Kapton® MT Thermally Conductive Polyimide Film
Kapton® MT is a homogeneous polyimide film possessing three times the thermal conductivity and cut-through strength of standard Kapton® HN, with thermal conductivity of 0.46 W/m·K across all grades. Tensile strength ranges from 20–23 kpsi (138–159 MPa) and dielectric strength from 4100–5500 V/mil depending on grade. The film is available in four grades — 100MT, 150MT, 200MT, and 300MT — offering a higher modulus than standard HN for improved strength in the final product.
Key Properties
- Thermal Conductivity: 0.46 W/m·K, all grades — ASTM D5470
- Tensile Strength: 100MT: 20 kpsi (138 MPa); 150MT: 21 kpsi (145 MPa); 200MT: 22 kpsi (152 MPa); 300MT: 23 kpsi (159 MPa) — ASTM D882
- Elongation: 100MT: 80%; 150MT: 85%; 200MT: 87%; 300MT: 100% — ASTM D882
- Dielectric Strength: 100MT: 5500 V/mil; 150MT: 5100 V/mil; 200MT: 4600 V/mil; 300MT: 4100 V/mil — ASTM D149
- Cut-Through Strength: 40 lb, all grades — Qnity Method
- Tensile Modulus: 100MT: 440 kpsi (3.0 GPa); 150MT: 450 kpsi (3.1 GPa); 200MT: 475 kpsi (3.3 GPa); 300MT: 490 kpsi (3.4 GPa) — ASTM D882
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- Specifications
- Applications
- General Info
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Physical Properties
| Property | 100MT | 150MT | 200MT | 300MT | Test Method |
| Tensile Strength, kpsi (MPa) | 20 (138) | 21 (145) | 22 (152) | 23 (159) | ASTM D882 |
| Tensile Modulus, kpsi (GPa) | 440 (3.0) | 450 (3.1) | 475 (3.3) | 490 (3.4) | ASTM D882 |
| Elongation, % | 80 | 85 | 87 | 100 | ASTM D882 |
| Tear Strength, initial (Graves), lbf | 1.7 | 1.7 | 1.7 | 1.7 | ASTM D1004 |
| Cut Through, lb | 40 | 40 | 40 | 40 | Qnity Method |
Electrical Properties
| Property | 100MT | 150MT | 200MT | 300MT | Test Method |
| Dielectric Strength, V/mil | 5500 | 5100 | 4600 | 4100 | ASTM D149 |
| Dielectric Constant (25°C, 1 kHz) | 4.2 | 4.2 | 4.2 | 4.2 | ASTM D150 |
| Surface Resistivity, ohm/sq | >10¹⁵ | >10¹⁵ | >10¹⁵ | >10¹⁵ | ASTM D257 |
| Volume Resistivity, ohm·cm | >10¹⁶ | >10¹⁶ | >10¹⁶ | >10¹⁶ | ASTM D257 |
Thermal Properties
| Property | 100MT | 150MT | 200MT | 300MT | Test Method |
| Thermal Conductivity, W/m·K | 0.46 | 0.46 | 0.46 | 0.46 | ASTM D5470 |
- Insulation pads at heat sink interfaces in electronic assemblies where heat transfer through the dielectric layer is required
- Heater circuit substrate requiring both thermal conductivity and high dielectric strength
- Power supply insulation where ceramic board replacement with a flexible film is desired
- NKN slot liner insulation in motor constructions requiring high cut-through resistance
- Printed circuit board isolation layers where thermal management through the insulator is necessary
Common industries: electronics, power supply manufacturing, electric motor manufacturing, thermal management systems, industrial controls.
Kapton® MT is a thermally conductive variant of the Kapton® polyimide film family, developed for applications where heat management through the film is as important as its electrical insulation performance.
Its thermal conductivity of 0.46 W/m·K — three times that of standard Kapton® HN — enables it to transfer heat away from heat-generating electronic components rather than acting as a pure thermal barrier, making it suitable for use as insulation pads at heat sink interfaces, as a substrate for heater circuits, and as a replacement for ceramic boards in power supply constructions.
Cut-through strength is 40 lb across all grades, triple that of standard HN, providing resistance to deformation under point loads from fasteners or component edges.
The film’s electrical properties support demanding isolation requirements: dielectric constant is 4.2 at 1 kHz (25°C); surface resistivity exceeds 10¹⁵ ohm/sq; and volume resistivity exceeds 10¹⁶ ohm-cm across all grades. Modulus ranges from 440–490 kpsi (3.0–3.4 GPa) — higher than standard HN — which improves handling and dimensional integrity in finished assemblies.
The film retains its properties through extended storage at 4–29°C (40–85°F) in original packaging. Thickness is not specified on the H-O Products TDS for this product; grades are designated 100MT, 150MT, 200MT, and 300MT.
What differentiates Kapton® MT from standard Kapton® HN?
Kapton® MT has three times the thermal conductivity of HN (0.46 W/m·K vs. 0.20 W/m·K) and three times the cut-through strength (40 lb vs. the reference HN value), while maintaining comparable dielectric isolation performance. Its modulus is also higher (440–490 kpsi vs. 400 kpsi for HN), improving mechanical integrity in finished assemblies. The tradeoff is lower tensile strength (20–23 kpsi for MT vs. 33.5 kpsi for HN).
Why does thermal conductivity matter for film selection in heat management applications?
Thermal conductivity determines how efficiently heat transfers through the film from a heat-generating component to a heat sink or dissipating surface. At 0.46 W/m·K — three times standard Kapton® HN — Kapton® MT conducts significantly more heat for a given thickness, enabling effective thermal management without the brittleness of ceramic alternatives and with the flexibility advantages of a polyimide film.
What is the service temperature capability of Kapton® MT?
No specific service temperature range is stated on the H-O Products TDS for Kapton® MT. The product description states that the film retains its properties during extended storage at 4–29°C (40–85°F) in original packaging. Contact H-O Products for additional thermal performance data.
Is Kapton® MT suitable for regulated environments?
No compliance certifications are specified on the H-O Products TDS for Kapton® MT. Contact H-O Products for additional compliance information.
How should Kapton® MT be specified?
Specify grade (100MT, 150MT, 200MT, or 300MT), compliance requirements, dimensional tolerances, and finished format (slit roll, sheet, or die-cut component). Confirm thickness requirements with H-O Products as thickness is not specified on the TDS.
