BERGQUIST GAP PAD TGP EMI4000 Silicone-Free Thermally Conductive EMI Absorbing Gap Pad

BERGQUIST GAP PAD TGP EMI4000 is a highly conformable, silicone-free gap pad that combines 4 W/(m·K) thermal conductivity with electromagnetic absorption up to 77 GHz, damping cavity resonances and cross-talk in radar modules, ADAS domain controllers, V2X and telematics units. The 60 Shore 00 pad has natural tack on both sides and a low-bleed formula, delivering thermal impedance of 0.35 °C·in²/W at 1 mm/10% deflection and attenuation of 86 dB/cm at 18 GHz and 98 dB/cm at 77 GHz. Offered at 0.75 to 2.0 mm thickness as die-cut parts, trays or tape and reel, across an operating range of -40°C to +125°C, with UL 94 V-0 flammability.

Key Properties

  • Thermal Conductivity: 4 W/(m·K) (ASTM D5470)
  • EMI Attenuation: 86 dB/cm @ 18 GHz, 98 dB/cm @ 77 GHz (ASTM D5568, 1 mm)
  • Technology: Silicone-free, no reinforcement carrier
  • Hardness: 60 Shore 00 (ASTM D2240)
  • Young’s Modulus: 550 kPa (80 psi) (ASTM D575)
  • Operating Temperature Range: -40°C to +125°C
  • Thickness: 0.75 to 2.0 mm

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    Physical Properties

    Property Value Test Method
    Technology Silicone-free —
    Appearance Dark gray —
    Reinforcement Carrier None —
    Thickness 0.75 to 2.0 mm ASTM D374
    Inherent Surface Tack 2 (2 sides) —
    Operating Temperature Range -40°C to +125°C —
    Hardness, Shore 00 (30-sec delay, bulk rubber) 60 ASTM D2240
    Heat Capacity 0.8 J/g·K ASTM E1269
    Density (bulk rubber) 2.67 g/cc ASTM D792

    Mechanical Properties

    Property Value Test Method
    Young’s Modulus (10% strain) 550 kPa (80 psi) ASTM D575

    Thermal Properties

    Property Value Test Method
    Thermal Conductivity 4 W/(m·K) ASTM D5470
    Thermal Impedance @ 1 mm, 10% Deflection 0.35 °C·in²/W ASTM D5470
    Thermal Impedance @ 1 mm, 20% Deflection 0.3 °C·in²/W ASTM D5470
    Thermal Impedance @ 1 mm, 30% Deflection 0.26 °C·in²/W ASTM D5470

    EMI Absorption (waveguide, 1 mm)

    Property Value Test Method
    Attenuation @ 18 GHz 86 dB/cm ASTM D5568
    Attenuation @ 77 GHz 98 dB/cm ASTM D5568

    Electrical Properties (measured at 1 mm)

    Property Value Test Method
    Dielectric Breakdown Voltage 1,000 VAC ASTM D149
    Dielectric Constant @ 1,000 Hz 48 ASTM D150
    Volume Resistivity 4.4 × 10⁷ ohm·meter ASTM D257

    Flame & Fire Performance

    Property Value Test Method
    Flammability V-0 UL 94

    Storage

    Property Value Test Method
    Shelf Life (Optimal Storage) 12 months at 25°C (±3), 50% RH (±10) —

    Compliance

    • UL 94 — Compliant (V-0)
    Standard Thicknesses:0.75 to 2.0 mm
    Standard Colors:Dark gray
    Supply Formats:Precision die-cut components, Kiss-cut parts, Trays, Tape and reel, Natural tack both sides (no reinforcement carrier), Protective liners
    Misc Notes:Custom dimensions and converted formats available based on application requirements and production volume.
    • Automotive radar modules (24 and 77 GHz)
    • ADAS data modules and domain controllers
    • V2X and telematics control units
    • Electronic control units with shielded RF cavities
    • Telecommunications and 5G radio hardware
    • Any assembly where a gap filler must also damp cavity resonance or cross-talk

    Common industries: automotive ADAS and radar, telecommunications, and RF/microwave electronics.

