BERGQUIST GAP PAD TGP 1500 Un-Reinforced Thermally Conductive Gap Filler (formerly GAP PAD 1500)
BERGQUIST GAP PAD TGP 1500 is an un-reinforced, conformable thermally conductive gap filler with 1.5 W/(m·K) thermal conductivity and natural tack on both sides. The un-reinforced construction provides additional compliancy compared to fiberglass-reinforced grades, with thermal impedance of 1.33 °C·in²/W at 0.040″/30% deflection and dielectric breakdown voltage greater than 6,000 VAC. Offered at 0.508 to 5.08 mm thickness across an operating range of -60°C to +200°C, with UL 94 V-0 flammability.
Key Properties
- Thermal Conductivity: 1.5 W/(m·K) (ASTM D5470)
- Thermal Impedance @ 0.040 in, 30% Deflection: 1.33 °C·in²/W
- Hardness: 40 Shore 00 (ASTM D2240)
- Young’s Modulus: 310 kPa (45 psi) (ASTM D575)
- Dielectric Breakdown Voltage: > 6,000 VAC (ASTM D149)
- Operating Temperature Range: -60°C to +200°C
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- Specifications
- Applications
- General Info
- FAQs
Physical Properties
| Property | Value | Test Method |
| Technology | Silicone | — |
| Appearance | Black | — |
| Reinforcement Carrier | None (Un-reinforced) | — |
| Thickness | 0.508 to 5.08 mm | ASTM D374 |
| Inherent Surface Tack | 2 (1 sided) | — |
| Operating Temperature Range | -60°C to +200°C | — |
| Hardness, Shore 00 (30-sec delay, bulk rubber) | 40 | ASTM D2240 |
| Heat Capacity | 1.0 J/g·K | ASTM E1269 |
| Density, Bulk Rubber | 2.1 g/cc | ASTM D792 |
Mechanical Properties
| Property | Value | Test Method |
| Young’s Modulus | 310 kPa (45 psi) | ASTM D575 |
Thermal Properties
| Property | Value | Test Method |
| Thermal Conductivity | 1.5 W/(m·K) | ASTM D5470 |
| Thermal Impedance @ 0.040 in — 10% Deflection | 1.62 °C·in²/W | ASTM D5470 |
| Thermal Impedance @ 0.040 in — 20% Deflection | 1.50 °C·in²/W | ASTM D5470 |
| Thermal Impedance @ 0.040 in — 30% Deflection | 1.33 °C·in²/W | ASTM D5470 |
Electrical Properties
| Property | Value | Test Method |
| Dielectric Breakdown Voltage | > 6,000 VAC | ASTM D149 |
| Dielectric Constant @ 1,000 Hz | 5.5 | ASTM D150 |
| Volume Resistivity | 1 × 10¹¹ ohm·meter | ASTM D257 |
Flame & Fire Performance
| Property | Value | Test Method |
| Flammability | V-0 | UL 94 |
Storage
| Property | Value | Test Method |
| Shelf Life (Optimal Storage) | 180 days at 25°C (±3), 50% RH (±10) | — |
Compliance
- UL 94 — Compliant (V-0)
- Telecommunications equipment thermal interface
- Computer and peripheral thermal management
- Power conversion thermal interface
- RDRAM memory module and chip scale package thermal pads
- Heat transfer to frame, chassis, or heat spreader
Common industries: telecommunications, computing, power conversion electronics, and memory module manufacturing.
BERGQUIST GAP PAD TGP 1500 is a thermally conductive, un-reinforced gap filling material engineered with an ideal filler blend that provides a low-modulus characteristic, maintaining optimal thermal performance while allowing for easy handling. The natural tack on both sides of the material delivers good compliance to adjacent surfaces, minimizing interfacial resistance. The un-reinforced construction — without a fiberglass carrier — produces additional compliancy versus the reinforced grades in the Gap Pad TGP family.
Mechanical and physical performance includes 40 Shore 00 hardness (30-second delay, bulk rubber), 2.1 g/cc bulk rubber density, 1.0 J/g·K heat capacity, and a Young’s modulus of 310 kPa (45 psi). Electrically, dielectric breakdown voltage is greater than 6,000 VAC, dielectric constant at 1,000 Hz is 5.5, and volume resistivity is 1 × 10¹¹ ohm-meter.
Thermally, the material delivers 1.5 W/(m·K) thermal conductivity per ASTM D5470 with thermal impedance at 0.040″ thickness of 1.62, 1.50, and 1.33 °C·in²/W at 10%, 20%, and 30% deflection respectively. Operating temperature range is -60°C to +200°C. The pad is offered at 0.508 to 5.08 mm thickness, with inherent surface tack rated 2 (1 sided), in sheet form or die-cut parts. Shelf life is 180 days at 25°C (±3) and 50% RH (±10).
Compliant with UL 94 V-0 (flame retardancy) and the listed ASTM test methods: ASTM D374, D2240, D792, D575, D149, D150, D257, D5470, and E1269.
What differentiates GAP PAD TGP 1500 from the fiberglass-reinforced TGP 3000, TGP 5000, and TGP 1000VOUS grades?
TGP 1500 is the un-reinforced grade in the Gap Pad TGP family — without a fiberglass carrier — which provides additional compliancy and conformability to adjacent surfaces compared to the reinforced grades. It delivers 1.5 W/(m·K) thermal conductivity at a Shore 00 hardness of 40 and 310 kPa Young's modulus, with natural tack on both sides that minimizes interfacial resistance. Dielectric breakdown voltage is greater than 6,000 VAC, the highest in the family. The trade-off versus the fiberglass-reinforced grades is reduced handling robustness and lower puncture, shear, and tear resistance, which is why TGP 1500 is offered with a shorter 180-day shelf life rather than the 12 months of the reinforced grades.
Why does thermal conductivity matter in material selection?
The function of a Gap Pad is to fill the air gap between a heat-generating component and a heat sink while transferring heat across that gap. Thermal conductivity sets the bulk heat transport, and thermal impedance — measured here at multiple deflection levels — captures real-world performance. TGP 1500 delivers 1.5 W/(m·K) and 1.33 °C·in²/W at 0.040" with 30% deflection, with the un-reinforced construction allowing greater compliance to surface topography and reducing interfacial resistance at low contact pressures.
What is the operating temperature range for GAP PAD TGP 1500?
The operating temperature range is -60°C to +200°C.
Is GAP PAD TGP 1500 suitable for high-voltage isolation and flame-rated electronics environments?
Yes. The material delivers greater than 6,000 VAC dielectric breakdown voltage and 1 × 10¹¹ ohm·meter volume resistivity, and is rated UL 94 V-0 for flammability — suitable for telecommunications, computer, power conversion, and memory module assemblies that require both flame retardancy and high-voltage isolation.
How should GAP PAD TGP 1500 be specified?
Specify grade (BERGQUIST GAP PAD TGP 1500), thickness (within 0.508 to 5.08 mm range), part geometry (sheet or die-cut), un-reinforced construction, inherent tack configuration, target deflection (which sets effective thermal impedance), dielectric performance requirements, UL 94 V-0 flame rating, operating temperature range, and finished format.
