BERGQUIST GAP PAD TGP 7000ULM Ultra-Low Modulus 7.0 W/m·K Thermally Conductive Gap Filler
BERGQUIST GAP PAD TGP 7000ULM is an extremely soft, ultra-low modulus gap filling material with 7.0 W/(m·K) thermal conductivity, the highest in the standard Gap Pad TGP line, formulated for high-performance applications that require low assembly stress. At 75 Shore 000 with a Young’s modulus of 152 kPa, the pad conforms to rough or irregular surfaces at low pressure and delivers dielectric breakdown voltage greater than 5,000 VAC with natural tack on both sides. Offered at 0.5 to 3.18 mm thickness across an operating range of -60°C to +200°C, with UL 94 V-0 flammability.
Key Properties
- Thermal Conductivity: 7.0 W/(m·K) (ASTM D5470)
- Hardness: 75 Shore 000 (ASTM D2240)
- Young’s Modulus: 152 kPa (22 psi)
- Dielectric Breakdown Voltage: > 5,000 VAC (ASTM D149)
- Operating Temperature Range: -60°C to +200°C
- Thickness: 0.5 to 3.18 mm
We want to help!
Enter your information and we'll get you in touch with our knowledgable staff. We know how important to the right product for your project.
Request a Consultation
- Specifications
- Applications
- General Info
- FAQs
Physical Properties
| Property | Value | Test Method |
| Technology | Silicone | — |
| Appearance | Gray | — |
| Thickness | 0.5 to 3.18 mm | — |
| Inherent Surface Tack | 2 (2 sides) | — |
| Operating Temperature Range | -60°C to +200°C | — |
| Hardness, Shore 000 | 75 | ASTM D2240 |
| Heat Capacity | 1.1 J/g·K | ASTM E1269 |
| Density | 3.2 g/cc | ASTM D792 |
Mechanical Properties
| Property | Value | Test Method |
| Young’s Modulus | 152 kPa (22 psi) | — |
Thermal Properties
| Property | Value | Test Method |
| Thermal Conductivity | 7.0 W/(m·K) | ASTM D5470 |
Electrical Properties
| Property | Value | Test Method |
| Dielectric Breakdown Voltage (40 mil sample) | > 5,000 VAC | ASTM D149 |
| Dielectric Constant @ 1,000 Hz | 8.7 | ASTM D150 |
| Volume Resistivity | 1.2 × 10¹¹ ohm·meter | ASTM D257 |
Flame & Fire Performance
| Property | Value | Test Method |
| Flammability | V-0 | UL 94 |
Storage
| Property | Value | Test Method |
| Shelf Life (Optimal Storage) | 180 days at 25°C (±3), 50% RH (±10) | — |
Compliance
- UL 94 — Compliant (V-0)
- Telecommunications equipment: routers, switches and base stations
- Optical transceiver thermal management
- ASIC and DSP package thermal interface
- High-power processors and accelerators where the gap must be filled at low force
- Thermal module to heat sink and chassis interfaces
Common industries: telecommunications and networking, optical communications, and high-performance computing hardware.
BERGQUIST GAP PAD TGP 7000ULM is an extremely soft, ultra-low modulus (ULM) gap filling material rated at 7.0 W/(m·K) thermal conductivity, the highest conductivity in the conventional Gap Pad TGP line. It is specially formulated for high-performance applications that require low assembly stress, and offers exceptional thermal performance at low pressures thanks to a unique filler package and an ultra-low modulus resin formulation.
The material is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface, and carries natural inherent tack on both sides. Protective liners are supplied on both sides for ease of use.
Physical performance includes 75 Shore 000 hardness, 3.2 g/cc density, 1.1 J/g·K heat capacity and a Young’s modulus of 152 kPa (22 psi). Electrically, dielectric breakdown voltage on a 40 mil sample is greater than 5,000 VAC, dielectric constant at 1,000 Hz is 8.7, and volume resistivity is 1.2 × 10¹¹ ohm-meter.
Thermally, the material delivers 7.0 W/(m·K) thermal conductivity per ASTM D5470 across an operating temperature range of -60°C to +200°C. Available in 8″ x 8″ sheets at standard thicknesses of 0.02, 0.04, 0.06, 0.08, 0.1 and 0.125 in (0.5, 1, 1.5, 2.0, 2.5 and 3.18 mm). Shelf life is 180 days at 25°C (±3) and 50% RH (±10).
Compliant with UL 94 V-0 (flame retardancy) and the listed ASTM test methods: ASTM D2240, D792, D149, D150, D257, D5470, and E1269.
What differentiates GAP PAD TGP 7000ULM from TGP 6000ULM and TGP 5000?
TGP 7000ULM is the highest-conductivity grade of the three at 7.0 W/(m·K), against 6.0 for TGP 6000ULM and 5.0 for TGP 5000. Like TGP 6000ULM it is an ultra-low modulus grade (75 Shore 000, 152 kPa Young's modulus) rather than an S-class pad (TGP 5000 is 35 Shore 00 at 310 kPa), so it reaches its working deflection at far lower stress. Choose TGP 7000ULM when the thermal budget is tightest; choose TGP 6000ULM (60 Shore 000, 41.3 kPa) when the assembly is even more sensitive to compression force.
Why does thermal conductivity matter in material selection?
The function of a Gap Pad is to fill the air gap between a heat-generating component and a heat sink while transferring heat across that gap. Thermal conductivity sets the bulk heat transport, with thermal resistance proportional to gap thickness; thinner gaps and higher conductivity both reduce thermal resistance. At 7.0 W/(m·K), TGP 7000ULM keeps thermal resistance low even across the thicker 2.5 and 3.18 mm gaps found under optical modules and stacked telecom boards, and the ultra-low modulus formulation keeps wet-out good at the low contact pressures those assemblies allow.
What is the operating temperature range for GAP PAD TGP 7000ULM?
The operating temperature range is -60°C to +200°C.
Is GAP PAD TGP 7000ULM suitable for flame-rated electronics environments?
Yes. The material is rated UL 94 V-0 for flammability, making it suitable for telecommunications, networking and optical equipment and other UL-rated assemblies that require a flame-retardant thermal gap filler.
How should GAP PAD TGP 7000ULM be specified?
Specify grade (BERGQUIST GAP PAD TGP 7000ULM), thickness (0.5 to 3.18 mm; 0.02 to 0.125 in standard), part geometry (sheet or die-cut), inherent tack configuration (2 sides), the target deflection or compression force, dielectric and thermal performance requirements, UL 94 V-0 flame rating, operating temperature range, and finished format.
