BERGQUIST GAP PAD TGP 3000ULM Ultra-Low Modulus Extra-Soft Thermally Conductive Gap Filler
BERGQUIST GAP PAD TGP 3000ULM is a soft, ultra-low modulus gap filling material with 3.0 W/(m·K) thermal conductivity, formulated for high-performance applications that require low assembly stress. At 20 Shore 00 with a Young’s modulus of 105 kPa, the pad conforms to rough or irregular surfaces at low pressure, delivering thermal impedance of 0.55 °C·in²/W at 10% deflection with dielectric breakdown voltage greater than 6,000 VAC. Offered with or without fiberglass reinforcement at 1.0 to 4.0 mm thickness across an operating range of -60°C to +200°C, with UL 94 V-0 flammability.
Key Properties
- Thermal Conductivity: 3.0 W/(m·K) (ASTM D5470)
- Thermal Impedance @ 10% Deflection: 0.55 °C·in²/W
- Hardness: 20 Shore 00 (ASTM D2240)
- Young’s Modulus: 105 kPa
- Dielectric Breakdown Voltage: > 6,000 VAC
- Operating Temperature Range: -60°C to +200°C
- Thickness: 1.0 to 4.0 mm
We want to help!
Enter your information and we'll get you in touch with our knowledgable staff. We know how important to the right product for your project.
Request a Consultation
- Specifications
- Applications
- General Info
- FAQs
Physical Properties
| Property | Value | Test Method |
| Technology | Silicone | — |
| Appearance | Blue | — |
| Reinforcement Carrier | Fiberglass (non-fiberglass option available) | — |
| Thickness | 1.0 to 4.0 mm | — |
| Inherent Surface Tack | 2 (2 sides) | — |
| Operating Temperature Range | -60°C to +200°C | — |
| Hardness, Shore 00 | 20 | ASTM D2240 |
| Heat Capacity | 0.8 J/g·K | ASTM E1269 |
| Density | 2.9 g/cc | ASTM D792 |
Mechanical Properties
| Property | Value | Test Method |
| Young’s Modulus | 105 kPa | — |
Thermal Properties
| Property | Value | Test Method |
| Thermal Conductivity | 3.0 W/(m·K) | ASTM D5470 |
| Thermal Impedance @ 10% Deflection | 0.55 °C·in²/W | ASTM D5470 |
| Thermal Impedance @ 20% Deflection | 0.49 °C·in²/W | ASTM D5470 |
| Thermal Impedance @ 30% Deflection | 0.43 °C·in²/W | ASTM D5470 |
Electrical Properties
| Property | Value | Test Method |
| Dielectric Breakdown Voltage (0.04 in sample) | > 6,000 VAC | — |
| Dielectric Constant @ 1,000 Hz | 9.2 | ASTM D150 |
| Volume Resistivity | 1 × 10¹² ohm·meter | ASTM D257 |
Flame & Fire Performance
| Property | Value | Test Method |
| Flammability | V-0 | UL 94 |
Storage
| Property | Value | Test Method |
| Shelf Life (Optimal Storage) | 365 days at 25°C (±3), 50% RH (±10) | — |
Compliance
- UL 94 — Compliant (V-0)
- Telecommunications equipment: routers, switches and base stations
- Optical transceiver thermal management
- ASIC and DSP package thermal interface
- Fragile or thin packages where compression force must stay very low
- Thick gaps (up to 4.0 mm) between boards and enclosure walls
Common industries: telecommunications and networking, optical communications, and computing hardware.
BERGQUIST GAP PAD TGP 3000ULM is a soft, ultra-low modulus (ULM) gap filling material rated at 3.0 W/(m·K) thermal conductivity. It is specially formulated for high-performance applications that require low assembly stress, and offers exceptional thermal performance at low pressures due to a unique filler package and an ultra-low modulus resin formulation.
The material is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides, the top side has minimal tack for ease of handling, and a non-fiberglass option is available for applications that require an additional reduction in stress.
Physical performance includes 20 Shore 00 hardness, 2.9 g/cc density, 0.8 J/g·K heat capacity and a Young’s modulus of 105 kPa. Electrically, dielectric breakdown voltage on a 0.04 in sample is greater than 6,000 VAC, dielectric constant at 1,000 Hz is 9.2, and volume resistivity is 1 × 10¹² ohm-meter.
Thermally, the material delivers 3.0 W/(m·K) thermal conductivity per ASTM D5470, with thermal impedance of 0.55, 0.49 and 0.43 °C·in²/W at 10%, 20% and 30% deflection, across an operating temperature range of -60°C to +200°C. Available in 8″ x 16″ sheets at standard thicknesses of 0.040, 0.060, 0.080, 0.100, 0.125 and 0.160 in (1.0 to 4.0 mm). Shelf life is 365 days at 25°C (±3) and 50% RH (±10).
Compliant with UL 94 V-0 (flame retardancy) and the listed ASTM test methods: ASTM D2240, D792, D150, D257, D5470, and E1269.
What differentiates GAP PAD TGP 3000ULM from TGP 3000?
Both are 3.0 W/(m·K) silicone gap fillers, but TGP 3000ULM is the ultra-low modulus version. It is softer (20 Shore 00 versus 30 Shore 00) with a lower Young's modulus (105 kPa versus 180 kPa), reaches thicker gaps (up to 4.0 mm versus 3.175 mm), and is offered with or without fiberglass reinforcement, where TGP 3000 is always fiberglass-reinforced. TGP 3000ULM also carries higher dielectric breakdown voltage (greater than 6,000 VAC versus greater than 3,000 VAC). Choose the ULM grade when assembly stress on the component is the limiting factor; choose TGP 3000 when handling robustness and tear resistance matter more.
When should the non-fiberglass option be used?
Fiberglass reinforcement improves handling, puncture and tear resistance, but it also adds stiffness. The non-fiberglass version of TGP 3000ULM removes that stiffness for applications that need an additional reduction in compression stress, such as thin or fragile packages and low-force clip mounts. It should be specified where the pad is placed by hand or die-cut into simple shapes and does not need the extra durability of the carrier.
What is the operating temperature range for GAP PAD TGP 3000ULM?
The operating temperature range is -60°C to +200°C.
Is GAP PAD TGP 3000ULM suitable for flame-rated electronics environments?
Yes. The material is rated UL 94 V-0 for flammability, making it suitable for telecommunications, networking and optical equipment and other UL-rated assemblies that require a flame-retardant thermal gap filler.
How should GAP PAD TGP 3000ULM be specified?
Specify grade (BERGQUIST GAP PAD TGP 3000ULM), thickness (0.040, 0.060, 0.080, 0.100, 0.125 or 0.160 in; 1.0 to 4.0 mm), fiberglass or non-fiberglass construction, part geometry (sheet or die-cut), inherent tack configuration (2 sides, top side minimal tack), the target deflection or compression force, dielectric and thermal impedance requirements, UL 94 V-0 flame rating, operating temperature range, and finished format.
