BERGQUIST® SIL PAD TSP K1300 Kapton®-Reinforced Thermally Conductive Insulator (formerly SIL-PAD K-10)
BERGQUIST SIL PAD TSP K1300 is a Kapton-reinforced silicone thermally conductive insulator engineered as a replacement for ceramic insulators such as Beryllium Oxide, Boron Nitride, and Alumina. The 0.15 ± 0.025 mm pad delivers 1.3 W/(m·K) thermal conductivity, dielectric breakdown voltage of 6,000 Vac minimum, and volume resistivity of 1 × 10¹² ohm-meter across an operating range of -60°C to +180°C. NASA outgassing compliant (TML 0.36%, VCM 0.09%), eliminating ceramic breakage at significantly lower cost than ceramic alternatives.
Key Properties
- Thermal Conductivity: 1.3 W/(m·K) (ASTM D5470)
- Thermal Resistance: 0.2 °C·in²/W (Bergquist Flat Plate Test)
- Dielectric Breakdown Voltage: 6,000 Vac min. (ASTM D149)
- Hardness: 90 Shore A (ASTM D2240)
- Operating Temperature Range: -60°C to +180°C
- Total Thickness: 0.15 ± 0.025 mm
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- Specifications
- Applications
- General Info
- FAQs
Physical Properties
| Property | Value | Test Method |
| Technology | Silicone | — |
| Appearance | Beige | — |
| Reinforcement Carrier | Kapton® | — |
| Total Thickness | 0.15 ± 0.025 mm | ASTM D374 |
| Operating Temperature Range | -60°C to +180°C | — |
Mechanical Properties
| Property | Value | Test Method |
| Hardness, Shore A | 90 | ASTM D2240 |
| Breaking Strength | 5 kN/m | ASTM D1458 |
| Elongation, 45° to Warp and Fill | 40% | ASTM D412 |
| Tensile Strength | 35 MPa | ASTM D412 |
Thermal Properties
| Property | Value | Test Method |
| Thermal Conductivity | 1.3 W/(m·K) | ASTM D5470 |
| Thermal Resistance | 0.2 °C·in²/W | Bergquist Flat Plate Test |
Electrical Properties
| Property | Value | Test Method |
| Dielectric Breakdown Voltage | 6,000 Vac min. | ASTM D149 |
| Dielectric Constant @ 1,000 Hz | 3.7 | ASTM D150 |
| Volume Resistivity | 1 × 10¹² ohm-meter | ASTM D257 |
Outgassing Properties (NASA SP-R-0022A)
| Property | Value | Test Method |
| Thermal Vacuum Weight Loss (TML), as manufactured | 0.36% | NASA SP-R-0022A |
| Volatile Condensable Material (VCM), as manufactured | 0.09% | NASA SP-R-0022A |
Compliance
- NASA SP-R-0022A — Compliant (TML 0.36%, VCM 0.09%)
- Replacement insulators for Beryllium Oxide, Boron Nitride, and Alumina ceramic pads
- High-reliability electronic packaging insulation
- Power semiconductor electrical isolation
- Thermal management in aerospace and NASA outgassing-rated assemblies
- Cost-sensitive high-performance insulator service
Common industries: aerospace, power semiconductor manufacturing, high-reliability electronics, and electronic packaging.
BERGQUIST SIL PAD TSP K1300 is a high-performance Kapton-reinforced silicone thermal interface insulator developed to replace ceramic insulators such as Beryllium Oxide (BeO), Boron Nitride (BN), and Alumina (Al₂O₃).
Ceramic insulators are expensive and break easily under handling and assembly stresses; the Kapton-reinforced construction of TSP K1300 eliminates breakage and costs significantly less, while delivering excellent thermal and electrical performance. The material is also NASA outgassing compliant, making it suitable for aerospace and high-reliability electronic packaging.
Mechanical performance includes 90 Shore A hardness, 5 kN/m breaking strength, 40% elongation at 45° to warp and fill, and 35 MPa tensile strength — values that reflect the Kapton reinforcement’s significant contribution to mechanical robustness. Electrically, the dielectric breakdown voltage is 6,000 Vac minimum, dielectric constant at 1,000 Hz is 3.7, and volume resistivity is 1 × 10¹² ohm-meter.
Thermally, the material delivers 1.3 W/(m·K) thermal conductivity per ASTM D5470 and 0.2 °C·in²/W thermal resistance per the Bergquist Flat Plate Test. NASA SP-R-0022A outgassing performance is documented at 0.36% Thermal Vacuum Weight Loss (TML) and 0.09% Volatile Condensable Material (VCM), both as manufactured. Operating temperature range is -60°C to +180°C, and total thickness is 0.15 ± 0.025 mm.
Compliant with NASA SP-R-0022A outgassing requirements and the listed ASTM test methods: ASTM D374, D2240, D1458, D412, D149, D150, D257, and D5470.
What differentiates SIL PAD TSP K1300 from the fiberglass-reinforced SIL PAD TSP grades and from ceramic insulators?
TSP K1300 uses a Kapton polyimide reinforcement rather than fiberglass, which delivers significantly higher tensile strength (35 MPa versus 9 to 20 MPa for the fiberglass-reinforced grades) and the highest dielectric breakdown voltage in the family at 6,000 Vac minimum. Compared with ceramic insulators (BeO, BN, Al₂O₃), TSP K1300 eliminates ceramic breakage during handling and assembly, costs significantly less, and is NASA outgassing compliant — making it the appropriate selection where a ceramic-class insulator is needed without the cost or fragility of ceramics.
Why does dielectric strength matter for this material?
The function of a thermal interface insulator is to electrically isolate a power source from a heat sink while transferring heat. TSP K1300 is designed for high-voltage power semiconductor and high-reliability service, with a dielectric breakdown voltage of 6,000 Vac minimum per ASTM D149 and volume resistivity of 1 × 10¹² ohm-meter — both the highest in the Sil Pad family — establishing the voltage withstand required for the demanding electrical isolation applications that traditionally used ceramic insulators.
What is the operating temperature range for SIL PAD TSP K1300?
The operating temperature range is -60°C to +180°C.
Is SIL PAD TSP K1300 suitable for aerospace, NASA outgassing, and high-reliability environments?
Yes. The material is NASA SP-R-0022A outgassing compliant with documented TML of 0.36% and VCM of 0.09% as manufactured, making it suitable for aerospace, NASA, and other high-reliability electronic packaging applications. The Kapton-reinforced construction also eliminates the breakage risk associated with ceramic insulators in the same service.
How should SIL PAD TSP K1300 be specified?
Specify grade (BERGQUIST SIL PAD TSP K1300), thickness (0.15 ± 0.025 mm), part geometry (sheet, die-cut, or kiss-cut), dielectric and thermal impedance requirements, NASA outgassing compliance (TML/VCM) if required, and finished format.
