BERGQUIST GAP PAD TGP 2200SF Silicone-Free Electrically Isolating Thermally Conductive Gap Filler (formerly GAP PAD 2200SF)
BERGQUIST GAP PAD TGP 2200SF is a silicone-free, electrically isolating gap filling material with 2.0 W/(m·K) thermal conductivity, designed for silicone-sensitive applications such as disk drives, fiber optic modules and assemblies near electrical contacts, relays and DC brush motors. The fiberglass-reinforced pad offers medium compliance for uneven topologies and high stack-up tolerances, with reduced tack on one side for burn-in and easy rework and dielectric breakdown voltage greater than 5,000 VAC. Offered at 0.254 to 3.175 mm thickness across an operating range of -60°C to +125°C, with UL 94 V-0 flammability.
Key Properties
- Thermal Conductivity: 2.0 W/(m·K) (ASTM D5470)
- Technology: Silicone-free, fiberglass-reinforced
- Hardness: 70 Shore 00 (ASTM D2240)
- Young’s Modulus: 228 kPa (33 psi) (ASTM D575)
- Dielectric Breakdown Voltage: > 5,000 VAC (ASTM D149)
- Operating Temperature Range: -60°C to +125°C
- Thickness: 0.254 to 3.175 mm
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- Specifications
- Applications
- General Info
- FAQs
Physical Properties
| Property | Value | Test Method |
| Technology | Silicone-free | — |
| Appearance | Green | — |
| Reinforcement Carrier | Fiberglass | — |
| Thickness | 0.254 to 3.175 mm | ASTM D374 |
| Inherent Surface Tack | 2 (2 sides; reduced tack on one side) | — |
| Operating Temperature Range | -60°C to +125°C | — |
| Hardness, Shore 00 (30-sec delay, bulk rubber) | 70 | ASTM D2240 |
| Heat Capacity | 1.0 J/g·K | ASTM E1269 |
| Density | 2.8 g/cc | ASTM D792 |
Mechanical Properties
| Property | Value | Test Method |
| Young’s Modulus | 228 kPa (33 psi) | ASTM D575 |
Thermal Properties
| Property | Value | Test Method |
| Thermal Conductivity | 2.0 W/(m·K) | ASTM D5470 |
Electrical Properties
| Property | Value | Test Method |
| Dielectric Breakdown Voltage | > 5,000 VAC | ASTM D149 |
| Dielectric Constant @ 1,000 Hz | 6.0 | ASTM D150 |
| Volume Resistivity | 1 × 10⁸ ohm·meter | ASTM D257 |
Flame & Fire Performance
| Property | Value | Test Method |
| Flammability | V-0 | UL 94 |
Storage
| Property | Value | Test Method |
| Shelf Life (Optimal Storage) | 12 months at 25°C (±3), 50% RH (±10) | — |
Compliance
- UL 94 — Compliant (V-0)
- Digital disk drive thermal management
- Assemblies in proximity to electrical contacts: DC brush motors, connectors, relays
- Fiber optic module thermal interface
- Silicone-sensitive electronics with uneven topologies and high stack-up tolerances
- Burn-in and rework processes that need a reduced-tack, reworkable pad
Common industries: data storage, optical communications, motor and relay assemblies, and any electronics where silicone outgassing near contacts or optics cannot be tolerated.
BERGQUIST GAP PAD TGP 2200SF is a thermally conductive, electrically isolating, silicone-free gap filling polymer specially designed for silicone-sensitive applications. With 2.0 W/(m·K) thermal conductivity and medium compliance, the material is ideal for applications with uneven topologies and high stack-up tolerances, and it removes the risk of siloxane migration onto nearby electrical contacts, optics or disk-drive surfaces.
The pad is fiberglass-reinforced for easy material handling and added durability during assembly, has natural tack on both sides with reduced tack on one side to allow burn-in processes and easy rework, and is available with a protective liner on both sides.
Physical performance includes 70 Shore 00 hardness (30-second delay, bulk rubber), 2.8 g/cc density, 1.0 J/g·K heat capacity and a Young’s modulus of 228 kPa (33 psi). Electrically, dielectric breakdown voltage is greater than 5,000 VAC, dielectric constant at 1,000 Hz is 6.0, and volume resistivity is 1 × 10⁸ ohm-meter.
Thermally, the material delivers 2.0 W/(m·K) thermal conductivity per ASTM D5470 across an operating temperature range of -60°C to +125°C. Available in 8″ x 16″ sheet form or die-cut parts at thicknesses from 0.254 to 3.175 mm. Shelf life is 12 months at 25°C (±3) and 50% RH (±10).
Compliant with UL 94 V-0 (flame retardancy) and the listed ASTM test methods: ASTM D374, D2240, D792, D575, D149, D150, D257, D5470, and E1269.
What differentiates GAP PAD TGP 2200SF from the silicone-free TGP 3004SF?
Both are silicone-free gap fillers for silicone-sensitive assemblies, but they are built differently. TGP 2200SF is a 2.0 W/(m·K) fiberglass-reinforced pad with tack on both sides (reduced on one side for rework) and a wider low-temperature range of -60°C to +125°C. TGP 3004SF is a 3.0 W/(m·K) pad on a 0.25 mil PET carrier with tack on one side only and a -40°C to +125°C range. Choose TGP 2200SF when the assembly needs a reworkable, electrically isolating pad with sturdy handling; choose TGP 3004SF when the thermal budget calls for the higher conductivity.
Why choose a silicone-free gap filler?
Silicone-based thermal materials can release low-molecular-weight siloxanes that outgas or migrate onto nearby surfaces. Near electrical contacts such as relays, connectors and DC brush motor commutators, that migration can form insulating deposits that cause contact failure; in disk drives and fiber optic modules it can contaminate heads and lenses. TGP 2200SF is silicone-free by design, so it delivers gap-filling thermal performance without introducing silicone into the assembly.
What is the operating temperature range for GAP PAD TGP 2200SF?
The operating temperature range is -60°C to +125°C.
Is GAP PAD TGP 2200SF suitable for flame-rated electronics environments?
Yes. The material is rated UL 94 V-0 for flammability, making it suitable for data storage, optical, motor control and other UL-rated assemblies that require a flame-retardant thermal gap filler.
How should GAP PAD TGP 2200SF be specified?
Specify grade (BERGQUIST GAP PAD TGP 2200SF), thickness (within 0.254 to 3.175 mm), part geometry (sheet or die-cut), inherent tack configuration (which side faces the reworkable surface), dielectric and thermal performance requirements, UL 94 V-0 flame rating, operating temperature range, and finished format.
