BERGQUIST® SIL PAD TSP 1600S High-Performance Silicone / Fiberglass Insulator for Low-Pressure Applications (formerly SIL-PAD 900S)
BERGQUIST SIL PAD TSP 1600S is a fiberglass-reinforced silicone thermally conductive insulator engineered for low-pressure component clamping, such as spring-clip-mounted discrete semiconductors (TO-220, TO-247, TO-218). The 0.229 mm pad delivers 1.6 W/(m·K) thermal conductivity and a thermal impedance of 0.61°C·in²/W at 50 psi across an operating range of -60°C to +180°C. The smooth, highly compliant surface minimizes interfacial thermal resistance and maximizes thermal performance at low mounting pressures, with UL 94 V-0 flammability.
Key Properties
- Thermal Conductivity: 1.6 W/(m·K) (ASTM D5470)
- Thermal Impedance @ 50 psi: 0.61 °C·in²/W
- Dielectric Breakdown Voltage: 5,500 Vac (ASTM D149)
- Hardness: 92 Shore A (ASTM D2240)
- Operating Temperature Range: -60°C to +180°C
- Total Thickness: 0.229 mm
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- Specifications
- Applications
- General Info
- FAQs
Physical Properties
| Property | Value | Test Method |
| Technology | Silicone | — |
| Appearance | Pink | — |
| Reinforcement Carrier | Fiberglass | — |
| Total Thickness | 0.229 mm | ASTM D374 |
| Operating Temperature Range | -60°C to +180°C | — |
Mechanical Properties
| Property | Value | Test Method |
| Hardness, Shore A | 92 | ASTM D2240 |
| Elongation, 45° to Warp and Fill | 20% | ASTM D412 |
| Tensile Strength | 9 MPa | ASTM D412 |
Thermal Properties
| Property | Value | Test Method |
| Thermal Conductivity | 1.6 W/(m·K) | ASTM D5470 |
Thermal Performance vs. Pressure
| Property | Value | Test Method |
| TO-220 Thermal Performance @ 10 psi | 3.96 °C/W | ASTM D5470 |
| Thermal Impedance @ 10 psi | 0.95 °C·in²/W | ASTM D5470 |
| TO-220 Thermal Performance @ 25 psi | 3.41 °C/W | ASTM D5470 |
| Thermal Impedance @ 25 psi | 0.75 °C·in²/W | ASTM D5470 |
| TO-220 Thermal Performance @ 50 psi | 2.9 °C/W | ASTM D5470 |
| Thermal Impedance @ 50 psi | 0.61 °C·in²/W | ASTM D5470 |
| TO-220 Thermal Performance @ 100 psi | 2.53 °C/W | ASTM D5470 |
| Thermal Impedance @ 100 psi | 0.47 °C·in²/W | ASTM D5470 |
| TO-220 Thermal Performance @ 200 psi | 2.32 °C/W | ASTM D5470 |
| Thermal Impedance @ 200 psi | 0.41 °C·in²/W | ASTM D5470 |
Electrical Properties
| Property | Value | Test Method |
| Dielectric Breakdown Voltage | 5,500 Vac | ASTM D149 |
| Dielectric Constant @ 1,000 Hz | 6.0 | ASTM D150 |
| Volume Resistivity | 1 × 10¹⁰ ohm-meter | ASTM D257 |
Flame & Fire Performance
| Property | Value | Test Method |
| Flammability Rating | V-0 | UL 94 |
Compliance
- UL 94 — Compliant (V-0)
- Spring clip-mounted discrete semiconductor insulation (TO-220, TO-247, TO-218)
- Power supply thermal interface at low mounting pressure
- Automotive electronics thermal interface insulation
- Motor control power device isolation
- Power semiconductor thermal interface in low-clamping-force assemblies
Common industries: power electronics, automotive electronics, motor controls, and discrete semiconductor assembly.
BERGQUIST SIL PAD TSP 1600S is a high-performance thermally conductive insulation material designed for a wide variety of applications requiring high thermal performance and electrical isolation, particularly those with low mounting pressures for component clamping. The material combines a smooth and highly compliant surface characteristic with high thermal conductivity, optimizing thermal resistance at low pressures.
Applications requiring low component clamping forces include discrete semiconductors (TO-220, TO-247, TO-218) mounted with spring clips, where the smooth surface texture minimizes interfacial thermal resistance and maximizes thermal performance.
Mechanical performance includes 92 Shore A hardness, 20% elongation at 45° to warp and fill, and 9 MPa tensile strength. Electrically, the dielectric breakdown voltage is 5,500 Vac, dielectric constant at 1,000 Hz is 6.0, and volume resistivity is 1 × 10¹⁰ ohm-meter.
Thermally, the material delivers 1.6 W/(m·K) thermal conductivity, with TO-220 thermal performance ranging from 3.96°C/W at 10 psi to 2.32°C/W at 200 psi, and thermal impedance from 0.95°C·in²/W at 10 psi to 0.41°C·in²/W at 200 psi. Operating temperature range is -60°C to +180°C, and the material is UL 94 V-0 flame retardant.
Compliant with UL 94 V-0 (flame retardancy) and the listed ASTM test methods: ASTM D374, D2240, D412, D149, D150, D257, and D5470.
What differentiates SIL PAD TSP 1600S from the original SIL PAD TSP 900 or the soft-tack TSP 1800ST?
TSP 1600S is engineered specifically for low-pressure applications, with a smooth, highly compliant surface that minimizes interfacial thermal resistance at the low clamping forces produced by spring clips. It delivers higher thermal conductivity (1.6 W/m·K vs 0.9 W/m·K), higher dielectric breakdown voltage (5,500 Vac vs 3,500–4,500 Vac), and lower thermal impedance at 50 psi (0.61 vs 1.13 °C·in²/W) than TSP 900, making it the appropriate selection for spring-clip-mounted TO-220, TO-247, and TO-218 packages. Compared to the naturally tacky TSP 1800ST, this grade does not have the auto-placement tack but is firmer (92 Shore A vs 75 Shore 00) and has higher dielectric breakdown voltage.
Why does thermal conductivity matter in material selection?
ile keeping the two electrically isolated. Thermal conductivity sets the bulk heat transport, and thermal impedance — which includes interfacial resistance and is pressure-dependent — determines real-world performance. TSP 1600S delivers 1.6 W/(m·K) and 0.61 °C·in²/W at 50 psi, with the surface chemistry tuned to minimize interfacial resistance at low pressures where competitive insulators perform poorly.
What is the operating temperature range for SIL PAD TSP 1600S?
The operating temperature range is -60°C to +180°C.
Is SIL PAD TSP 1600S suitable for flame-rated electronics environments?
Yes. The material is rated UL 94 V-0 for flammability, making it suitable for power supply, automotive electronics, motor control, and other UL-rated assemblies that require flame-retardant thermal interface insulation.
How should SIL PAD TSP 1600S be specified?
Specify grade (BERGQUIST SIL PAD TSP 1600S), thickness (0.229 mm), part geometry (sheet, die-cut, or kiss-cut), target mounting pressure (low-pressure applications are the design intent), dielectric and thermal impedance requirements, UL 94 V-0 flame rating, and finished format.
