Kapton® XP Fluorocarbon-Coated Polyimide Insulation Substrate
Kapton® XP is a type H polyimide film coated on one or both sides with a proprietary fluorocarbon resin, with tensile strength of 24–29 kpsi (165–200 MPa) and dielectric strength of 4400–4800 V/mil (173–189 kV/mm) depending on construction. High bond strengths to copper, to itself, and to other materials are maintained at elevated temperatures, and the film demonstrates significantly improved bond strength retention versus Kapton® FN from room temperature through 200°C. Available in 1.5 mil (150XP019) and 2.0 mil (200XP919) constructions.
Key Properties
- Tensile Strength: 150XP019: 29 kpsi (200 MPa); 200XP919: 24 kpsi (165 MPa) — ASTM D882
- Elongation: 150XP019: 93%; 200XP919: 95% — ASTM D882
- Dielectric Strength: 150XP019: 4400 V/mil (173 kV/mm); 200XP919: 4800 V/mil (189 kV/mm) — ASTM D149
- Key Performance Attribute: Significantly improved bond strength retention at elevated temperature vs. Kapton® FN
- Thickness: 150XP019: 1.5 mil (38 µm); 200XP919: 2.0 mil (50 µm) — ASTM D374
- Yield: 150XP019: 82.4 ft²/lb (16.9 m²/kg); 200XP919: 57.4 ft²/lb (11.8 m²/kg) — —
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- Specifications
- Applications
- General Info
- FAQs
Physical Properties
| Property | 150XP019 | 200XP919 | Test Method |
| Thickness, mil (µm) | 1.5 (38) | 2.0 (50) | ASTM D374 |
| Tensile Strength, kpsi (MPa) | 29 (200) | 24 (165) | ASTM D882 |
| Elongation, % | 93 | 95 | ASTM D882 |
| Yield, ft²/lb (m²/kg) | 82.4 (16.9) | 57.4 (11.8) | — |
Electrical Properties
| Property | 150XP019 | 200XP919 | Test Method |
| Dielectric Strength, V/mil (kV/mm) | 4400 (173) | 4800 (189) | ASTM D149 |
- Magnet wire insulation requiring high bond strength to copper that is maintained through elevated operating temperatures
- Coated magnet wire constructions where superior coating-to-coating bond retention above 100°C is required
- Motor insulation applications where bond integrity between insulation tape layers must be preserved at service temperature
- Copper bonding substrates in electrical assemblies exposed to thermal cycling or sustained elevated temperature
- High-temperature insulation constructions where Kapton® FN bond retention at temperature is insufficient
Common industries: electric motor manufacturing, magnet wire fabrication, power generation, automotive traction systems, industrial electrical equipment.
Kapton® XP is designed for magnet wire insulation and copper bonding applications where bond strength must be maintained through elevated temperature operating conditions. The film uses a proprietary fluorocarbon resin coating — distinct from the standard FEP used in Kapton® FN — applied to one or both sides of a type H polyimide base film.
This resin system provides high initial bond strength to copper, to other XP surfaces, and to a range of substrates, with significantly better retention of that bond strength at temperatures up to 200°C compared to Kapton® FN.
The bond retention advantage is documented through four comparative test series on the H-O Products TDS: coating to Kapton® bond retention, coating to coating bond retention, coating to copper bond retention, and bond retention to ML coated magnet wire — all plotted across the 0–200°C temperature range.
In each comparison, Kapton® XP maintains substantially higher percent bond retention than Kapton® FN at temperatures above approximately 100°C, while starting from the same room-temperature bond strength baseline (1.5–3.5 lbs./in. depending on the bond interface). The chemical stability, electrical properties, and mechanical strength of XP in high and low temperature environments match those of Kapton® FN.
Other constructions beyond 150XP019 and 200XP919 are available on request.
What differentiates Kapton® XP from Kapton® FN?
Kapton® XP uses a proprietary fluorocarbon resin rather than standard FEP, which provides substantially better retention of bond strength at elevated temperatures. In all four bond retention test series shown on the TDS (coating to Kapton®, coating to coating, coating to copper, and coating to ML magnet wire), XP maintains much higher percent bond retention than FN above approximately 100°C. Room-temperature bond strength and chemical, electrical, and mechanical properties are equivalent between the two films.
Why does bond strength retention at elevated temperature matter for magnet wire insulation?
Motor and generator windings operate at elevated temperatures in service, particularly under inverter-duty conditions. If the bond between insulation tape layers or between the tape and conductor degrades at service temperature, insulation integrity can be compromised, leading to turn-to-turn shorts and premature failure. Kapton® XP's superior bond retention through 200°C directly translates to more reliable long-term motor insulation performance compared to FN.
What is the service temperature range for Kapton® XP?
The bond retention data on the H-O Products TDS covers 0–200°C. No specific rated service temperature range is stated on the TDS beyond this. Contact H-O Products for additional thermal performance data.
Is Kapton® XP suitable for regulated environments?
No compliance certifications are specified on the H-O Products TDS for Kapton® XP. Contact H-O Products for additional compliance information.
How should Kapton® XP be specified?
Specify construction designation (150XP019 for 1.5 mil, 200XP919 for 2.0 mil, or other construction on request), whether single or double-sided coating is required, bond interface (copper, self, or other substrate), compliance requirements, dimensional tolerances, and finished format (slit roll for tape wrapping or fabricated component).
