Multilayer Polyimide Aerogel Thermal Protection Film with Silicone PSA AZ-TPS PI 100
AZ-TPS PI 100 is a 240 micron (9.5 mil) multilayer thermal protection film built around a 165 micron (6.5 mil) AeroZero® polyimide aerogel core, faced with polyimide films and silicone pressure-sensitive adhesive (PSA) layers, delivering a thermal conductivity of 0.046 W/m·K at 25°C. The silicone PSA bonds to stainless steel, aluminum, glass, and polymer substrates, reaching full adhesion strength after a 3-day room-temperature dwell, and the construction carries a UL94 VTM-0 flame rating. The film remains flexible and RF transparent, suiting complex, contoured part geometries across Aerospace, Defense, and Electronics applications.
Key Properties
- Thermal Conductivity (25°C): 0.046 W/m·K
- Tensile Strength: 15 MPa (2 ksi)
- Tensile Elongation at Break: 8%
- Adhesive Strength (180° peel, 3-day RT dwell, AZ film on 2 mil Al foil): >200 N/m (1.1 lbf/in)
- Glass Transition / Decomposition Temperature: 305°C (580°F) Tg / 410°C (770°F) decomposition (10 wt% loss)
- Thickness: 240 µm (9.5 mil)
We want to help!
Enter your information and we'll get you in touch with our knowledgable staff. We know how important to the right product for your project.
Request a Consultation
- Specifications
- Applications
- General Info
- FAQs
Physical Properties
| Property | Value | Test Method |
| Thickness, µm (mil) | 240 (9.5) | In-House Method |
| Density, g/cm³ | 0.58 | In-House Method |
Mechanical Properties
| Property | Value | Test Method |
| Tensile Strength, MPa (ksi) | 15 (2) | ASTM D882-12 |
| Young’s Modulus, MPa (ksi) | 450 (65) | ASTM D882-12 |
| Tensile Elongation at Break, % | 8 | ASTM D882-12 |
Thermal Properties
| Property | Value | Test Method |
| Thermal Conductivity (25°C), W/m·K | 0.046 | ASTM C518-10 |
| Specific Heat Capacity (25°C), J/g·°C | 1.22 | ASTM C1784-20 |
| IR Emissivity (Polyimide Surface) | 0.77 | ASTM E408-13 |
| Glass Transition Temp (AZ Tg, DMA), °C (°F) | 305 (580) | ASTM E1640-13 |
| Decomposition Temp (10 wt% loss, TGA), °C (°F) | 410 (770) | ASTM 2550-17 |
Adhesion Properties
| Property | Value | Test Method |
| Adhesive Strength: 180° peel/3 day-RT dwell time AZ film on 50.8 micron (2 mil) Al Foil, N/m (lbf/in) | >200 (1.1) | ASTM D3330 |
| Adhesive Type | Silicone | — |
Flame & Fire Performance
| Property | Value | Test Method |
| UL Flammability Rating | VTM-0 | UL94 VTM0 |
Construction
| Property | Value | Test Method |
| Layer 1 — Polyimide (PI) | 25.4 micron (1 mil) | — |
| Layer 2 — Silicone Adhesive (PSA) | 25.4 micron (1 mil) | — |
| Layer 3 — AeroZero (AZ) | 165 micron (6.5 mil) | — |
| Layer 4 — Silicone Adhesive (PSA) | 25.4 micron (1 mil) | — |
Compliance
- UL94 VTM-0 — Compliant (UL Flammability Rating)
- Thermal barrier protection for aerospace structures and components
- Thermal shielding for defense systems and platforms
- Thermal protection for electronic enclosures and devices
- RF-transparent thermal barriers for antenna and sensor housings
- Thermal protection film for complex, contoured part geometries
Common industries: Aerospace, Defense, Electronics.
AZ-TPS PI 100 is a multilayer, adhesive-backed thermal protection film from Blueshift Materials’ AeroZero® Thermal Protection Systems product line. The construction pairs a 165 micron (6.5 mil) AeroZero® polyimide aerogel core with 25.4 micron (1 mil) polyimide face films and 25.4 micron (1 mil) silicone pressure-sensitive adhesive layers on both sides, for a total thickness of 240 micron (9.5 mil). Its primary performance advantage is a low thermal conductivity of 0.046 W/m·K combined with an ultra-thin, lightweight, flexible format that allows it to be applied directly to complex, contoured part geometries as a permanent, self-adhered thermal barrier.
The engineering-grade silicone PSA bonds to stainless steel, aluminum, glass, and polymer substrates such as polyimides, polyether ketones, polyurethanes, and polyesters, reaching optimal adhesion after a 3-day room-temperature dwell (minimum 24 hours at 10°C/50°F), with a peel-away release liner for straightforward application. The film carries a UL94 VTM-0 flame retardant rating and is RF transparent, making it suitable for use on or near antenna and sensor housings where signal transparency is required.
AZ-TPS PI 100 is intended for thermal barrier and protection applications across the Aerospace, Defense, and Electronics industries. Compliant with UL94 VTM-0.
What differentiates AZ-TPS PI 100 from other thermal protection film constructions?
AZ-TPS PI 100 combines a 165 micron (6.5 mil) AeroZero® polyimide aerogel core with polyimide face films and silicone PSA layers on both sides in a total thickness of just 240 micron (9.5 mil). This ultra-thin, lightweight, flexible construction is self-adhering — bonding permanently to stainless steel, aluminum, glass, and a range of polymer substrates without additional fasteners or hardware — while remaining RF transparent and UL94 VTM-0 flame rated.
Why does thermal conductivity matter in material selection for AZ-TPS PI 100?
As a thermal barrier film, AZ-TPS PI 100's primary function is to isolate parts from heat. Its thermal conductivity of 0.046 W/m·K at 25°C allows it to provide effective thermal insulation in an ultra-thin, low-weight film format, avoiding the bulk and added weight of thicker traditional insulation while still protecting components in demanding thermal environments.
What is the temperature range for AZ-TPS PI 100?
The TDS lists a glass transition temperature (AZ Tg, DMA) of 305°C (580°F) and a decomposition temperature (10 wt% loss, TGA) of 410°C (770°F). The silicone PSA requires a minimum application temperature of 10°C (50°F) and reaches optimal adhesion after a 3-day room-temperature dwell.
Is AZ-TPS PI 100 suitable for flame-rated environments?
Yes. AZ-TPS PI 100 carries a UL94 VTM-0 flammability rating as listed on the manufacturer's TDS.
How should AZ-TPS PI 100 be specified?
Specify grade (AZ-TPS PI 100), thickness, adhesive/liner configuration, bond surface/substrate compatibility, compliance requirements, dimensional tolerances, and finished format.