    BERGQUIST GAP PAD TGP EMI4000 is a highly conformable, silicone-free material offering both thermal conductivity (4 W/m·K) and electromagnetic absorption of cavity resonances and cross-talk that cause electromagnetic interference, at frequencies up to 77 GHz. It performs the job of a thermal gap filler and a microwave absorber in one die-cut part, which is why it is specified in radar modules, ADAS domain controllers and telematics units.

    The soft nature of the material enables low assembly stress and enhances wet-out at the interface, giving better thermal performance than harder materials with a similar rating, and a low-bleed formula prevents gap instability and loss of functionality over time. The pad has inherent natural tack on both sides, eliminating heat-flow-impeding adhesive layers and improving handling during placement, and is supplied with protective liners.

    Physical performance includes 60 Shore 00 hardness (30-second delay, bulk rubber), 2.67 g/cc density, 0.8 J/g·K heat capacity and a Young’s modulus of 550 kPa (80 psi) at 10% strain. Electrically, measured at 1 mm, dielectric breakdown voltage is 1,000 VAC, dielectric constant at 1,000 Hz is 48, and volume resistivity is 4.4 × 10⁷ ohm-meter; the high dielectric constant and lossy character are what give the material its absorbing function.

    Thermally, the material delivers 4 W/(m·K) thermal conductivity per ASTM D5470, with thermal impedance at 1 mm of 0.35, 0.3 and 0.26 °C·in²/W at 10%, 20% and 30% deflection. Waveguide testing at 1 mm per ASTM D5568 shows attenuation of 86 dB/cm at 18 GHz and 98 dB/cm at 77 GHz. Operating temperature range is -40°C to +125°C, thickness 0.75 to 2.0 mm, supplied as die-cut parts, in trays, or on tape and reel. Shelf life is 12 months at 25°C (±3) and 50% RH (±10).

    Compliant with UL 94 V-0 (flame retardancy) and the listed ASTM test methods: ASTM D374, D2240, D792, D575, D149, D150, D257, D5470, D5568, and E1269.

    What differentiates GAP PAD TGP EMI4000 from a standard Gap Pad?

    A standard Gap Pad is a thermal interface only. TGP EMI4000 adds an electromagnetic absorbing function: its lossy, high-dielectric-constant (48) formulation attenuates 86 dB/cm at 18 GHz and 98 dB/cm at 77 GHz, so one die-cut part fills the thermal gap and damps the cavity resonances or cross-talk inside a shielded RF enclosure. It is silicone-free, has no reinforcement carrier, and is softer than most absorber sheets at 60 Shore 00. Its dielectric breakdown voltage (1,000 VAC at 1 mm) is lower than an insulating gap pad, so it is not a substitute where high-voltage isolation is required.

    Why does EM absorption matter in a thermal gap filler?

    In radar and RF modules the metal housing and heat sink form cavities that can resonate at the operating frequency, and adjacent channels can couple through the air gap. A conventional gap filler does nothing about that. Placing an absorbing gap pad between the RF board and the lid or heat sink damps those resonances and cross-talk while still carrying heat away, which removes a separate absorber layer from the stack and simplifies assembly.

    What is the operating temperature range for GAP PAD TGP EMI4000?

    The operating temperature range is -40°C to +125°C.

    Is GAP PAD TGP EMI4000 suitable for flame-rated electronics environments?

    Yes. The material is rated UL 94 V-0 for flammability, making it suitable for automotive electronics, telecommunications and other UL-rated assemblies that require a flame-retardant thermal and EMI gap pad.

    How should GAP PAD TGP EMI4000 be specified?

    Specify grade (BERGQUIST GAP PAD TGP EMI4000), thickness (within 0.75 to 2.0 mm), part geometry (die-cut), delivery format (trays or tape and reel for automated placement), the frequency band to be absorbed, the target deflection or compression force, thermal impedance requirement, UL 94 V-0 flame rating, operating temperature range, and finished format.

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