Five-Layer AeroZero® Aerogel Thermal Protection System, Acrylic Adhesive QuinZero TPS 501
QuinZero TPS 501 is a five-layer AeroZero® polyimide aerogel thermal protection system with a 952.5 µm (37.5 mil) total construction thickness and a basis weight of 390 g/m², with each aerogel layer bonded by a 25.4 micron (1 mil) acrylic pressure-sensitive adhesive. The construction delivers a thermal conductivity of 0.037 W/m·K at 25°C and a glass transition temperature of 305°C (580°F), with a tensile strength of 6.5 MPa (0.94 ksi) and 6.0% elongation at break. The acrylic adhesive provides greater than 280 N/m (1.6 lbf/in) 72-hour peel strength to aluminum foil, enabling permanent bonding to metal, composite, and polymer substrates.
Key Properties
- Thermal Conductivity (25°C): 0.037 W/m·K
- Glass Transition Temperature (AeroZero Tg, DMA): 305°C (580°F)
- Adhesive Strength — 72 hr. Peel Strength to 2 mil Aluminum Foil: >280 N/m (1.6 lbf/in)
- Tensile Strength: 6.5 MPa (0.94 ksi)
- Thickness: 952.5 µm (37.5 mil)
- Basis Weight: 390 g/m²
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- Specifications
- Applications
- General Info
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Physical Properties
| Property | Value | Test Method |
| Thickness, µm (mil) | 952.5 (37.5) | ASTM D374/D374M |
| Density, g/cm³ | 0.40 | ASTM D202 |
| Basis Weight, g/m² | 390 | ASTM D202 |
Mechanical Properties
| Property | Value | Test Method |
| Tensile Strength, MPa (ksi) | 6.5 (0.94) | ASTM D882 |
| Young’s Modulus, MPa (ksi) | 200 (29) | ASTM D882 |
| Tensile Elongation at Break, % | 6.0 | ASTM D882 |
Thermal Properties
| Property | Value | Test Method |
| Thermal Conductivity (25°C), W/m·K | 0.037 | ASTM C518 |
| Specific Heat Capacity (25°C), J/g·°C | 1.35 | ASTM C1784 |
| Glass Transition Temperature (AeroZero Tg, DMA), °C (°F) | 305 (580) | ASTM E1640 |
| Decomposition Temperature (10 wt% loss, TGA), °C (°F) | 260 (500) | ASTM E2550 |
Adhesion Properties
| Property | Value | Test Method |
| Adhesive Strength: 72 hr. Peel Strength to 2 mil Aluminum Foil, N/m (Lbf/in) | >280 (1.6) | ASTM D3330 |
| Adhesive Type | Acrylic | — |
- Thermal barrier protection for aerospace structures and components
- Thermal shielding for defense systems
- Thermal protection for electronic enclosures and equipment
- Permanent bonding to metal substrates, including stainless steel and aluminum
- Thermal protection for composite and polymer substrates, including carbon fiber, polyimide, PEEK, polyurethane, and polyester
Common industries: Aerospace, Defense, Electronics, Industrial Manufacturing.
QuinZero TPS 501 is a multilayer AeroZero® aerogel thermal protection system (TPS) engineered for direct, adhesive-backed application to structures requiring a lightweight thermal barrier. The construction combines five 165 micron (6.5 mil) AeroZero® polyimide aerogel layers, each bonded with a 25.4 micron (1 mil) acrylic adhesive layer, for a total thickness of 952.5 µm (37.5 mil) and a basis weight of 390 g/m². Its primary performance advantage is a low thermal conductivity of 0.037 W/m·K at 25°C combined with a high glass transition temperature of 305°C (580°F), allowing the construction to function as a thermal barrier across a wide range of elevated-temperature conditions.
Mechanically, the construction exhibits a tensile strength of 6.5 MPa (0.94 ksi), a Young’s modulus of 200 MPa (29 ksi), and 6.0% elongation at break, with a decomposition temperature of 260°C (500°F) at 10% weight loss (TGA). The integrated acrylic pressure-sensitive adhesive provides greater than 280 N/m (1.6 lbf/in) 72-hour peel strength to 2 mil aluminum foil, allowing the material to be applied directly and permanently to stainless steel, aluminum, carbon fiber, polyimide, PEEK, polyurethane, and polyester substrates without secondary bonding steps. The flexible, multilayer format conforms to complex part geometries while remaining lightweight.
What differentiates QuinZero TPS 501 from other thermal protection materials?
QuinZero TPS 501 combines five bonded AeroZero® polyimide aerogel layers with an integrated acrylic pressure-sensitive adhesive into a single, ready-to-apply construction. This multilayer format delivers a low thermal conductivity of 0.037 W/m·K together with a high glass transition temperature of 305°C (580°F) in a flexible, lightweight sheet that bonds permanently to a substrate without requiring separate adhesives or mechanical fasteners.
Why does thermal conductivity matter in material selection for QuinZero TPS 501?
As a thermal protection system, QuinZero TPS 501 is selected specifically to limit heat transfer across the structures it is bonded to. Its thermal conductivity of 0.037 W/m·K (25°C) is the primary measure of that insulating performance, directly determining how effectively the construction shields aerospace, defense, and electronic components from thermal exposure.
What is the temperature capability of QuinZero TPS 501?
The TDS lists a glass transition temperature (AeroZero Tg, DMA) of 305°C (580°F) and a decomposition temperature (10 wt% loss, TGA) of 260°C (500°F). No separate continuous service temperature range is specified on the manufacturer's TDS.
Is QuinZero TPS 501 suitable for flame-rated or aerospace/defense-regulated environments?
No compliance standards are specified on the manufacturer's TDS for QuinZero TPS 501. The product is described as flame retardant among its listed features, but no certification, test standard, or regulatory file number is provided on the TDS to confirm suitability for regulated environments.
How should QuinZero TPS 501 be specified?
Specify grade (QuinZero TPS 501), thickness, bond substrate, compliance requirements, dimensional tolerances, and finished format.
