BERGQUIST GAP PAD TGP 6000ULM Ultra-Low Modulus High-Conductivity Thermally Conductive Gap Filler
BERGQUIST GAP PAD TGP 6000ULM is a highly conformable, ultra-low modulus gap filling material with 6.0 W/(m·K) thermal conductivity, formulated for high-performance applications that require low assembly stress. At 60 Shore 000 with a Young’s modulus of only 41.3 kPa, the fiberglass-reinforced pad conforms to rough or uneven surfaces at low pressure, delivering thermal impedance of 0.34 °C·in²/W at 0.040″/10% deflection with dielectric strength greater than 5,000 VAC. Natural tack on both sides eliminates adhesive layers. Offered at 1.016 to 3.175 mm thickness across an operating range of -60°C to +200°C, with UL 94 V-0 flammability.
Key Properties
- Thermal Conductivity: 6.0 W/(m·K) (ASTM D5470)
- Thermal Impedance @ 0.040 in, 10% Deflection: 0.34 °C·in²/W
- Hardness: 60 Shore 000 (ASTM D2240)
- Young’s Modulus: 41.3 kPa (6 psi)
- Dielectric Strength: > 5,000 VAC (ASTM D149)
- Operating Temperature Range: -60°C to +200°C
- Thickness: 1.016 to 3.175 mm
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- Specifications
- Applications
- General Info
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Physical Properties
| Property | Value | Test Method |
| Technology | Silicone | — |
| Appearance | Gray | — |
| Reinforcement Carrier | Fiberglass | — |
| Thickness | 1.016 to 3.175 mm | — |
| Interface Tack | 2 sides | — |
| Operating Temperature Range | -60°C to +200°C | — |
| Hardness, Shore 000 | 60 | ASTM D2240 |
| Heat Capacity | 1.0 J/g·K | ASTM E1269 |
| Density (bulk rubber) | 3.2 g/cc | ASTM D792 |
Mechanical Properties
| Property | Value | Test Method |
| Young’s Modulus | 41.3 kPa (6 psi) | — |
Thermal Properties
| Property | Value | Test Method |
| Thermal Conductivity | 6.0 W/(m·K) | ASTM D5470 |
| Thermal Impedance @ 0.040 in, 10% Deflection | 0.34 °C·in²/W | ASTM D5470 |
| Thermal Impedance @ 0.040 in, 20% Deflection | 0.29 °C·in²/W | ASTM D5470 |
| Thermal Impedance @ 0.040 in, 30% Deflection | 0.26 °C·in²/W | ASTM D5470 |
Electrical Properties
| Property | Value | Test Method |
| Dielectric Strength | > 5,000 VAC | ASTM D149 |
| Dielectric Constant @ 1,000 Hz | 6.5 | ASTM D150 |
| Volume Resistivity | 1 × 10¹⁰ ohm·meter | ASTM D257 |
Flame & Fire Performance
| Property | Value | Test Method |
| Flammability Rating @ 0.76 / 3.0 / 4.7 mm | V-0 | IEC 60695-11-10 / UL 94 |
Storage
| Property | Value | Test Method |
| Shelf Life (Optimal Storage) | 6 months at 25°C (±3), 50% RH (±10) | — |
Compliance
- UL 94 — Compliant (V-0)
- Telecommunications equipment thermal interface
- ASIC and DSP package thermal management
- Consumer electronics gap filling
- Thermal module to heat sink assembly
- Low-stress interfaces on fragile or uneven component stacks
Common industries: telecommunications, computing and consumer electronics, and any assembly where a large or uneven gap must be filled at very low compression force.
BERGQUIST GAP PAD TGP 6000ULM is a highly conformable, ultra-low modulus (ULM) gap filling material rated at 6.0 W/(m·K) thermal conductivity. It is specially formulated for high-performance applications that require low assembly stress, and delivers exceptional thermal performance at low pressures thanks to a unique filler package and an ultra-low modulus resin formulation. The material is highly conformal, even to surfaces with high roughness or topography, which supports excellent interfacing and wet-out.
The pad is fiberglass-reinforced and offered with a higher natural inherent tack on both sides, eliminating the need for thermally impeding adhesive layers and providing stick-in-place behaviour during assembly. The top side has minimal tack for ease of handling and rework, and the material is supplied with protective liners on both sides.
Physical performance includes 60 Shore 000 hardness, 3.2 g/cc density, 1.0 J/g·K heat capacity and a Young’s modulus of just 41.3 kPa (6 psi). Electrically, dielectric strength is greater than 5,000 VAC, dielectric constant at 1,000 Hz is 6.5, and volume resistivity is 1 × 10¹⁰ ohm-meter.
Thermally, the material delivers 6.0 W/(m·K) thermal conductivity per ASTM D5470, with thermal impedance at 0.040 in of 0.34, 0.29 and 0.26 °C·in²/W at 10%, 20% and 30% deflection, across an operating temperature range of -60°C to +200°C. Available in 8″ x 16″ sheets at standard thicknesses of 0.040″, 0.060″, 0.080″, 0.100″ and 0.125″ (1.016 to 3.175 mm). Shelf life is 6 months at 25°C (±3) and 50% RH (±10).
Compliant with UL 94 V-0 (flame retardancy, tested at 0.76, 3.0 and 4.7 mm per IEC 60695-11-10) and the listed ASTM test methods: ASTM D2240, D792, D149, D150, D257, D5470, and E1269.
What differentiates GAP PAD TGP 6000ULM from TGP 5000 and TGP 7000ULM?
TGP 6000ULM sits between the two in conductivity (6.0 W/m·K versus 5.0 for TGP 5000 and 7.0 for TGP 7000ULM) but is in a different class mechanically. It is an ultra-low modulus (ULM) grade at 60 Shore 000 with a Young's modulus of 41.3 kPa, compared with 35 Shore 00 and 310 kPa for the S-class TGP 5000, so it fills the same gap at a fraction of the compression force. Against TGP 7000ULM (75 Shore 000, 152 kPa) it is softer still, which makes it the choice when a fragile package or a low-force clip mount limits how hard the interface can be loaded.
Why does ultra-low modulus matter in a gap filler?
A gap pad is compressed to reach the real gap in the assembly, and the force it pushes back with is transferred to the component, the solder joints and the housing. A low-modulus pad reaches the same deflection at a much lower stress, so thin BGAs, ceramic packages, clip-mounted heat sinks and thin-wall enclosures are not bowed or over-stressed. TGP 6000ULM combines that low-stress behaviour with 6.0 W/(m·K) conductivity, so thermal performance is not traded away for compliance.
What is the operating temperature range for GAP PAD TGP 6000ULM?
The operating temperature range is -60°C to +200°C.
Is GAP PAD TGP 6000ULM suitable for flame-rated electronics environments?
Yes. The material carries a UL 94 V-0 flammability rating, tested at 0.76 mm, 3.0 mm and 4.7 mm thicknesses per IEC 60695-11-10, making it suitable for telecommunications, computing and consumer electronics assemblies that require a flame-retardant thermal gap filler.
How should GAP PAD TGP 6000ULM be specified?
Specify grade (BERGQUIST GAP PAD TGP 6000ULM), thickness (0.040", 0.060", 0.080", 0.100" or 0.125"; 1.016 to 3.175 mm), part geometry (sheet or die-cut), inherent tack configuration (natural tack both sides, top side minimal tack), the target deflection or compression force, dielectric and thermal impedance requirements, UL 94 V-0 flame rating, operating temperature range, and finished format.
