thermal impedance of 1.68 °C·in²/W at 0.040″/30% deflection with 6,000 VAC dielectric breakdown voltage and excellent vibration dampening and shock absorbing characteristics. Offered at 0.508 to 6.35 mm thickness across an operating range of -60°C to +200°C, with UL 94 V-0 flammability.
Key Properties
- Thermal Conductivity: 1.0 W/(m·K) (ASTM D5470)
- Thermal Impedance @ 0.040 in, 30% Deflection: 1.68 °C·in²/W
- Hardness: 5 Shore 00 (ASTM D2240)
- Young’s Modulus: 55 kPa (8 psi) (ASTM D575)
- Dielectric Breakdown Voltage: 6,000 VAC (ASTM D149)
- Operating Temperature Range: -60°C to +200°C
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- Specifications
- Applications
- General Info
- FAQs
Physical Properties
| Property | Value | Test Method |
| Technology | Silicone | — |
| Appearance | Mauve / Pink | — |
| Reinforcement Carrier | Fiberglass | — |
| Thickness | 0.508 to 6.35 mm | ASTM D374 |
| Inherent Surface Tack | 1 (1 sided) | — |
| Operating Temperature Range | -60°C to +200°C | — |
| Hardness, Shore 00 (30-sec delay, bulk rubber) | 5 | ASTM D2240 |
| Heat Capacity | 1.0 J/g·K | ASTM E1269 |
| Density, Bulk Rubber | 1.6 g/cc | ASTM D792 |
Mechanical Properties
| Property | Value | Test Method |
| Young’s Modulus | 55 kPa (8 psi) | ASTM D575 |
Thermal Properties
| Property | Value | Test Method |
| Thermal Conductivity | 1.0 W/(m·K) | ASTM D5470 |
| Thermal Impedance @ 0.040 in — 10% Deflection | 1.97 °C·in²/W | ASTM D5470 |
| Thermal Impedance @ 0.040 in — 20% Deflection | 1.87 °C·in²/W | ASTM D5470 |
| Thermal Impedance @ 0.040 in — 30% Deflection | 1.68 °C·in²/W | ASTM D5470 |
Electrical Properties
| Property | Value | Test Method |
| Dielectric Breakdown Voltage | 6,000 VAC | ASTM D149 |
| Dielectric Constant @ 1,000 Hz | 5.5 | ASTM D150 |
| Volume Resistivity | 1 × 10¹¹ ohm·meter | ASTM D257 |
Flame & Fire Performance
| Property | Value | Test Method |
| Flammability | V-0 | UL 94 |
Storage
| Property | Value | Test Method |
| Shelf Life (Optimal Storage) | 12 months at 25°C (±3), 50% RH (±10) | — |
Compliance
- UL 94 — Compliant (V-0)
- Telecommunications equipment thermal interface
- Computer and peripheral thermal management
- Power conversion thermal interface
- Thermal coupling between heat-generating semiconductors or magnetic components and a heat sink
- Heat transfer to a frame, chassis, or heat spreader
- High-voltage bare-leaded device isolation with vibration dampening
Common industries: telecommunications, computing, power conversion electronics, and high-voltage electronics assembly.
BERGQUIST GAP PAD TGP 1000VOUS is an ultra-conformable, thermally conductive material for filling air gaps, recommended for applications that require a minimum amount of pressure on components.
The viscoelastic, gel-like nature of the material delivers excellent low-stress vibration dampening and shock absorbing characteristics, while the electrically isolating construction allows use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices. The fiberglass reinforcement provides puncture, shear, and tear resistance despite the very low hardness.
Mechanical and physical performance includes 5 Shore 00 hardness (30-second delay, bulk rubber) — the lowest in the Gap Pad TGP family — with 1.6 g/cc bulk rubber density, 1.0 J/g·K heat capacity, and a “gel-like” Young’s modulus of 55 kPa (8 psi). Electrically, dielectric breakdown voltage is 6,000 VAC — the highest in the Gap Pad TGP family — with dielectric constant at 1,000 Hz of 5.5 and volume resistivity of 1 × 10¹¹ ohm-meter.
Thermally, the material delivers 1.0 W/(m·K) thermal conductivity per ASTM D5470 with thermal impedance at 0.040″ thickness of 1.97, 1.87, and 1.68 °C·in²/W at 10%, 20%, and 30% deflection respectively. Operating temperature range is -60°C to +200°C. The pad is offered at 0.508 to 6.35 mm thickness, with inherent surface tack rated 1 (1 sided), in sheet form or die-cut parts. Shelf life is 12 months at 25°C (±3) and 50% RH (±10).
Compliant with UL 94 V-0 (flame retardancy) and the listed ASTM test methods: ASTM D374, D2240, D792, D575, D149, D150, D257, D5470, and E1269.
What differentiates GAP PAD TGP 1000VOUS from the firmer TGP 3000 and TGP 5000 grades?
TGP 1000VOUS is the ultra-soft, viscoelastic grade in the Gap Pad TGP family, with a Shore 00 hardness of 5 and a gel-like 55 kPa Young's modulus — far softer than the 30 Shore 00 / 180 kPa TGP 3000 and the 35 Shore 00 / 310 kPa TGP 5000. The very low hardness produces minimum stress on components, excellent vibration dampening, and shock absorption, making the grade specifically suited to applications with fragile leads or strict low-pressure requirements.
The trade-off is lower thermal conductivity (1.0 W/m·K), but the grade compensates with the highest dielectric breakdown voltage in the family at 6,000 VAC, supporting isolation between heat sinks and high-voltage bare-leaded devices.
Why does thermal conductivity matter in material selection?
The function of a Gap Pad is to fill the air gap between a heat-generating component and a heat sink while transferring heat across that gap. Thermal conductivity sets the bulk heat transport, and thermal impedance — measured here at multiple deflection levels — captures real-world performance. TGP 1000VOUS delivers 1.0 W/(m·K) and 1.68 °C·in²/W at 0.040" with 30% deflection. The defining selection criterion for this grade is not maximum thermal conductivity but minimum mechanical stress on components, with thermal performance optimized within that constraint.
What is the operating temperature range for GAP PAD TGP 1000VOUS?
he operating temperature range is -60°C to +200°C.
Is GAP PAD TGP 1000VOUS suitable for high-voltage isolation and flame-rated electronics environments?
Yes. The material delivers 6,000 VAC dielectric breakdown voltage and 1 × 10¹¹ ohm·meter volume resistivity, supporting isolation between heat sinks and high-voltage bare-leaded devices, and is rated UL 94 V-0 for flammability — suitable for telecommunications, computer, and power conversion assemblies that require both flame retardancy and high-voltage isolation.
How should GAP PAD TGP 1000VOUS be specified?
Specify grade (BERGQUIST GAP PAD TGP 1000VOUS), thickness (within 0.508 to 6.35 mm range), part geometry (sheet or die-cut), inherent tack configuration (1 side), target deflection (which sets effective thermal impedance), dielectric performance requirements, UL 94 V-0 flame rating, operating temperature range, and finished format.
