BERGQUIST GAP PAD TGP 40000SF Silicone-Free 40 W/m·K Ultra-High Conductivity Thermal Gap Pad
BERGQUIST GAP PAD TGP 40000SF is a silicone-free gap filling material with an ultra-high 40 W/(m·K) thermal conductivity, achieved with oriented filler technology, formulated for high-performance computing, AI accelerator, 5G and optical transceiver applications that require a silicone-free, low-outgassing solution. The 85 Shore 00 pad is not electrically insulating and is not naturally tacky, with an optional one-side PSA for handling and fixturing. Offered at 20 to 125 mil thickness across an operating range of -40°C to +150°C.
Key Properties
- Thermal Conductivity: 40 W/(m·K) (ASTM D5470, 0.5 to 1.5 mm at 50 psi)
- Technology: Silicone-free, oriented filler
- Hardness: 85 Shore 00 (ASTM D2240)
- Stress @ 10% Strain: 56 psi (ASTM D575)
- Electrical Isolation: Not electrically insulating
- Operating Temperature Range: -40°C to +150°C
- Thickness: 20 to 125 mil
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- Specifications
- Applications
- General Info
- FAQs
Physical Properties
| Property | Value | Test Method |
| Technology | Silicone-free (oriented filler) | — |
| Appearance | Black | — |
| Thickness | 20 to 125 mil (0.5 to 3.175 mm) | — |
| Surface Tack | Not naturally tacky; one-side PSA optional | — |
| Operating Temperature Range | -40°C to +150°C | — |
| Hardness, Shore 00 | 85 | ASTM D2240 |
| Density | 1.7 g/cc | ASTM D792 |
Mechanical Properties
| Property | Value | Test Method |
| Stress @ 10% Strain (40 mil pads) | 56 psi | ASTM D575 |
Thermal Properties
| Property | Value | Test Method |
| Thermal Conductivity (0.5 to 1.5 mm pads at 50 psi) | 40 W/(m·K) | ASTM D5470 |
Electrical Properties
| Property | Value | Test Method |
| Electrical Isolation | Not electrically insulating | — |
Storage
| Property | Value | Test Method |
| Shelf Life (Optimal Storage) | 365 days at 5 to 28°C, 50% RH (±10), sealed with moisture barrier | — |
- 5G telecom and datacom equipment
- DSPs in optical transceivers
- GPUs and CPUs in high-performance computing
- Immersion cooling for AI accelerators
- Vehicle control units and ADAS sensors
- Aerospace and defense electronics
- LED and laser thermal management
Common industries: data center and AI hardware, telecommunications, automotive ADAS, aerospace and defense, and photonics.
BERGQUIST GAP PAD TGP 40000SF is a silicone-free gap filling material rated at 40 W/(m·K), using oriented filler technology to achieve ultra-high thermal conductivity, roughly an order of magnitude above conventional filled gap pads. It is specially formulated for high-performance applications that require silicone-free solutions, with low bleed and low outgassing, and offers exceptional thermal performance at typical assembly pressures.
The material is not electrically insulating, so it is intended for interfaces where the component and heat sink are at the same potential or where a separate dielectric barrier is used. It is not naturally tacky; an optional one-side PSA is available for handling and fixturing, and the pad offers easy handling, assembly and disassembly.
Physical performance includes 85 Shore 00 hardness, 1.7 g/cc density and a stress of 56 psi at 10% strain on 40 mil pads (ASTM D575). Thermal conductivity of 40 W/(m·K) is measured per ASTM D5470 on 0.5 to 1.5 mm pads at 50 psi, with optimal thermal performance at 10% strain, across an operating temperature range of -40°C to +150°C.
Available in 6″ x 6″ sheets (4″ x 6″ at 20 mil) at standard thicknesses of 20, 40, 60, 80, 100 and 125 mil, with custom thicknesses and part sizes available upon request. Shelf life is 365 days at 5 to 28°C and 50% RH (±10) in sealed containers with moisture barrier packaging.
Tested to the listed ASTM methods: ASTM D2240, D792, D575, and D5470. No UL 94 flammability rating is published on the Henkel datasheet; contact H-O for approval and certificate information.
What differentiates GAP PAD TGP 40000SF from the other Gap Pad grades?
TGP 40000SF is in a different class: 40 W/(m·K) against 1 to 7 W/(m·K) for the conventional filled gap pads, achieved with oriented filler technology in a silicone-free matrix. The trade-offs are that it is firmer (85 Shore 00), it is not electrically insulating, and it is not naturally tacky (a one-side PSA is optional). It is the choice for GPU, CPU, ASIC and optical-module interfaces where the thermal budget cannot be met by a conventional pad, and where the interface does not need to provide electrical isolation.
Can GAP PAD TGP 40000SF be used where electrical isolation is required?
Not on its own. The material is not electrically insulating, so it should be applied between surfaces at the same potential, or combined with a separate dielectric layer where isolation is needed. Where a single electrically isolating pad is required, a filled silicone or silicone-free Gap Pad grade with a published dielectric breakdown voltage is the correct choice.
What is the operating temperature range for GAP PAD TGP 40000SF?
The operating temperature range is -40°C to +150°C.
How should GAP PAD TGP 40000SF be stored?
Store the product in an unopened container in a dry location at 5 to 28°C and 50% RH (±10), in sealed containers with moisture barrier packaging, for a 365-day shelf life. Material removed from containers may be contaminated during use and should not be returned to the original container.
How should GAP PAD TGP 40000SF be specified?
Specify grade (BERGQUIST GAP PAD TGP 40000SF), thickness (20, 40, 60, 80, 100 or 125 mil, or a custom thickness), part geometry (sheet or die-cut), whether the one-side PSA is required, the assembly pressure and target strain (optimal thermal performance is at 10% strain), operating temperature range, and finished format. Note that the material is not electrically insulating.
