BERGQUIST GAP PAD TGP 3004SF Silicone-Free Thermally Conductive Gap Filler (formerly GAP PAD 3004SF)
BERGQUIST GAP PAD TGP 3004SF is a silicone-free, high-performance gap filling material with 3.0 W/(m·K) thermal conductivity, designed for silicone-sensitive applications such as hard disk drives, optical assemblies, medical devices, and automotive electronics. The pad offers exceptionally low interfacial resistance to adjacent surfaces and is built on a 0.25 mil PET film carrier that provides a no-tack surface on one side for easy, residue-free disassembly and natural tack on the other side for ease of handling and placement. Offered at 0.254 to 3.175 mm thickness across an operating range of -40°C to +125°C, with dielectric breakdown voltage greater than 6,000 VAC and UL 94 V-0 flammability.
Key Properties
- Thermal Conductivity: 3.0 W/(m·K) (ASTM D5470)
- Technology: Silicone-free, 0.25 mil PET film carrier
- Hardness: 70 Shore 00 (ASTM D2240)
- Dielectric Breakdown Voltage: > 6,000 VAC (ASTM D149)
- Operating Temperature Range: -40°C to +125°C
- Thickness: 0.254 to 3.175 mm
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- Specifications
- Applications
- General Info
- FAQs
Physical Properties
| Property | Value | Test Method |
| Technology | Silicone-free | — |
| Appearance | Light gray | — |
| Reinforcement Carrier | 0.25 mil PET film | — |
| Thickness | 0.254 to 3.175 mm | ASTM D374 |
| Inherent Surface Tack | 1 (1 side) | — |
| Operating Temperature Range | -40°C to +125°C | — |
| Hardness, Shore 00 (30-sec delay, @ 250 mil, 23°C, bulk rubber) | 70 | ASTM D2240 |
| Heat Capacity | 0.8 J/g·K | ASTM E1269 |
| Density (bulk rubber) | 3.2 g/cc | ASTM D792 |
Thermal Properties
| Property | Value | Test Method |
| Thermal Conductivity | 3.0 W/(m·K) | ASTM D5470 |
Electrical Properties
| Property | Value | Test Method |
| Dielectric Breakdown Voltage | > 6,000 VAC | ASTM D149 |
| Dielectric Constant @ 1,000 Hz | 8.0 | ASTM D150 |
| Volume Resistivity | 1 × 10¹¹ ohm·meter | ASTM D257 |
Flame & Fire Performance
| Property | Value | Test Method |
| Flammability | V-0 | UL 94 |
Storage
| Property | Value | Test Method |
| Shelf Life (Optimal Storage) | 270 days at 25°C (±3), 50% RH (±10) | — |
Compliance
- UL 94 — Compliant (V-0)
- Hard disk drives (HDD) and HDD/SSD combination drives
- HDD case-to-tray thermal interface
- Medical devices
- Optical components and laser optics
- Automotive electronics (HEV, NEV, battery systems)
- Solar energy electronics
- LED lighting
Common industries: data storage, medical devices, optics and photonics, automotive and electric-vehicle electronics, solar energy, and LED lighting — particularly silicone-sensitive assemblies where silicone outgassing or migration cannot be tolerated.
BERGQUIST GAP PAD TGP 3004SF is a high-performance, thermally conductive gap filling material with a silicone-free formulation. The pad delivers 3.0 W/(m·K) thermal conductivity and offers exceptionally low interfacial resistance to adjacent surfaces, and it is designed specifically for applications that are silicone-sensitive, such as hard disk drives, optical assemblies, and medical devices, where silicone outgassing or migration cannot be tolerated.
The material is constructed on a 0.25 mil PET film carrier that provides a no-tack surface on one side and natural tack on the other. The PET side allows easy disassembly and rework with no residue left behind, while the tacky side allows for ease of handling and placement during assembly.
Physical performance includes 70 Shore 00 hardness (30-second delay, 250 mil, 23°C, bulk rubber), 3.2 g/cc density, and 0.8 J/g·K heat capacity. Electrically, dielectric breakdown voltage is greater than 6,000 VAC, dielectric constant at 1,000 Hz is 8.0, and volume resistivity is 1 × 10¹¹ ohm-meter.
Thermally, the material delivers 3.0 W/(m·K) thermal conductivity per ASTM D5470 across an operating temperature range of -40°C to +125°C. The pad is offered with natural inherent tack on one side (rated 1 / 1 side). Available in sheet form or die-cut parts at thicknesses from 0.254 to 3.175 mm, with custom thicknesses available upon request. Shelf life is 270 days at 25°C (±3) and 50% RH (±10).
Compliant with UL 94 V-0 (flame retardancy) and the listed ASTM test methods: ASTM D374, D2240, D792, D149, D150, D257, D5470, and E1269.
What differentiates GAP PAD TGP 3004SF from the silicone-based Gap Pad grades such as TGP 3000?
TGP 3004SF is the silicone-free member of the family. It matches the 3.0 W/(m·K) thermal conductivity of TGP 3000 but uses a silicone-free formulation on a 0.25 mil PET film carrier instead of a silicone resin on fiberglass reinforcement. It is firmer (70 Shore 00 versus 30 Shore 00), has a narrower operating range (-40°C to +125°C versus -60°C to +200°C), and carries higher dielectric strength (greater than 6,000 VAC versus greater than 3,000 VAC). Tack is on one side only: the PET side is no-tack for easy, residue-free disassembly, and the other side has natural tack for handling and placement.
Why choose a silicone-free gap filler?
Silicone-based thermal materials can release low-molecular-weight siloxanes that outgas or migrate onto nearby surfaces. In hard disk drives, optical and laser assemblies, and some medical devices, that contamination can cause head-disk interface failures, hazing of lenses and sensors, or wetting and bonding problems in downstream processes. TGP 3004SF is silicone-free by design, so it delivers gap-filling thermal performance without introducing silicone into a silicone-sensitive assembly.
What is the operating temperature range for GAP PAD TGP 3004SF?
The operating temperature range is -40°C to +125°C.
Is GAP PAD TGP 3004SF suitable for flame-rated electronics environments?
Yes. The material is rated UL 94 V-0 for flammability, making it suitable for automotive electronics, LED lighting, solar energy electronics, data storage hardware, and other UL-rated assemblies that require a flame-retardant thermal gap filler.
How should GAP PAD TGP 3004SF be specified?
Specify grade (BERGQUIST GAP PAD TGP 3004SF), thickness (within the 0.254 to 3.175 mm range, or a custom thickness on request), part geometry (sheet or die-cut), inherent tack configuration (1 side, with the no-tack PET side facing the surface that will be reworked), dielectric and thermal performance requirements, UL 94 V-0 flame rating, operating temperature range, and finished format.
