BERGQUIST GAP PAD TGP 3000 Soft “S-Class” Reinforced Thermally Conductive Gap Filler (formerly GAP PAD 3000S30)
BERGQUIST GAP PAD TGP 3000 is a fiberglass-reinforced, soft “S-Class” gap filling material with 3.0 W/(m·K) thermal conductivity, engineered for high-performance, low-stress applications using fixed standoff or clip mounting. The pad delivers exceptional thermal performance at low pressures, with dielectric breakdown voltage greater than 3,000 VAC and natural inherent tack on both sides to eliminate the need for thermally-impeding adhesive layers. Offered at 0.254 to 3.175 mm thickness across an operating range of -60°C to +200°C, with UL 94 V-0 flammability.
Key Properties
- Thermal Conductivity: 3.0 W/(m·K) (ASTM D5470)
- Hardness: 30 Shore 00 (ASTM D2240)
- Young’s Modulus: 180 kPa (26 psi) (ASTM D575)
- Dielectric Breakdown Voltage: > 3,000 VAC (ASTM D149)
- Operating Temperature Range: -60°C to +200°C
- Thickness: 0.254 to 3.175 mm
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- Specifications
- Applications
- General Info
- FAQs
Physical Properties
| Property | Value | Test Method |
| Technology | Silicone | — |
| Appearance | Light blue | — |
| Reinforcement Carrier | Fiberglass | — |
| Thickness | 0.254 to 3.175 mm | ASTM D374 |
| Inherent Surface Tack | 2 (2 sides) | — |
| Operating Temperature Range | -60°C to +200°C | — |
| Hardness, Shore 00 (30-sec delay, bulk rubber) | 30 | ASTM D2240 |
| Heat Capacity | 1.0 J/g·K | ASTM E1269 |
| Density | 3.2 g/cc | ASTM D792 |
Mechanical Properties
| Property | Value | Test Method |
| Young’s Modulus | 180 kPa (26 psi) | ASTM D575 |
Thermal Properties
| Property | Value | Test Method |
| Thermal Conductivity | 3.0 W/(m·K) | ASTM D5470 |
Electrical Properties
| Property | Value | Test Method |
| Dielectric Breakdown Voltage | > 3,000 VAC | ASTM D149 |
| Dielectric Constant @ 1,000 Hz | 7.0 | ASTM D150 |
| Volume Resistivity | 1 × 10⁹ ohm·meter | ASTM D257 |
Flame & Fire Performance
| Property | Value | Test Method |
| Flammability | V-0 | UL 94 |
Storage
| Property | Value | Test Method |
| Shelf Life (Optimal Storage) | 12 months at 25°C (±3), 50% RH (±10) | — |
Compliance
- UL 94 — Compliant (V-0)
- Thermal interface between processors or server S-RAMs and heat sinks
- Mass storage drive thermal management
- Wireline and wireless communications hardware thermal interface
- Notebook computer thermal pads
- BGA package thermal management
- Power conversion thermal interface
Common industries: computing, telecommunications, server and storage hardware, and power conversion electronics.
BERGQUIST GAP PAD TGP 3000 is a thermally conductive, reinforced, soft “S-Class” gap filling material that offers exceptional thermal performance at low pressures due to an all-new 3 W/m·K filler package and low-modulus resin formulation. The material is fiberglass-reinforced to enhance handling, puncture, shear, and tear resistance, and is well suited for high-performance, low-stress applications that typically use fixed standoff or clip mounting.
The conformable yet elastic nature of the pad supports excellent interfacing and wet-out characteristics, even on surfaces with high roughness and/or topography.
Mechanical and physical performance includes 30 Shore 00 hardness (30-second delay, bulk rubber), 3.2 g/cc density, 1.0 J/g·K heat capacity, and a Young’s modulus of 180 kPa (26 psi). Electrically, dielectric breakdown voltage is greater than 3,000 VAC, dielectric constant at 1,000 Hz is 7.0, and volume resistivity is 1 × 10⁹ ohm-meter.
Thermally, the material delivers 3.0 W/(m·K) thermal conductivity per ASTM D5470 across an operating temperature range of -60°C to +200°C. The pad is offered with natural inherent tack on both sides (rated 2 / 2 sides), supplied with protective liners on both sides; the top side has reduced tack for ease of handling. Available in sheet form or die-cut parts at thicknesses from 0.254 to 3.175 mm. Shelf life is 12 months at 25°C (±3) and 50% RH (±10).
Compliant with UL 94 V-0 (flame retardancy) and the listed ASTM test methods: ASTM D374, D2240, D792, D575, D149, D150, D257, D5470, and E1269.
What differentiates GAP PAD TGP 3000 from the higher-conductivity TGP 5000 or the ultra-soft TGP 1000VOUS?
TGP 3000 is the 3.0 W/(m·K) "S-Class" soft gap filler in the family, sitting between the ultra-soft 1.0 W/(m·K) TGP 1000VOUS and the higher-conductivity 5.0 W/(m·K) TGP 5000. At 30 Shore 00 with a 180 kPa Young's modulus, it is firmer than the gel-like TGP 1000VOUS (5 Shore 00, 55 kPa) but softer than TGP 5000 (35 Shore 00, 310 kPa). The grade is specifically engineered for high-performance, low-stress applications using fixed standoff or clip mounting, with natural inherent tack on both sides that eliminates the need for adhesive layers.
Why does thermal conductivity matter in material selection?
The function of a Gap Pad is to fill the air gap between a heat-generating component and a heat sink while transferring heat across that gap. Thermal conductivity sets the bulk heat transport, with thermal resistance proportional to gap thickness; thinner gaps and higher conductivity both reduce thermal resistance. TGP 3000 delivers 3.0 W/(m·K), supporting low thermal resistance over the 0.254 to 3.175 mm thickness range, and the low-modulus formulation maintains good wet-out at the low contact pressures characteristic of fixed-standoff and clip-mounted assemblies.
What is the operating temperature range for GAP PAD TGP 3000?
The operating temperature range is -60°C to +200°C.
Is GAP PAD TGP 3000 suitable for flame-rated electronics environments?
Yes. The material is rated UL 94 V-0 for flammability, making it suitable for processors, server hardware, communications equipment, notebook computers, and other UL-rated assemblies that require flame-retardant thermal gap fillers.
How should GAP PAD TGP 3000 be specified?
Specify grade (BERGQUIST GAP PAD TGP 3000), thickness (within 0.254 to 3.175 mm range), part geometry (sheet or die-cut), inherent tack configuration (2 sides), dielectric and thermal performance requirements, UL 94 V-0 flame rating, operating temperature range, and finished format.
